KR101551772B1 - Replica stamp for SCIL process and manufacturing method for thereof - Google Patents

Abstract

The present invention relates to a replica stamp for a SCIL process and a manufacturing method thereof, and more particularly to a replica stamp for SCIL (Substrate Conformal Imprinting Lithography) process which is formed including a glass substrate, an intermediate layer, and a pattern layer in which a pattern of a master stamp is replicated In the stamp, a protective film is adhered to the other side of the glass substrate, thereby improving the flexibility while maintaining the tensile strength of the glass substrate, thereby relieving the influence of the SCIL process factor, thereby increasing the success rate of the SCIL process. And a method of manufacturing the same.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a replica stamp for a SCIL process,

The present invention relates to a replica stamp for a SCIL process and a manufacturing method thereof, and more particularly to a replica stamp for SCIL (Substrate Conformal Imprinting Lithography) process which is formed including a glass substrate, an intermediate layer, and a pattern layer in which a pattern of a master stamp is replicated In the stamp, a protective film is adhered to the other side of the glass substrate, thereby improving the flexibility while maintaining the tensile strength of the glass substrate, thereby relieving the influence of the SCIL process factor, thereby increasing the success rate of the SCIL process. And a method of manufacturing the same.

The UV nanoimprinting process is a process in which a stamp having a pattern to be copied is brought into contact with a substrate coated with a UV resin so that the resin fills the patterns of the stamp and the UV light is used to cure the resin The pattern of the stamp is copied to the resin of the substrate.

Recently, SUSS MicroTec has partnered with Philips to commercialize a new UV nanoimprinting process called SCIL (Substrate Conformal Imprint Lithography).

In the SCIL process, a master stamp is generally manufactured by using photolithography or e-beam lithography on a silicon wafer, and a replica stamp is produced, which is a duplicate of the master stamp.

This replica stamp is made of a h-PDMS replicating a pattern of a master stamp of about 100 μm thickness, and a PDMS layer of 500 to 600 μm thick between a glass substrate and h-PDMS using a thin glass of 0.2 mm thickness as a substrate do.

FIG. 1 is a conceptual diagram of the SCIL process. The SCIL process will be briefly described as follows.

First, the above-described replica stamp is mounted on a holder. As shown in the figure, the holder has dozens of slender pneumatic pressure control grooves formed on its surface contacting the glass substrate. At the beginning of the process, vacuum is applied to all the grooves so that the replica stamp is attached to the holder (Fig. 1 (a)). Then, when constant air pressure is applied sequentially from one end groove, the replica stamp is locally deformed and sequentially contacts the substrate coated with resin (Fig. 1 (b) - (c)).

After the replica stamp contacts the entire surface of the substrate and the resin sufficiently fills the pattern of the replica stamp, the resin using UV light is cured. When the curing is completed, a vacuum is applied in the reverse order of applying the air pressure to the grooves so that the replica stamp is separated from the substrate (Fig. 1 (d) to (f)).

The greatest feature of the SCIL system is the replica stamp with a thin glass substrate.

As shown in FIG. 2, the replica stamp 10 has a structure in which a thin glass having a thickness of 100 to 200 μm is used as a substrate, a PDMS layer having a thickness of 500 to 600 μm is formed in the middle, Of h-PDMS. The pattern to be imprinted is directly formed in h-PDMS. Around the glass substrate 11, a rubber ring 14, which is an accessory of a rubber material of 500 탆 thickness, is attached.

The glass substrate 11 serves as a base of the replica stamp, and is responsible for deforming and restoring the local shape of the replica stamp in the SCIL process using the vacuum pressure.

The PDMS of the intermediate layer 12 serves as a cushion layer, which serves to compensate for the fine flatness error of the wafer surface when pressure is applied.

The pattern layer 13 is made of h-PDMS or X-PDMS having a pattern of replicated master wafers, good bonding strength with the intermediate PDMS layer, and higher strength than PDMS.

The thickness of the PDMS layer or the pattern layer 13 can be slightly changed depending on the situation, and even if there is a change of several tens of microns in the manufacturing process, there is no problem in the process.

Finally, the rubber ring 14 attached to the periphery of the glass substrate 11 is used when the replica stamp 10 is mounted on the chuck and shields the space between the chuck surface and the glass substrate 11 from the outside, Atmosphere or low-pressure air can be applied.

On the other hand, the most important component in the replica stamp for SCIL is a thin glass of 200 탆 thickness used as a substrate.

As mentioned above, the reason why thin glass is used as a substrate is that the material has proper rigidity and flexibility, and it can compensate the disadvantages while maintaining the advantages of existing rigid and flexible substrates.

A flexible substrate typified by a polymer film (for example, PC or PET) is excellent in flexibility, and uniform contact with a wafer in an imprinting process is advantageous even at a low pressure. However, the flexible substrate is easily deformed by a weak force or heat, and the position accuracy of the pattern transferred after imprinting is reduced.

Hard substrates typified by glass or silicon wafers of several mm thickness have high positional accuracy of the pattern after imprinting due to high rigidity of the material, but are not flexible and uniform contact with the substrate to which the pattern is to be transferred is very difficult. In particular, as the imprinting area is widened, the process conditions such as a very high pressure applied for uniform contact become more difficult.

The use of a glass substrate having a thickness of about 200 μm makes it possible to use the rigid substrate patterning accuracy and the flexibility of the flexible substrate at the same time. Therefore, in a process using a shape replica of a local replica stamp, .

In the SCIL process, the wafer on which the replica stamp and the resin are coated is brought close to the wafer by about 100 mu m, and then the wafer is contacted with the replica stamp by applying a local deformation to the replica stamp.

Therefore, the deformation rate of thin glass substrate depends on the strength of air pressure.

When the thickness of the glass used as the substrate is reduced, the deformation rate is increased, and the proximity distance between the replica stamp and the wafer can be increased to 100 mu m or more. Experimental results show that the process progresses even when the thickness of the glass substrate is 100 μm and the proximity distance is 150 μm to 200 μm. This is especially important in the large area imprinting process of 6 inches or more in the following two aspects.

First, as the proximity distance increases, the flatness of the chucks attaching the replica stamp and the wafer can be easily managed.

Second, the possibility of random contact between the replica stamp and the wafer within the adjustment range when adjusting the replica stamp and wafer attitude to mechanical equipments (mainly tilt and height adjustment stages) so that the proximity distance is the same in the imprinting area And the precision of the adjusting device is relatively lowered, so that the system configuration becomes easy.

However, as glass becomes thinner, the following two disadvantages arise.

First, the glass substrate is easily broken and difficult to handle. That is, the glass substrate is easily damaged when applying a local pressure to the surface, bending it excessively, or sticking out an adhesive material such as PDMS.

Second, it becomes difficult to manage the flatness of the replica stamp. When the replica stamp is manufactured, the chuck fixing the glass substrate deforms the glass substrate along the surface shape, so that an unintended shape may appear on the surface of the final replica stamp.

For example, when the glass substrate is fixed with a vacuum chuck having a groove, the glass substrate is finely deformed in the groove, and the PDMS is hardened along with the deformed shape, so that the shape of the groove appears on the surface of the replica stamp .

Therefore, it is necessary to develop a replica stamp that complements the disadvantages described above while exploiting the characteristics of a thin glass substrate

Korean Patent Laid-Open Publication No. 2010-0132282 ("Nanoparticle Thin Film Manufacturing Method and Manufacturing Method of Stamp for Nanoimprint Using It," 2010.12.17)

SUMMARY OF THE INVENTION The present invention has been made in order to solve the problems of the prior art as described above, and it is an object of the present invention to provide a glass substrate having a thin glass substrate for uniformly imprinting a large area using a local deformation of the glass substrate The present invention relates to a replica stamp for a SCIL process and a method of manufacturing the replica stamp for a SCIL process, which can solve the difficulty of making a flat replica stamp, which is difficult to handle as the glass becomes thinner.

The replica stamp for the SCIL process of the present invention comprises a glass substrate, an intermediate layer bonded to one side of the glass substrate, and a pattern layer formed on the one side of the intermediate layer, Conformal Imprinting Lithography) process replica stamp, wherein the replica stamp is characterized in that a protective film is bonded to the other side of the glass substrate.

Also, in the replica stamp according to an embodiment of the present invention, the glass substrate has a thin thickness of 100 to 200 탆, and the protective film may be attached flat on the other side of the glass substrate.

In addition, the protective film according to an embodiment of the present invention may have a thickness of 50 to 100 탆.

Also, the protective film according to an embodiment of the present invention may be made of polycarbonate (PC) or polyethylene terephthalate (PET), or may be made of a material transparent to i-line wavelength or g-line wavelength.

In addition, the protective film according to an embodiment of the present invention may be formed to correspond to the size and shape of the glass substrate, and may be attached to the glass substrate.

Also, a method for producing a replica stamp for SCIL process of the present invention comprises the steps of: a) attaching a pattern layer material over an entire area of an upper surface of a master stamp; b) curing the pattern layer material applied on the master stamp to form the pattern layer; c) applying an adhesive to said protective film lying on a flat plate; d) placing the glass substrate above the protective film, spreading the adhesive while being pressed by the glass substrate, and attaching a protective film to the glass substrate; e) an adhesive curing step in which the adhesive of the protective film is cured; f) disposing an intermediate layer material on the upper surface of the pattern layer; g) disposing the glass substrate constituting a substrate layer on the upper side of the intermediate layer material, spreading the intermediate layer material while being pressed by the glass substrate, and then curing to form an intermediate layer and a substrate layer; And h) removing the master stamp; And a control unit.

Further, in the step c), the adhesive may be evenly spread by spin coating.

Also, in the step e), the adhesive may be cured by ultraviolet rays or heat.

In the replica stamp for SCIL process and the method for manufacturing the same, the protective film is attached to the other side of the glass substrate in the replica stamp for a SCIL (Substrate Conformal Imprinting Lithography) process, so that the flexibility is maintained while maintaining the tensile strength of the glass substrate. Thereby further reducing the influence of process parameters related to the proximity distance in the SCIL process and facilitating handling.

More specifically, the present invention is characterized in that a thin glass substrate is suitable for large-area imprinting using a local deformation proposed in the SCIL process, and at the same time, it is preferable to apply a local pressure to the glass surface, bend it, To overcome the disadvantage of being easily damaged during handling, a thin protective film was attached to the glass substrate.

Accordingly, the present invention highlights advantages of a SCIL process suitable for large-area imprinting, and a problem in that when the replica stamp is separated from the master stamp during the manufacturing process of the replica stamp, damage such as separation failure or tearing occurs All can be resolved.

Further, according to the present invention, a glass substrate having a very thin thickness of about 50 mu m can be used as compared with a conventional replica stamp for a SCIL process, in which a glass substrate having a thickness of about 150 to 200 mu m is used. It is easy to deform the substrate surface in the vertical direction and it is easy to control the shape of the glass substrate by using the air pressure.

Further, since the deformation amount is large even under the same air pressure condition, the gap between the replica stamp and the wafer substrate can be increased to 100 mu m or more, and the flatness tolerance management of the replica stamp chuck and the wafer chuck can be facilitated .

In addition, even if a local crack is generated in the glass substrate, since the protective film on the rear surface prevents cracks from diffusing and separates the glass surface from the space to which vacuum pressure is applied in the imprinting process, The imprinting process can be continued even if it is damaged.

In addition, the present invention has a risk that when a chuck is directly fixed to a glass substrate when a conventional replica stamp for a SCIL process is attached to a chuck, there is a danger that a local deformed portion due to the air pressure may be broken, The chuck can be directly fastened to the glass substrate itself without a ring made of a rubber material, unlike a rubber-like ring which has to be connected mechanically.

1 is a schematic diagram of a SCIL process;
2 shows a cross-sectional view of the replica stamp in the SCIL system.
3 is a cross-sectional view of a replica stamp for SCIL process according to the present invention.
Figure 4 is a photograph of a replica stamp for a SCIL process according to the present invention.
Figure 5 is an actual photograph showing the flexibility of a replica stamp for SCIL process according to the present invention.
6 is a photograph of imprinting using a replica stamp for SCIL process according to the present invention.
7 is a flowchart showing a method of manufacturing a replica stamp for SCIL process according to the present invention.

Hereinafter, a replica stamp for a SCIL process and a method of manufacturing the same according to the present invention having the above-described structure will be described in detail with reference to the accompanying drawings.

Fig. 3 is a cross-sectional view of a replica stamp for a SCIL process according to the present invention, Fig. 4 is an actual photograph of a replica stamp for a SCIL process according to the present invention, Fig. 5 is a view showing the flexibility of a replica stamp for a SCIL process according to the present invention FIG. 6 is a photograph showing imprinting using a replica stamp for SCIL process according to the present invention, and FIG. 7 is a flowchart showing a method for manufacturing a replica stamp for SCIL process according to the present invention.

Example 1.

In Embodiment 1, a replica stamp 1 for a SCIL process according to the present invention is described with reference to Figs. 3 to 6. Fig.

The present invention relates to a replica stamp 1 for SCIL (Substrate Conformal Imprinting Lithography) process and is formed by including a glass substrate 100, And aims at improving flexibility and facilitating handling while maintaining the tensile strength of the glass substrate (100).

Referring to FIG. 3, the structure of the glass substrate 100 will be described. The glass substrate 100 has a thin thickness of about 100 to 200 μm.

The intermediate layer 200 is formed on one side of the glass substrate 100 and is formed of a PDMS layer having a thickness of 500 to 600 μm to serve as a cushion layer and compensates for a fine flatness error of the surface of the wafer when pressure is applied .

The pattern layer 300 is a layer in which a pattern of a master stamp forming a pattern is duplicated at the time of stamp production, and is made of h-PDMS or X-PDMS having strong bonding strength with the intermediate PDMS layer and higher strength than PDMS .

In particular, the SCIL process replica stamp 1 of the present invention further includes a protective film 400 attached to the other side of the glass substrate 100, that is, a side opposite to the side to which the intermediate layer 200 is coupled .

The protective film 400 is thin and attached flat on the other side of the glass substrate 100 in order to maintain the tensile strength of the glass substrate 100 and improve flexibility.

If the thickness of the protective film 400 is too small, the flexibility of the glass substrate 100 can not be utilized. Therefore, even if the thickness of the protective film 400 is too thin, It is important that the tensile strength can be maintained.

That is, the present invention is characterized in that a thin glass substrate 100 is suitable for large-area imprinting using a local deformation suggested in the SCIL process, and at the same time, applying a local pressure to the glass surface, bending, The thin protective film 400 is attached to the glass substrate 100 in order to overcome the disadvantage that it is easily damaged in the handling process of the glass substrate 100.

Therefore, in the SCIL process replica stamp 1 of the present invention, the protective film 400 may be made of either polycarbonate (PC) or polyethylene terephthalate (PET), or made of a material transparent to i-line wavelength or g-line wavelength It is preferred that a transparent material be used.

However, the protective film 400 is not limited to the above-described material, and can be variously modified as long as it is a transparent material capable of maintaining the tensile strength of the glass substrate 100 with a small thickness.

At this time, since the protective film 400 is uniformly applied over the entire area of the glass substrate 100, the ultraviolet rays, heat, and the like transmitted through the glass substrate 100 are uniformly distributed, The size and shape of the glass substrate 100 may be different from each other.

Referring again to FIG. 3, the structure of the replica stamp 1 for SCIL process of the present invention will be described as a whole.

First, the protective film 400 made of a thin transparent material is attached to the upper surface of the glass substrate 100.

The intermediate layer 200, which is a PDMS layer serving as a cushion layer, is formed on the lower side of the glass substrate 100, and h-PDMS or X-PDMS is formed on the lowermost side. The pattern layer 300 is formed.

Accordingly, in the SCIL process replica stamp 1 of the present invention, since the protective film 400 is attached to the other side of the glass substrate 100, the flexibility is improved while maintaining the tensile strength of the glass substrate 100 Can be facilitated.

In addition, the present invention highlights advantages of a SCIL process suitable for large-area imprinting, and can be used to prevent damage to the replica stamp 1 from being detached or torn when the replica stamp 1 is separated from the master stamp during the manufacturing process of the replica stamp 1 All the problems that arise can be solved.

In addition, in the present invention, the conventional SCIL process replica stamp 1 uses a glass substrate 100 having a very thin thickness of about 50 μm, compared to a glass substrate 100 having a thickness of about 150 to 200 μm. As it becomes available. It is easy to deform the substrate surface in the vertical direction, and it is easy to control the shape of the glass substrate 100 by using the air pressure.

Further, since the deformation amount is large even under the same air pressure condition, the present invention can increase the clearance between the replica stamp 1 and the wafer substrate to 100 mu m or more, and it is easy to manage the flatness tolerance between the replica stamp 1 chuck and the wafer chuck .

In addition, the present invention has a risk that when a conventional SCL process replica stamp 1 is attached to a chuck, a chuck is directly fixed to the glass substrate 100, The chuck can be directly fastened to the glass substrate 100 itself without a ring made of a rubber material, unlike in the case where it is necessary to be connected mechanically by a rubber ring which is further attached to the edge.

Example 2.

In Embodiment 2, a method for manufacturing a replica stamp 1 for SCIL process according to the present invention will be described with reference to Fig.

The method of manufacturing the replica stamp 1 for SCIL process of the present invention includes the steps of: a) attaching the material of the pattern layer 300 over the entire area of the upper surface of the master stamp; b) curing the material of the pattern layer (300) applied on the master stamp to form the pattern layer (300); c) applying an adhesive to the protective film (400) placed on a flat plate (S300); d) placing the glass substrate above the protective film, and spreading the adhesive while being pressed by the glass substrate to attach the protective film to the glass substrate (S400); e) an adhesive curing step (S500) in which the adhesive of the protective film is cured; f) arranging the material of the intermediate layer 200 on the upper surface of the pattern layer 300 (S600); g) The glass substrate 100 constituting the substrate layer is disposed on the upper side of the material of the intermediate layer 200. The material of the intermediate layer 200 is spread while being pressed by the glass substrate 100, And forming a substrate layer (S700); And h) removing the master stamp (S800); .

More specifically, h-PDMS or X-PDMS, which is the material of the pattern layer 300, is attached over the entire area of the master stamp.

At this time, the material of the pattern layer 300 may be attached by a method such as spin coating. So that the material of the pattern layer 300 can be adhered fairly uniformly over the entire upper surface of the master stamp from this adhering step.

Next, the material of the pattern layer 300 applied on the master stamp is cured to form the pattern layer 300. At this time, the material of the pattern layer 300 may be cured by heating or ultraviolet rays.

When the material is h-PDMS, the pattern layer 300 is preferably cured by heating at a temperature within the range of about 60 to 80 DEG C (most preferably about 70 DEG C) for 1 to 2 hours Do.

Next, after the adhesive is sufficiently applied to the protective film 400 placed on the flat plate, the glass substrate 100 is placed on the protective film 400 so that the adhesive is applied to the glass substrate 100 Apply pressure and spread.

At this time, it is important that the glass substrate 100 is well covered so as not to capture air bubbles in the space between the glass substrate 100 and the glass substrate 100, and the adhesive is guided to spread over the entire surface of the glass.

The adhesive may be uniformly spread out by a method such as spin coating before contact with the glass substrate 100, and then may be hardened in contact with the glass substrate 100.

The adhesive may be cured by ultraviolet rays or heat to allow the protective film 400 to adhere to the glass.

The steps c) S300, d) S400, and e) S500 of the process of attaching the protective film 400 to the glass substrate 100 may be performed before the stamping process May be performed first, or may be performed after f) step S600, depending on the situation.

Next, the material of the intermediate layer 200 is disposed on the upper surface of the pattern layer 300. The material of the intermediate layer 200 is PDMS, and the PDMS is in a liquid state having a high viscosity in the process step, and is injected and disposed by a dropping method.

Next, a glass substrate 100 constituting the substrate layer is disposed on the material of the intermediate layer 200, and the material of the intermediate layer 200 is first cured by pressing and heating by the glass substrate 100 .

That is, when the glass substrate 100 presses the material of the intermediate layer 200, the material of the intermediate layer 200 (in a liquid state having a high viscosity) is spread by pressing, and the intermediate layer 200 200) material is cured by heating or ultraviolet rays.

When the material of the intermediate layer 200 is PDMS, the material of the intermediate layer 200 is pressed for a time within a range of 2 to 3 days at a temperature within the range of 40 to 60 DEG C (most preferably about 50 DEG C) Lt; / RTI >

Thus, the intermediate layer 200 and the substrate layer are formed, and when the intermediate layer 200 is cured and then the master stamp is removed, the production of the replica stamp 1 is completed.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It goes without saying that various modifications can be made.

1: Replica stamp for SCIL process
100: glass substrate
200: middle layer
300: pattern layer
400: protective film
S100 ~ 800: Steps for manufacturing replica stamp for SCIL process

Claims (8)

A replica stamp for a SCIL (Substrate Conformal Imprinting Lithography) process formed by including a glass substrate, an intermediate layer coupled to one side of the glass substrate, and a pattern layer coupled to one side of the intermediate layer to replicate the pattern of the master stamp As a result,
Wherein the replica stamp has a protective film bonded to the other side of the glass substrate.
The method according to claim 1,
The replica stamp
Wherein the glass substrate has a thickness of 100 to 200 mu m,
Wherein the protective film is attached flat on the other side of the glass substrate.
3. The method of claim 2,
The protective film
And a thickness of 50 to 100 占 퐉.
The method of claim 3,
The protective film
And is made of either a polycarbonate (PC) or a polyethylene terephthalate (PET), or is made of a transparent material at an i-line wavelength or a g-line wavelength.
The method of claim 3,
The protective film
Wherein the glass substrate is formed to correspond to the size and shape of the glass substrate and is attached to the glass substrate.
A method of manufacturing a replica stamp for a SCIL process according to any one of claims 1 to 5,
a) attaching the pattern layer material over the entire area of the top surface of the master stamp;
b) curing the pattern layer material applied on the master stamp to form the pattern layer
c) applying an adhesive to said protective film lying on a flat plate;
d) placing the glass substrate above the protective film, spreading the adhesive while being pressed by the glass substrate, and attaching a protective film to the glass substrate;
e) an adhesive curing step in which the adhesive of the protective film is cured;
f) disposing an intermediate layer material on the upper surface of the pattern layer;
g) disposing the glass substrate constituting a substrate layer on the upper side of the intermediate layer material, spreading the intermediate layer material while being pressed by the glass substrate, and then curing to form an intermediate layer and a substrate layer; And
h) removing the master stamp; ≪ / RTI > wherein the method comprises the steps of:
The method according to claim 6,
In the step c)
Wherein said adhesive is evenly spread by spin coating. ≪ RTI ID = 0.0 > 11. < / RTI >
The method according to claim 6,
In the step e)
Wherein the adhesive is cured by ultraviolet light or heat.

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