CN110029372B - Electroforming equipment and method for manufacturing conducting circuit by electroforming mode - Google Patents
Electroforming equipment and method for manufacturing conducting circuit by electroforming mode Download PDFInfo
- Publication number
- CN110029372B CN110029372B CN201910431629.4A CN201910431629A CN110029372B CN 110029372 B CN110029372 B CN 110029372B CN 201910431629 A CN201910431629 A CN 201910431629A CN 110029372 B CN110029372 B CN 110029372B
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- electroforming
- roller
- pasting
- film
- mold
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to electroforming equipment and a method for manufacturing a conducting circuit by using the electroforming equipment. An electroforming apparatus comprises an electroforming tank, an electroforming roller rotating in the electroforming tank, and a pasting roller in rolling connection with the electroforming roller; the periphery of the electroforming roller is covered with an electroforming mold, and the lower side of the electroforming roller is immersed in electroforming liquid in an electroforming tank. When the conductive circuit diagram is produced, the conductive circuit diagram is used as a negative electrode of electroforming, electroforming is carried out according to the outline of the conductive circuit diagram to form a metal diaphragm, the metal diaphragm is separated from an electroforming mold in the modes of vibration, extrusion and adsorption, the metal diaphragm is collected through a pasting film, and then the metal diaphragm is arranged on a substrate through post-processing to form a conductive circuit. The method has the advantages of simple process, high utilization rate, low production cost, energy conservation and environmental protection, and can be used for mass production.
Description
Technical Field
The invention relates to a circuit board production process, in particular to electroforming equipment and a method for manufacturing a conductive circuit by using the electroforming equipment.
Background
The existing circuit board production is basically carried out by etching, printing and other production processes. The above processes are well established in the art and increase the production cost if the production scale is increased. Moreover, the process is complicated, the utilization rate is not high enough, a plurality of pollution sources are generated during etching, and the utilization rate of waste liquid is not high.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides electroforming equipment and a method for manufacturing a conductive circuit by using the electroforming equipment.
In order to achieve the purpose, the invention adopts the following technical scheme:
an electroforming apparatus comprises an electroforming tank, an electroforming roller rotating in the electroforming tank, and a pasting roller in rolling connection with the electroforming roller; the periphery of the electroforming roller is covered with an electroforming mold, and the lower side of the electroforming roller is immersed in electroforming liquid in an electroforming tank.
The further technical scheme is as follows: and the periphery of the pasting roller is provided with a pasting layer for adhering an electroformed product of the electroforming mold.
The further technical scheme is as follows: and the front end of the connection point of the electroforming roller and the pasting roller is provided with an extrusion wheel for separating the electroformed product from the electroforming mold.
The further technical scheme is as follows: the device also comprises a discharging wheel and a receiving wheel; the discharging wheel is used for discharging the adhesive film and adhering the electroformed product through the adhesive roller and the electroforming roller, and the receiving wheel is used for receiving the adhesive film adhered with the electroformed product;
or the like, or, alternatively,
the periphery of the pasting roller is provided with a pasting film; the pasting roller is pressed against the electroforming roller to adhere the peeled electroformed product.
A method of making conductive traces by electroforming, comprising the steps of:
covering a designed conductive circuit pattern on the surface of an electroforming roller to serve as an electroforming mold;
step two, the electroforming roller rotates, and the electroforming mold is contacted with the electroforming solution, so that metal ions in the electroforming solution form a layer of metal film on the graph surface of the conductive circuit;
step three, the electroforming roller continues to rotate, and the metal film is separated under the action of external force;
and step four, the pasting roller rotates to adhere the separated metal film for receiving, and the electroforming roller continues to rotate for electroforming.
The further technical scheme is as follows: the conductive circuit pattern protrudes out of the surface of the electroforming roller; the metal ions are deposited according to the conductive circuit pattern, so that the outline of the metal film is the same as that of the conductive circuit pattern.
The further technical scheme is as follows: the electroforming solution is rich in one of copper ions, aluminum ions, nickel ions and silver ions.
The further technical scheme is as follows: in the third step, the metal film is stripped from the electroforming mold through a squeezing wheel in a squeezing or vibration or adsorption mode.
The further technical scheme is as follows: and in the fourth step, the pasting roller is provided with a pasting film or a pasting film released by the discharging roller, the pasting film is pasted on the surface of the electroforming mold, and the peeled metal film is continuously adhered.
The further technical scheme is as follows: and step five, the device also comprises a protective film roller which continuously discharges a protective film, and the protective film is adhered to one side of the adhesive film adhered with the metal film on the material receiving wheel so as to protect the metal film.
Compared with the prior art, the invention has the beneficial effects that: the invention is to form a metal film by disposing an electroforming mold on an electroforming roller, electroforming on an electroforming tank, physically separating the metal film from the electroforming mold, and then separating the metal film from the electroforming roller by adhesion. When the conductive circuit diagram is produced, the conductive circuit diagram is used as a negative electrode of electroforming, electroforming is carried out according to the outline of the conductive circuit diagram to form a metal diaphragm, the metal diaphragm is separated from an electroforming mold in the modes of vibration, extrusion and adsorption, the metal diaphragm is collected through a pasting film, and then the metal diaphragm is arranged on a substrate through post-processing to form a conductive circuit. The method has the advantages of simple process, high utilization rate, low production cost, energy conservation and environmental protection, and can be used for mass production.
The invention is further described below with reference to the accompanying drawings and specific embodiments.
Drawings
FIG. 1 is a schematic view of an electrocasting apparatus of the present invention;
FIG. 2 is a schematic view of an electrocasting apparatus of the present invention;
FIG. 3 is a schematic view of an electrocasting apparatus of the present invention;
FIG. 4 is a schematic view and a partially enlarged view of an electroforming mold surface of an electroforming apparatus of the present invention;
FIG. 5 is a schematic side view of an electroforming apparatus of the present invention;
FIG. 6 is a schematic view of an electrocasting roll as an electrocasting plate in an electrocasting apparatus of the present invention;
FIG. 7 is a flow chart of a method of manufacturing conductive traces by electroforming according to the present invention.
Detailed Description
In order to more fully understand the technical content of the present invention, the technical solution of the present invention will be further described and illustrated with reference to the following specific embodiments, but not limited thereto.
Fig. 1 to 7 show drawings of an embodiment of the present invention.
An electroforming apparatus, as shown in FIGS. 1 to 5, includes an electroforming tank 10, an electroforming roller 11 that rotates in the electroforming tank 10, and a pasting roller 12 that is roll-coupled to the electroforming roller 11. The periphery of the electroforming roll 11 is covered with an electroforming mold 13, and the lower side of the electroforming roll 11 is immersed in the electroforming solution in the electroforming tank 10.
As shown in fig. 1, the pasting roller 12 is provided at its outer circumference with a pasting layer for pasting the electroformed product of the electroform 13. The pasting roller 12 rotates while being pasted to the electroforming roller 11, and the pasted layer can be adhered and sucked to the electroformed product which has been molded, so that the electroforming roller 11 can perform the next electroforming cycle. When the adhesive layer is provided on the outer periphery of the adhesive roller 12, the discharge wheel 15 is not required, but the take-up wheel 16 is required.
The front end of the point where the electroforming roller 11 is coupled to the pasting roller 12 is provided with a pressing wheel 14 for separating the electroformed product from the electroforming mold 13. The extrusion wheel 14 can peel the electroformed product from the electroformed mould 13 in a plurality of physical ways on the premise of not influencing the quality of the electroformed product, so as to facilitate the adhesion and adsorption of the next process.
Preferably, the pasting roll 12 is provided with a pasting film on the outer periphery. The pasting roller 12 is pressed against the electroforming roller 11 to adhere the peeled electroformed product. The pasting roller 12 is wound with a pasting film, and the pasting film is continuously discharged during rotation to adhere the electroformed product.
In other embodiments, as shown in fig. 2 and 3, the material receiving device further includes a material discharging wheel 15 and a material receiving wheel 16. The discharging wheel 15 is used for discharging the pasting film and passing through the pasting roller 12 and the electroforming roller 11 to adhere the electroformed product, and the collecting wheel 16 is used for collecting the pasting film adhered with the electroformed product. The pasting roller 12 is for pressing the pasting film against the surface of the electroforming mold 13 to adhere the pasting film to the electroformed product.
The device also comprises a protective film roller 17 which continuously discharges a protective film, wherein the protective film is adhered to one side of the adhesive film adhered with the metal film on the material receiving wheel 16 so as to protect the metal film.
As shown in fig. 4 and 5, the electroforming mold 13 includes a plurality of electroforming modules 18, and each electroforming module 18 electroforms a formed product. The electroforming module 18 includes an electroforming portion 181 and an insulating portion 182, wherein the electroforming portion 181 is the outline of the product and can be directly electroformed to form the outline of the product. In the electrocasting tank 10, metal ions in the electrolyte deposit to form a metal layer on the electrocasting portion 181, and since the electrocasting portion 181 protrudes from the insulating portion 182, the metal layer is separated from the electrocasting portion 181 by an external force and then adheres to the adhesive film by the application roller 12.
In other embodiments, as shown in fig. 6, the electroforming roll 11 may be replaced with an electroforming plate 11A of a planar structure, an electroforming mold 13 is fixed to one side of the electroforming plate 11A, and a power shaft 11B moves the electroforming plate 11A from the electroforming station a to the pressing station B and the adhering station C by the action of a connecting rod 11C. At the electroforming station a, an electroforming plate 11A is immersed in an electroforming tank 10, and a metal layer is deposited on an electroforming mold 13 after power is supplied; when the thickness of the metal layer meets the requirement, the power shaft 11B rotates to enable the electroforming plate 11A to move to the extrusion station B, at the moment, the electroforming mold 13 side of the electroforming plate 11A faces upwards, and the extrusion wheel 14 performs rolling extrusion on the electroforming plate 11A to enable the metal layer to be separated from the electroforming mold 15; after the extrusion is completed, the power shaft 11B drives the electroformed plate 11A to move while the side of the electroformed plate 11A facing the electroformed mold 13 is always facing upward so that the metal layer does not fall off from the electroformed mold 13. Similarly, the pasting roller 12 may be a circular roller or a flat plate-like pasting roller 11D, and the pasting roller 11D is provided with a pasting film toward the electroforming mold 13 so as to adhere the electroformed metal layer (i.e., the circuit) to the pasting film.
A method of manufacturing a conductive circuit by electroforming, as shown in fig. 4, comprising the steps of:
step one, covering a designed conductive circuit pattern on the surface of an electroforming roller 11 to be used as an electroforming mold 13;
step two, the electroforming roller 11 rotates, and the electroforming mold 13 is contacted with electroforming solution, so that metal ions in the electroforming solution form a layer of metal film on the graph surface of the conductive circuit;
step three, the electroforming roller 11 continues to rotate, and the metal film is separated from the electroforming mold 13 under the action of external force;
and step four, the pasting roller 12 rotates to adhere the separated metal film for collecting, and the electroforming roller 11 continues to rotate for electroforming.
The conductive trace patterns protrude from the surface of the electroforming roll 11. And depositing metal ions according to the conductive circuit pattern so that the outline of the metal film is the same as that of the conductive circuit pattern. Specifically, the conductive part of the conductive line pattern is used as a cathode for electroforming, so that metal ions in the electroforming solution can be electroformed into a metal layer with a thickness of 4-30 um according to the shape of the conductive line pattern.
Preferably, the electroforming solution is rich in one of copper ions, aluminum ions, nickel ions and silver ions.
In the third step, the metal film is peeled off from the electroforming mold 13 by pressing or vibration or adsorption by the pressing wheel 14.
In the fourth step, the pasting roller 12 is provided with a pasting film or a pasting film discharged from the discharging roller, the pasting film is pasted on the surface of the electroforming mold 13, and the peeled metal film is continuously adhered.
And the fifth step, further comprising a protective film roller 17 which continuously discharges a protective film, wherein the protective film is adhered to one side of the adhesive film adhered with the metal film on the material receiving wheel 16 so as to protect the metal film.
The conductive circuit pattern produced by the electroforming method is a metal film, and can be a conductive circuit finished product only by later processing. Generally, the metal film produced by the method is fixed on a substrate through processing, and then can be used as a flexible circuit board and an RFID circuit.
In summary, the present invention provides a method of electroforming a metal film by disposing an electroforming mold on an electroforming roller, electroforming on an electroforming tank to form the metal film, physically separating the metal film from the electroforming mold, and then separating the metal film from the electroforming roller by adhesion. When the conductive circuit diagram is produced, the conductive circuit diagram is used as a negative electrode of electroforming, electroforming is carried out according to the outline of the conductive circuit diagram to form a metal diaphragm, the metal diaphragm is separated from an electroforming mold in the modes of vibration, extrusion and adsorption, the metal diaphragm is collected through a pasting film, and then the metal diaphragm is arranged on a substrate through post-processing to form a conductive circuit. The method has the advantages of simple process, high utilization rate, low production cost, energy conservation and environmental protection, and can be used for mass production.
The technical contents of the present invention are further illustrated by the examples only for the convenience of the reader, but the embodiments of the present invention are not limited thereto, and any technical extension or re-creation based on the present invention is protected by the present invention. The protection scope of the invention is subject to the claims.
Claims (8)
1. An electroforming device is characterized by comprising an electroforming tank, an electroforming roller rotating in the electroforming tank and a pasting roller in rolling connection with the electroforming roller; the periphery of the electroforming roller is covered with an electroforming mold, and the lower side of the electroforming roller is immersed in electroforming liquid in an electroforming tank;
the front end of the connection point of the electroforming roller and the pasting roller is provided with an extrusion wheel used for separating the electroforming product from the electroforming mold;
and the periphery of the pasting roller is provided with a pasting layer for adhering an electroformed product of the electroforming mold.
2. The electroforming apparatus of claim 1, further comprising a take-off wheel and a take-up wheel; the discharging wheel is used for discharging the adhesive film and adhering the electroformed product through the adhesive roller and the electroforming roller, and the receiving wheel is used for receiving the adhesive film adhered with the electroformed product;
or the like, or, alternatively,
the periphery of the pasting roller is provided with a pasting film; the pasting roller is pressed against the electroforming roller to adhere the peeled electroformed product.
3. A method for manufacturing a conductive line by electroforming, the method being implemented based on the electroforming apparatus according to any one of claims 1 to 2, comprising the steps of:
covering a designed conductive circuit pattern on the surface of an electroforming roller to serve as an electroforming mold;
step two, the electroforming roller rotates, and the electroforming mold is contacted with the electroforming solution, so that metal ions in the electroforming solution form a layer of metal film on the graph surface of the conductive circuit;
step three, the electroforming roller continues to rotate, and the metal film is separated under the action of external force;
and step four, the pasting roller rotates to adhere the separated metal film for receiving, and the electroforming roller continues to rotate for electroforming.
4. The method of claim 3, wherein the conductive trace pattern protrudes from the surface of the electroforming roller; the metal ions are deposited according to the conductive circuit pattern, so that the outline of the metal film is the same as that of the conductive circuit pattern.
5. A method of making electrically conductive traces according to claim 3 wherein the electroforming solution is rich in one of copper ions, aluminum ions, nickel ions, and silver ions.
6. A method for manufacturing a conductive circuit by electroforming according to claim 3, wherein in the third step, the metal film separation is performed by peeling the metal film from the electroforming mold by pressing or vibrating or adsorbing of the pressing wheel.
7. A method for manufacturing a conductive circuit by electroforming according to claim 3, wherein in the fourth step, the pasting roller itself is provided with a pasting film, the pasting film is pasted on the surface of the electroforming mold, and the peeled metal film is continuously adhered.
8. A method for manufacturing a conductive line by electroforming according to claim 7, further comprising a fifth step of continuously discharging a protective film by a protective film roller, wherein the protective film is adhered to the side of the pasting film to which the metal film is pasted at the receiving roller to protect the metal film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910431629.4A CN110029372B (en) | 2019-05-22 | 2019-05-22 | Electroforming equipment and method for manufacturing conducting circuit by electroforming mode |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910431629.4A CN110029372B (en) | 2019-05-22 | 2019-05-22 | Electroforming equipment and method for manufacturing conducting circuit by electroforming mode |
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| Publication Number | Publication Date |
|---|---|
| CN110029372A CN110029372A (en) | 2019-07-19 |
| CN110029372B true CN110029372B (en) | 2020-08-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910431629.4A Active CN110029372B (en) | 2019-05-22 | 2019-05-22 | Electroforming equipment and method for manufacturing conducting circuit by electroforming mode |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203530451U (en) * | 2013-10-31 | 2014-04-09 | 常州华日升反光材料股份有限公司 | Electroforming equipment |
| CN106521563A (en) * | 2016-10-31 | 2017-03-22 | 无锡职业技术学院 | Electric casting manufacturing device and process of carbon fiber reinforced metal |
| CN107112210A (en) * | 2014-12-22 | 2017-08-29 | 富士胶片株式会社 | Imprint mold |
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2019
- 2019-05-22 CN CN201910431629.4A patent/CN110029372B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203530451U (en) * | 2013-10-31 | 2014-04-09 | 常州华日升反光材料股份有限公司 | Electroforming equipment |
| CN107112210A (en) * | 2014-12-22 | 2017-08-29 | 富士胶片株式会社 | Imprint mold |
| CN106521563A (en) * | 2016-10-31 | 2017-03-22 | 无锡职业技术学院 | Electric casting manufacturing device and process of carbon fiber reinforced metal |
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| Publication number | Publication date |
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| CN110029372A (en) | 2019-07-19 |
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