CN102387669B - Three-dimensional circuit component and manufacture method thereof - Google Patents
Three-dimensional circuit component and manufacture method thereof Download PDFInfo
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- CN102387669B CN102387669B CN201010268256.2A CN201010268256A CN102387669B CN 102387669 B CN102387669 B CN 102387669B CN 201010268256 A CN201010268256 A CN 201010268256A CN 102387669 B CN102387669 B CN 102387669B
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Abstract
The invention discloses a three-dimensional circuit component and a manufacture method thereof and particularly relates to a method of forming a conductive circuit on a non-conductive base in electroplating mode. The non-conductive base, a circuit pattern portion on the base, a conductive contact and an electric guide contact are formed through co-injection processing. A conductive medium layer is further formed and covered on the circuit pattern portion and all contacts. Finally, a metal circuit is formed on the circuit pattern portion in electroplating mode, and electroplating current is distributed on the circuit pattern portion evenly through arrangement of the conductive contact and the electric guide contact. Therefore, a problem that the thickness of a metal coating is uneven when the metal circuit is formed in electroplating mode is solved, and the advantages of reducing production cost and improving production efficiency are obtained.
Description
Technical field
The invention relates to a kind of three-dimensional circuit component and preparation method thereof, relate to a kind of manufacture method utilizing the mode of plating to form the three-dimensional circuit component of conducting wire on non-conductive pedestal especially.
Background technology
Based on masses' being particular about for the convenience of 3C Product and portability, order about the future development of electronic product towards microminiaturization, lightweight and multifunction, impelled IC to design simultaneously and circuit design towards the direction progress that three-dimensional 3D designs.By the three-dimensional that circuit element designs, complicated circuit can be formed on the circuit element of limited bulk, allowing electronic product not affecting under its function, can apparent volume be reduced.In other words, the circuit element design of three-dimensional, impel electronic product under small volume, also complicated circuit can be possessed, therefore the cubic design of circuit element, really have and allow the potentiality of electronic product microminiaturization, lightweight and multifunction, and be widely used in various aspect, as electronic products such as mobile phone, automobile circuit, ATM (automatic teller machine) and hearing aidss.
At present, the mode for making three-dimensional circuit component has moulded-interconnect element (MID, molded interconnect device)-extra quality jetting process.The method is by extra quality shoot mode, first with non-conductive material ejection formation forming element carrier, then forms circuit patterns with another material on component carrier via ejection formation, finally uses chemical plating mode in circuit patterns, generate metallic conduction circuit.In addition, the mode making three-dimensional circuit component still has moulded-interconnect element-laser direct forming method (MID-LDS, Molded Interconnect device-Laser DirectStructuring), this mode is via ejection formation forming element carrier by the non-conductive plastic containing catalyst, again with the catalyst on laser activated carrier, make catalyst change catalyst core into, carry out electroless plating reaction by catalyst core and preplating metal ion, and form metallic conduction circuit.
The manufacture method of above-mentioned known three-dimensional circuit component, efficiently can produce three-dimensional circuit component, but the design being limited to circuit patterns is often made up of the multiple circuits be not connected mutually, and has high requirement as the uniformity of its metal layer thickness of metallic conduction circuit of three-dimensional circuit component.Therefore, because chemical plating is when not applying electric power, the metal solvent that its adhering on surface of part forming circuit patterns by wish on circuit element, carry out a catalytic reaction so that preplating reducing metal ions wish on circuit element is formed the surface of the part of circuit patterns to the preplating metal ion existed in chemical plating fluid, therefore chemical plating has compared to plating the advantage that there is not the uneven impact of electric force lines distribution and also can obtain the uniform coating of thickness to the plating piece of complex geometry.The conducting wire adopting chemical plating mode to make three-dimensional circuit component in a known way more.
Chemical plating is when not applying electric power, the metal solvent that its adhering on surface of part forming circuit patterns by wish on circuit element, one catalytic reaction is carried out to the preplating metal ion existed in chemical plating fluid, so that preplating reducing metal ions wish on circuit element is formed the surface of the part of circuit patterns.Therefore, electroless plating method can form the uniform coat of metal of thickness in the surface for forming the part of circuit patterns on circuit element.But because chemical plating is the chemical reduction reaction of carrying out under not external energy, therefore its reaction time is long, speed of separating out is slow, and easily produces a large amount of waste liquid.Such as, when forming copper thickness 10 microns or nickel thickness 3 microns with chemical plating, the reaction time reaching 3,4 hours must just be expended.In addition, chemical plating need use a large amount of plating solutions and reducing agent, also causes the problem of high cost.
If but when forming copper or the nickel metal layer of same thickness with plating mode, plating not only can reduce the reaction time effectively, increase outside production efficiency, due to plating solution use amount compared to electroless plating method less much and do not need to use a large amount of reducing agent, therefore, the effect reducing production cost can also be reached.In addition, chemical plating is compared with plating, and stability of solution used is poor, and the maintenance of solution, adjustment and regeneration are all cumbersome, and therefore material cost expense is also comparatively electroplated higher.Consider electroless plating method the problem of reaction time of deriving slow and high cost, if effectively plating mode can be applied in the making of three-dimensional circuit component, not only make it can form various different stereo circuit pattern, the uniform coat of metal of thickness can also be produced, then can replace the making that electroless plating method is applied to circuit, enhance productivity to reach, reduce the object of production cost and minimizing waste liquid generation.
Summary of the invention
Because above-mentioned known technology Problems existing, object of the present invention is providing a kind of three-dimensional circuit component and preparation method thereof exactly, to reach the mode utilizing plating, produces the object of the uniform metallic conduction circuit of thickness.
Object according to the present invention proposes a kind of manufacture method of three-dimensional circuit component, its key step comprises: one first non-conductive material ejection formation is formed a pedestal, again one second non-conductive material ejection formation is formed at least one first material bone, a circuit patterns portion and at least one conductive junction point on pedestal, make at least one first material bone and at least one conductive junction point form with circuit patterns portion the circuit communicated.Then forming an interface layer is covered at least one first material bone, circuit patterns portion and at least one conductive junction point, and after being formed in interface layer that an insulating barrier is covered at least one conductive junction point, then form a coat of metal and be covered in the interface layer in circuit patterns portion.Finally remove and be covered in interface layer at least one conductive junction point and insulating barrier; And remove at least one first material bone, to obtain a three-dimensional circuit component.
Wherein, when the first non-conductive material ejection formation is formed a pedestal, more can form at least one second material bone, and at least one second material bone is connected to pedestal simultaneously.
Wherein, in circuit patterns portion, form the coat of metal by galvanoplastic, and circuit patterns portion is made up of at least one circuit.
Wherein, second non-conductive material ejection formation is formed at least one first material bone, a circuit patterns portion and at least one conductive junction point on pedestal time, more can form at least one electric contact that draws on pedestal, and at least one electric contact, at least one first material bone and at least one conductive junction point of drawing forms with circuit patterns portion the circuit communicated simultaneously.
Wherein, at least one draw electric contact be arranged on composition preinstalled circuit pattern portion at least one circuit between, and in electroplate time, average for electroplating current is directed to each circuit.
Wherein, at least one conductive junction point is used to connect at least one first material bone and circuit patterns portion, using the current lead-through point as circuit patterns portion in time electroplating.
Object according to the present invention proposes a kind of three-dimensional circuit component again, and it includes: a pedestal, is formed by one first non-conductive material;
One circuit patterns portion be arranged on pedestal according to a pattern, and circuit patterns portion is made up of at least one circuit; One coat of metal is covered in circuit patterns portion; And at least one conductive junction point, be arranged on this pedestal, in order to connect edge and the circuit patterns portion of pedestal.Wherein, circuit patterns portion and at least one conductive junction point formed by one second non-conductive material.
Wherein, at least one conductive junction point is in order to connecting circuit pattern portion, susceptor edges and at least one first material bone.
Wherein, more comprising and at least onely draw electric contact, is be arranged between at least one circuit on pedestal, in order to connect this at least one circuit.
By above technical scheme, three-dimensional circuit component of the present invention and preparation method thereof, it can have one or more following advantage:
(1) utilize galvanoplastic to form metallic circuit, owing to not needing to use chemical plating fluid in a large number and the coating speed of separating out of galvanoplastic is fast, therefore there is advantages such as can reducing production cost, improving production efficiency, minimizing waste liquid generation and decreasing pollution.
(2) according to the conductive path length of each circuit, the area of circuit pattern or geometry etc., by conductive junction point and draw electric contact mean allocation and be arranged between each circuit, allow electroplating current uniform distribution in each part of circuit pattern, and then the uniform metallic circuit layer of thickness can be obtained.
Accompanying drawing explanation
Fig. 1 is the flow chart of steps of the manufacture method of stereo circuit of the present invention.
Fig. 2 is embodiment 1 schematic diagram of three-dimensional circuit component of the present invention.
Fig. 3 is the form schematic diagram of embodiment 1 in completing steps S11 and step S12 of three-dimensional circuit component of the present invention.
Fig. 4 is embodiment 1 another form schematic diagram in completing steps S11 and step S12 of three-dimensional circuit component of the present invention.
Fig. 5 is embodiment 2 schematic diagram of three-dimensional circuit component of the present invention.
Fig. 6 is the 1st form schematic diagram of embodiment 2 in completing steps S11 and step S12 of three-dimensional circuit component of the present invention.
Fig. 7 is the 1st form schematic diagram of embodiment 2 in completing steps S13 of three-dimensional circuit component of the present invention.
Fig. 8 is the 1st form schematic diagram of embodiment 2 in completing steps S14 of three-dimensional circuit component of the present invention.
Fig. 9 is the 1st form schematic diagram of embodiment 2 in completing steps S15 of three-dimensional circuit component of the present invention.
Figure 10 is the 1st form schematic diagram of embodiment 2 in completing steps S16 of three-dimensional circuit component of the present invention.
Figure 11 is the 1st form schematic diagram of embodiment 2 in completing steps S17 of three-dimensional circuit component of the present invention.
Figure 12 is the form schematic diagram of three-dimensional circuit component in completing steps S15 of the embodiment 3 of stereo circuit of the present invention.
Figure 13 is the 2nd form schematic diagram of embodiment 2 in completing steps S15 of stereo circuit unit of the present invention.
Figure 14 is that the embodiment 2 of three-dimensional circuit component of the present invention is in completing steps S15's
2nd form in removing the first material bone after pedestal, the schematic diagram of kish layer burr on pedestal.
Figure 15 is the 1st form schematic diagram of embodiment 4 in completing steps S15 of three-dimensional circuit component of the present invention.
Figure 16 is the 2nd form schematic diagram of embodiment 4 in completing steps S15 of three-dimensional circuit component of the present invention.
Figure 17 is the form schematic diagram of embodiment 5 in completing steps S15 of three-dimensional circuit component of the present invention.
Figure 18 is the form schematic diagram of three-dimensional circuit component in completing steps S15 of embodiments of the invention 6.
In figure:
10,40: pedestal
101,401: the second material bones
20,50: circuit patterns portion
501,201: conductive junction point
502,202: draw electric contact
503,203: the first material bones
2031: metal level burr
30: interface layer
31: insulating barrier
S11-S17: Bu Sudden embodiment
Embodiment
Hereinafter with reference to relevant indicators, the three-dimensional circuit component and preparation method thereof according to present pre-ferred embodiments is described.For the ease of understanding, the similar elements system of following embodiment indicates explanation with same-sign.
The present invention proposes a kind of three-dimensional circuit component and preparation method thereof.Refer to Fig. 1 and Fig. 2, it is respectively the flow chart of steps of the manufacture method of three-dimensional circuit component of the present invention and embodiment 1 schematic diagram of three-dimensional circuit component of the present invention.
As shown in Figure 1, the manufacture method key step of three-dimensional circuit component of the present invention comprises: step S11, and one first non-conductive material ejection formation is formed a pedestal.Step S12, forms at least one first material bone, a circuit patterns portion and at least one conductive junction point on pedestal, makes at least one first material bone and at least one conductive junction point form with circuit patterns portion the circuit communicated by one second non-conductive material ejection formation.Step S13, forms an interface layer and is covered at least one first material bone, circuit patterns portion and at least one conductive junction point.Step S14, forms an insulating barrier and is covered in the interface layer of at least one conductive junction point.Step S15, forms a coat of metal and is covered in the interface layer in circuit patterns portion.Step S16, removes and is covered in interface layer at least one conductive junction point and insulating barrier.And step S17, remove at least one first material bone, to obtain a three-dimensional circuit component.
Wherein, the first non-conductive material can be any dielectric plastics, and the second non-conductive material is non-conductive and be applicable to the plastics carrying out chemical plating.
Wherein, be in circuit patterns portion, form the coat of metal by galvanoplastic in step S15, and circuit patterns portion is made up of at least one circuit.
Wherein, at least one conductive junction point is used to connect at least one first material bone and circuit patterns portion, using the current lead-through point as circuit patterns portion in time electroplating.
Wherein, in step s 12, more can comprise being formed and at least onely draw electric contact, to be used for connecting this at least one circuit, and in time electroplating, average for electroplating current is directed to each circuit.
As shown in Figure 2, the three-dimensional circuit component completed made by the manufacture method of three-dimensional circuit component of the present invention includes: a pedestal 10; One circuit patterns portion 20 is arranged on pedestal 10 according to a pattern; One coat of metal, is be covered in circuit patterns portion 20, utilizes black block to represent the part of the coat of metal in figure; At least one conductive junction point 201 is arranged on pedestal 10, in order to connect edge and the circuit patterns portion 20 of pedestal 10.
And referring to Fig. 3, it is the form schematic diagram of embodiment 1 in completing steps S11 and step S12 of three-dimensional circuit component of the present invention.As shown in the figure, it includes in step s 11, by the pedestal 10 that the first non-conductive material ejection formation is formed, and in step s 12, at least one first material bone 203 formed by the second non-conductive material ejection formation, at least one conductive junction point 201 and circuit patterns portion 20.
Wherein, in step s 11, when forming pedestal 10 by the first non-conductive material ejection formation, more can form at least one second material bone 101 is connected on pedestal 10 simultaneously, as shown in Figure 4, it is embodiment 1 another form schematic diagram in completing steps S11 and step S12 of three-dimensional circuit component of the present invention, and now formed in step s 11 at least one second material bone 101 finally can remove in the lump together with at least one first material bone 203 in step S17 on pedestal 10.
In addition, in step s 12, by the second non-conductive material ejection formation formed at least one first material bone 203, circuit patterns portion 20 and at least one conductive junction point 201 on pedestal 10 time, more can form at least one electric contact 202 that draws simultaneously on pedestal 10, and finally form embodiment 2 schematic diagram of three-dimensional circuit component of the present invention as shown in Figure 5.It includes pedestal 10, circuit patterns portion 20, coat of metal as shown in the figure, be covered in circuit patterns portion, black block is utilized to represent the part of the coat of metal, at least one conductive junction point 201 and at least onely draw electric contact 202 in figure, be arranged on pedestal 10, in order to connect edge and the circuit patterns portion 20 of pedestal 10.
Now formed at least onely drawing electric contact 202, is be arranged on pedestal 10, in order to connecting circuit pattern portion 20.And if be formed at least one when drawing electric contact 202 in step S12 simultaneously, then in step s 13 form the interface layer being covered at least one conductive junction point 201, can be formed equally and be covered at least one drawing on electric contact 202.And in step S14 form the insulating barrier be covered at least one conductive junction point 201, can be formed equally and be covered at least one drawing on electric contact 202.And be covered in and at least onely draw interface layer on electric contact 202 and insulating barrier, finally can remove in step S16.
In addition in example 2, in step S11, when forming pedestal 10 by the first non-conductive material ejection formation, same at least one second material bone 101 that also can simultaneously be formed as shown in Figure 4.
Below for ease of further facilitating the manufacture method that three-dimensional circuit component of the present invention is described, illustrate by including at least one embodiment 2 of drawing electric contact for example, and be formed with at least one the multi-form of second material bone in step s 11 with embodiment 2 three-dimensional circuit component of the present invention and preparation method thereof is described.And will compare other include at least one draw each embodiment of electric contact difference and the difference of each embodiment at least one first material bone and at least one second material bone design in manufacturing process.
Refer to Fig. 6 to Figure 11, it is that the embodiment 2 of three-dimensional circuit component of the present invention is in the 1st form schematic diagram completing each step S11-S17 respectively, in the 1st form of embodiment 2, the three-dimensional circuit component of embodiment 2 is formed with at least one second material bone in step s 11.
First refer to shown in Fig. 6, it is that three-dimensional circuit component of the present invention is in the 1st form schematic diagram of completing steps S11 and step S12.In S11 step, the first non-conductive material ejection formation is formed a pedestal 10.And form circuit patterns portion 20, at least one conductive junction point 201 and at least one first material bone 203 on pedestal 10 by the second non-conductive material in step s 12, and conductive junction point 201, draw electric contact 202 contact and circuit patterns portion 20 forms interconnected circuit.Wherein, in the 1st form of this embodiment 2, step S11 more comprises the first non-conductive material ejection formation is formed at least one second material bone 101 on pedestal 10, and more comprise in step s 12 the second non-conductive material ejection formation is formed at least one electric contact 202 that draws on pedestal 10, and this first material bone 203 is connected with conductive junction point 201, and be connected with circuit patterns portion 20 by conductive junction point 201, and to draw electric contact 202 be that position is between the circuit in built-up circuit pattern portion 20, the conductive path of circuit be used for when shortening plating, to balance electroplating current.In addition, when circuit patterns portion 20 be designed to many circuits be not connected to each other form time, draw electric contact 202 except each circuit can be shortened except the conductive path of electroplating process, the circuit be not originally connected to each other can be allowed again to be simultaneously interconnected with one another.
And the first non-conductive material can be any dielectric plastics, the second non-conductive material is then non-conductive and is applicable to the plastics carrying out chemical plating.In addition, by calculating conductive path length, the geometry and area etc. of each circuit, conductive junction point 201 and draw electric contact 202 can according to result of calculation and the object for balanced each circuit part conductive current, and distribute arbitrarily and be arranged between each circuit, the impact of the electric force lines distribution uneven thickness for formed coat of metal during to avoid electroplating.
Then refer to Fig. 7, it is the 1st form schematic diagram of embodiment 2 in completing steps S13 of three-dimensional circuit component of the present invention.As shown in the figure, in step s 13, form that an interface layer 30 is covered in one side that the first material bone 203 is connected with circuit patterns portion 20, circuit patterns portion 20, at least one conductive junction point 201 and at least onely draw on electric contact 202, in the figure 7, indicate the part forming interface layer 30 in the mode put.Wherein interface layer 30 must have conductivity, can be formed by various ways, form interface layer 30 by chemical plating in the present invention, for there is conductivity and thickness is about the metal level of 0.1 micron to 2 microns, and its optimum thickness is 0.2 micron to 1 micron, and be the metal of the tool such as copper or nickel conductivity.Wherein because the second non-conductive material is non-conductive and be applicable to the plastics carrying out chemical plating, therefore interface layer can be formed at the part formed by the second non-conductive material.
Interface layer 30 is to allow the first material bone 203, circuit patterns portion 20, conductive junction point 201 and draw that electric contact 202 becomes to each other can the wire of mutual conduction, so when step S15 electroplates, by the negative pole of the first material bone 203 and power supply is connected, can allow and have the circuit patterns portion of the conductance general character between the first material bone 203 in electroplating process as negative pole, and allow the positive pole of power supply and preplating metal solid connect, when circuit element being soaked in the electroplate liquid containing preplating metal ion, preplating metal ion just receives electronics on the surface in the interface layer 30 in the circuit patterns portion 20 as negative pole and reduces the pre-plating of precipitation in circuit patterns portion, form desired metallic circuit.Wherein, the metal of pre-galvanized can be copper, nickel, chromium, tin, silver or the metal such as golden.
Refer to Fig. 8 again, it is the 1st form schematic diagram of embodiment 2 in completing steps S14 of three-dimensional circuit component of the present invention.In S14 step, form an insulating barrier 31 and be covered at least one conductive junction point 201 and at least onely draw in the interface layer 30 of electric contact 201, in figure, utilize oblique line block to represent insulating barrier 31 position.Wherein, insulating barrier 31 can use ink or coating to process in modes such as printing, ink-jets and ink can be solvent type acid-proof ink, the acid-proof ink of water-based, acidproof not alkaline-resisting ink or the ink of UV constrictive type, the ink of anti-plate or coating etc., can also stick insulating tape as insulating barrier.
In S14 step, form an insulating barrier 31 and be covered in the object of conducting electricity and connecing electricity 201 and drawing in the interface layer 30 of electric contact 202, be in order to allow conductive junction point 201 and draw electric contact 202 electroplate in step S15 time, only just by the existence of interface layer 30 can with circuit patterns portion 20 and the first material bone 203 mutual conduction, the coat of metal can't being formed at conductive junction point 201 and draw on electric contact 202, causing the change to the circuit patterns for being formed.In other words, insulating barrier 31 allows conductive junction point 201 and draw electric contact 202 and be purely only used to conduct electricity and can not increase thickness by the electroplating process in step S15.
Refer to Fig. 9, it is the 1st form schematic diagram of embodiment 2 in completing steps S15 of three-dimensional circuit component of the present invention.Represent the part forming the coat of metal at electroplating process in figure with black block, can find out, conduction connects electricity 201 and draws on electric contact 202 and do not form the coat of metal, and the coat of metal is only formed on circuit patterns portion 20 and the first material bone 203.
Refer to Figure 10, it is the 1st form schematic diagram of embodiment 2 in completing steps S16 of three-dimensional circuit component of the present invention.After forming the coat of metal, in step s 16, the insulating barrier 31 removing conductive junction point 201 and draw on electric contact 202 and interface layer 30, make conductive junction point 201 and draw the state that electric contact 202 and circuit patterns portion 20 revert to not conducting, avoid the circuit patterns affecting the coat of metal.As shown in the figure, remove after being covered in insulating barrier 31 on each contact and interface layer 30, namely expose conductive junction point 201 and draw electric contact 202 the second non-conductive material surface originally, in figure, represent the second non-conductive material surface originally with white block.
Wherein, what the method removing the insulating barrier 31 and interface layer 30 being covered in conductive junction point 201 and drawing electric contact 202 can use dry type removes method, removes insulating barrier and interface layer as utilized laser simultaneously.What maybe can use wet type removes method, such as, utilize akaline liquid or remover, and coordinate ultrasonic equipment or utilize the mode of electrolysis first to be removed by insulating barrier, interface layer is removed by recycling acidic liquid or micro-etching agent etc.And if use laser divests, then can only for conductive junction point 201 and draw electric contact 202 and have the part be connected to divest with circuit patterns portion 20, with conductive junction point 201 and draw electric contact 202 the interface layer 30 with conductivity for not change circuit patterns portion 20 for principle.
Finally refer to Figure 11, it is the 1st form schematic diagram of embodiment 2 at completing steps S17 of three-dimensional circuit component of the present invention.In step S17, remove the first material bone 203 and the second material bone 101 in pedestal 10, to obtain three-dimensional circuit component as shown in Figure 5.Wherein, the first material bone and the second material bone are removed and is located away from pedestal, to avoid the pattern and the function that affect three-dimensional circuit component outward appearance and upper metallic circuit thereof.
And removing in step, in order to ensure in electroplating process, there is the first material bone 203 of interface layer 30 equally, the coat of metal can not formed with the contiguous part contacted in circuit patterns portion 20, cause when removing step, have influence on the circuit patterns portion 20 adjoining with it, different designs can be had in the junction of the first material bone 203 and substrate 10.As shown in Figure 9, in the 1st form of the completing steps S15 of this embodiment 2, removal end when namely one end that first material bone 203 is connected with pedestal 10 removes, directly do not touch circuit patterns portion 20, and possess a segment distance, this segment distance is the position for conductive junction point 201 place, and by the interface layer 30 of conductive junction point 201 is coated with insulating barrier 31, make not have the coat of metal at electroplating process between the first material bone 203 and circuit patterns portion 20 to produce, during to guarantee to remove the first material bone 203, the design of original circuit patterns can not be had influence on, wherein, from scheme more can find out be covered in insulating barrier 31 on conductive junction point 201 also can a little toward at least one first material bone 203 with extend, so can when at least one first material bone 203 be removed in pedestal 10, metal burr can not be left at the edge of at least one first material bone 203 and conductive junction point 201 connecting place.
In addition, as seen from Figure 9, the second material bone 101 more by the first non-conductive material is formed in this form, be coated on around removal end that the first material bone 203 is connected with pedestal 10, only expose the one side that the first material bone 203 and conductive junction point 201 connect, to avoid in electroplating process, the coat of metal is formed around the connecting place of the first material bone 203 and pedestal 10, cause and remove the first material bone 203 after pedestal, produce metal level burr and remain in pedestal 10, affect the design of three-dimensional circuit component.Wherein, the second material bone formed by the first non-conductive material can not form interface layer and cover its surface in the plating process of step S13, it is hereby ensured when electroplating process, can not form the coat of metal.
As mentioned above, in embodiment 2 in the first form of each steps flow chart, the design of the first material bone 203 and pedestal 10 connected mode, can guarantee when removing the first material bone 203 in pedestal 10, the circuit patterns 20 that can not have influence on original antenna designs, and can not kish layer burr on element base 10.
Refer to Figure 12 to Figure 13, its three-dimensional circuit component being respectively the embodiment 3 of stereo circuit of the present invention is in the form schematic diagram of completing steps S15 and the three-dimensional circuit component of embodiment 2 in the 2nd form schematic diagram of completing steps S15.As can be seen from Figure, embodiment 2 and embodiment 3 have that identical circuit patterns portion 20 designs, identical conductive junction point 201 configures and the identical electric contact 202 that draws configures, and due to the manufacture method of the three-dimensional circuit component of each embodiment all described above, therefore just no longer to describe in detail at this.
And embodiment 2 can be found out in the 1st form of completing steps S15, embodiment 2 in the 2nd form of completing steps S15 and embodiment 3 form at completing steps S15, the maximum difference of three is the design of the connected mode of the first material bone 203 and pedestal 10.
As shown in figure 12, in one form of embodiment 3, the first material bone 203 that element produces in manufacturing process to be designed to the removal end that the first material bone 203 removes in pedestal 10 be close in circuit patterns 20, cause when removing, need very the removing of careful, be just unlikely the circuit patterns portion 20 that destruction is close to.In addition, in in one form of embodiment 3, there be not the coated of the first non-conductive material in the surrounding of the first material bone 203 and pedestal 10 joint, causes the first material bone 203 to remove after pedestal 10, easily at peripheral part kish layer burr of the first material bone 203 with pedestal 10 connecting place.These metal level burr need give processing again depending on its demand and remove.
And shown in Figure 13, in the 2nd form of embodiment 2 after completing steps S15, although the first material bone 203 is not close to circuit patterns portion 20, and as in the 1st form of embodiment 2, be connected with circuit patterns portion 20 by conductive junction point 201, but because there be not the coated of the first non-conductive material in the surrounding of the first material bone 203 and pedestal 10 joint, therefore when removing, easily at peripheral part kish layer burr with pedestal 10 connecting place.These metal level burr need give processing again depending on its demand and remove.
Figure 14 can be consulted, its embodiment 2 being three-dimensional circuit component of the present invention is in the 2nd form of completing steps S15 in removing the first material bone 203 after pedestal 10, the schematic diagram of kish layer burr 2031 on pedestal 10, metal level burr 2031 can remain in around the first material bone 203 and pedestal 10 connecting place as seen from Figure 14.These metal level burr need give processing again depending on its demand and remove.
Refer to Figure 15 to Figure 17, its embodiment 4 being respectively three-dimensional circuit component of the present invention is in the 1st form schematic diagram of completing steps S15 and the 2nd form schematic diagram and embodiment 5 in a form schematic diagram of completing steps S15.The maximum difference of three can be observed out by figure and be that one first material bone 203 is wherein not identical with the design of pedestal 10 connecting place, and its other difference and 1st form of impact in above-mentioned comparing embodiment 2 in completing steps S15, the 2nd form and, embodiment 3 to describe in detail, therefore is not described in detail in this and compares when the difference of a form of completing steps S15.
In addition, the difference that the three-dimensional circuit component of embodiment 4, embodiment 5 and embodiment 2 and embodiment 3 is maximum is in embodiment 4, embodiment 5, be provided with two conductive junction points 201, and position set by conductive junction point 201 as described earlier and, be arranged between the first material bone 203 and circuit patterns portion 20, to connect the first material bone 203 and circuit patterns portion 20.And when electroplating process, by power cathode is seized on both sides by the arms as shown in the figure with electrode holder, expect on bone 203 at the Shu be connected with each conductive junction point 201, make there is the circuit patterns portion 20 of the conductance general character between the first material bone 203 in electroplating process, analyse as negative pole and plate out pre-plating form metallic circuit in circuit patterns portion 20.
Wherein, multiple conductive junction point 201 is distributed in the circuit patterns portion 20 of pedestal 10 in conjunction with multiple first material bone 203, the circuit patterns portion 20 on pedestal 10 is allowed the mode of multiple spot to be connected with power cathode, make power end can mean allocation in circuit patterns portion 20, originally the high electric current of the circuit near single conductive junction point is concentrated on to help dispersion, allow average being dispersed in circuit patterns portion 20 of electroplating current, avoid the formation of the coat of metal in uneven thickness.
Refer to Figure 18, it is the form schematic diagram of three-dimensional circuit component in completing steps S15 of embodiments of the invention 6.Embodiment 5, for the manufacture method of three-dimensional circuit component of the present invention is applied to columned three-dimensional circuit component, wherein, this form of embodiment 7 as shown in figure 18, for after completing steps S15, include non-conductive substrate 40, circuit patterns portion 50, conductive junction point 501 and draw electric contact 502.Wherein at conductive junction point 501 and draw on electric contact 502, be respectively coated with an interface layer 30 and insulating barrier 31, due to its formed and production method as aforesaid step, therefore in this another repeated description.
Columned three-dimensional circuit component in embodiment 7, its circuit patterns portion 50 for being wound in the continuous print spiral coil on cylinder, and is provided with two conductive junction points 501.Each conductive junction point 501 respectively position, on the second material bone 503 at cylinder circuit element two ends, is used for connection second material bone 503 and spiral helicine circuit patterns portion 50, using as during plating step and the energising point that connects of power cathode.As shown in the figure, conductive junction point 501 is separately positioned on the two ends of cylindric three-dimensional circuit component, in the circuit patterns portion 50 being distributed on cylindric three-dimensional circuit component contributing to making electroplating current average, electroplating current is allowed major part to concentrate on the circuit relatively near arbitrary conductive junction point 501, and the metal level causing plating to generate is thicker, or on circuit near a distant conductive junction point 501 of leaving one's post, the metal level causing plating to generate is thinner.Therefore, the design of conductive junction point 501 as shown in the figure, has the effect of the electroplating current of each circuit in balancing circuitry pattern portion, and then reaches the object of budget metals thickness of coating.
In addition, as shown in Figure 18, more by multiple setting of drawing electric contact 502, to reduce the access path between its each coil of continuous print helical coil circuit, the object reducing conductive path in time electroplating can be reached.By reduce conductive path by electroplating current can evenly be distributed in circuit patterns, to avoid causing the metal layer thickness in circuit patterns portion uneven.
After plating completes, remove conductive junction point 501 and the insulating barrier drawn on electric contact 502 and interface layer, and cylinder two ends present the first material bone 503 of T font and the second material bone 401 will remove in cylinder circuit element body, and retain original circuit patterns and component body, each step describes in detail as above, therefore in this not another repeated description.
The foregoing is only illustrative, but not be restricted person.Anyly do not depart from spirit of the present invention and category, and to its equivalent modifications of carrying out or change, all should be contained in claim.
Claims (15)
1. a manufacture method for stereo circuit, is characterized in that, its step comprises:
One first non-conductive material ejection formation is formed a pedestal;
One second non-conductive material ejection formation is formed at least one first material bone, a circuit patterns portion and at least one conductive junction point on described pedestal, make described at least one first material bone and described at least one conductive junction point form with described circuit patterns portion the circuit communicated;
Forming an interface layer is covered on described at least one first material bone, described circuit patterns portion and described at least one conductive junction point;
Forming an insulating barrier is covered in the described interface layer of described at least one conductive junction point;
Forming a coat of metal is covered in the described interface layer in described circuit patterns portion;
Remove and be covered in described interface layer on described at least one conductive junction point and described insulating barrier; And
Remove described at least one first material bone, to obtain a three-dimensional circuit component.
2. the manufacture method of stereo circuit as claimed in claim 1, it is characterized in that: the step of the described pedestal of described formation more comprises described first non-conductive material ejection formation is formed at least one second material bone, and described at least one second material bone is connected to described pedestal.
3. the manufacture method of stereo circuit as claimed in claim 2, is characterized in that: described in remove described at least one first material bone step more comprise and remove described at least one second material bone.
4. the manufacture method of stereo circuit as claimed in claim 1, it is characterized in that: the step of the described at least one first material bone of described formation more comprises described second non-conductive material ejection formation is formed at least one electric contact that draws on described pedestal, and described at least one electric contact that draws forms with described at least one first material bone, described circuit patterns portion and described at least one conductive junction point the circuit communicated on described pedestal.
5. the manufacture method of stereo circuit as claimed in claim 4, it is characterized in that: the step of the described interface layer of described formation more comprises and forms described interface layer and be covered in and describedly at least onely draw on electric contact, and the step of the described insulating barrier of described formation more comprises and forms described insulating barrier and be covered in described at least onely to draw on electric contact, and described in remove described interface layer and described insulating barrier step more comprise removing to be covered in and describedly at least onely draw described interface layer on electric contact and described insulating barrier.
6. the manufacture method of stereo circuit as claimed in claim 4, is characterized in that: described circuit patterns portion is made up of at least one circuit, and connects described at least one circuit by described at least one electric contact that draws.
7. the manufacture method of stereo circuit as claimed in claim 1, is characterized in that: described at least one first material bone connects described circuit patterns portion by described at least one conductive junction point.
8. the manufacture method of stereo circuit as claimed in claim 1, is characterized in that: described interface layer is a metal level with conductivity.
9. the manufacture method of stereo circuit as claimed in claim 1, is characterized in that: form described interface layer by electroless plating method, and forms the described coat of metal by galvanoplastic.
10. the manufacture method of stereo circuit as claimed in claim 9, is characterized in that: described interface layer thickness is 0.1-2 micron.
The manufacture method of 11. stereo circuits as claimed in claim 1, is characterized in that: described insulating barrier is ink, coating or adhesive tape.
The manufacture method of 12. stereo circuits as claimed in claim 1, it is characterized in that: described in remove described interface layer and described insulating barrier step remove described interface layer and described insulating barrier by laser, or coordinate ultrasonic equipment by liquid remover or utilize the mode of electrolysis first to be removed by described insulating barrier, described interface layer is removed by recycling acidic liquid or micro-etching agent.
13. 1 kinds of three-dimensional circuit components, is characterized in that, include:
One pedestal, by one first non-conductive material is formed;
One circuit patterns portion, is arranged on described pedestal according to a pattern, and described circuit patterns portion is made up of at least one circuit;
One coat of metal, is covered in described circuit patterns portion; And
At least one conductive junction point, is arranged on described pedestal, in order to connect the edge of described pedestal and described circuit patterns portion;
Wherein, described circuit patterns portion and described at least one conductive junction point formed by one second non-conductive material, and described three-dimensional circuit component more comprises at least one first material bone is connected on described pedestal, and described at least one first material bone formed by described second non-conductive material;
Wherein, described three-dimensional circuit component more comprises at least one second material bone and is connected on described pedestal, and described at least one second material bone formed by described first non-conductive material.
14. 1 kinds of three-dimensional circuit components, is characterized in that, include:
One pedestal, by one first non-conductive material is formed;
One circuit patterns portion, is arranged on described pedestal according to a pattern, and described circuit patterns portion is made up of at least one circuit;
One coat of metal, is covered in described circuit patterns portion; And
At least one conductive junction point, is arranged on described pedestal, in order to connect the edge of described pedestal and described circuit patterns portion;
Wherein, described circuit patterns portion and described at least one conductive junction point formed by one second non-conductive material, and described three-dimensional circuit component more comprises at least one first material bone is connected on described pedestal, and described at least one first material bone formed by described second non-conductive material, has more an interface layer between described circuit patterns portion and the described coat of metal.
15. 1 kinds of three-dimensional circuit components, is characterized in that, include:
One pedestal, by one first non-conductive material is formed;
One circuit patterns portion, is arranged on described pedestal according to a pattern, and described circuit patterns portion is made up of at least one circuit;
One coat of metal, is covered in described circuit patterns portion; And
At least one conductive junction point, is arranged on described pedestal, in order to connect the edge of described pedestal and described circuit patterns portion;
Wherein, described circuit patterns portion and described at least one conductive junction point formed by one second non-conductive material, and described three-dimensional circuit component more comprises at least one first material bone is connected on described pedestal, and described at least one first material bone formed by described second non-conductive material;
Wherein, described three-dimensional circuit component more comprises and at least onely draws electric contact, is arranged between the described at least one circuit on described pedestal, in order to connect described at least one circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010268256.2A CN102387669B (en) | 2010-08-31 | 2010-08-31 | Three-dimensional circuit component and manufacture method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010268256.2A CN102387669B (en) | 2010-08-31 | 2010-08-31 | Three-dimensional circuit component and manufacture method thereof |
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| Publication Number | Publication Date |
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| CN102387669A CN102387669A (en) | 2012-03-21 |
| CN102387669B true CN102387669B (en) | 2015-04-08 |
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| CN201010268256.2A Expired - Fee Related CN102387669B (en) | 2010-08-31 | 2010-08-31 | Three-dimensional circuit component and manufacture method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105092662B (en) * | 2014-05-20 | 2019-01-22 | 光宏精密股份有限公司 | Electrochemical sensing test piece and its manufacturing method |
| CN106862564B (en) * | 2017-01-12 | 2019-11-12 | 南京航空航天大学 | The production method of structural circuit unitary member based on selective laser sintering technology |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1012995A (en) * | 1996-06-24 | 1998-01-16 | Hitachi Cable Ltd | Manufacture of circuit component provided with three-dimensional structure |
| CN1360462A (en) * | 2000-12-19 | 2002-07-24 | 神达电脑股份有限公司 | Method for preparing printed circuit board (PCB) |
| CN1414828A (en) * | 2001-10-23 | 2003-04-30 | Trw车辆电气与零件有限两合公司 | Electronic module and its producing method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020089388A1 (en) * | 2001-01-10 | 2002-07-11 | Thomas Lingel | Circulator and method of manufacture |
| CN201805617U (en) * | 2010-09-03 | 2011-04-20 | 光宏精密股份有限公司 | Three-dimensional circuit element |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1012995A (en) * | 1996-06-24 | 1998-01-16 | Hitachi Cable Ltd | Manufacture of circuit component provided with three-dimensional structure |
| CN1360462A (en) * | 2000-12-19 | 2002-07-24 | 神达电脑股份有限公司 | Method for preparing printed circuit board (PCB) |
| CN1414828A (en) * | 2001-10-23 | 2003-04-30 | Trw车辆电气与零件有限两合公司 | Electronic module and its producing method |
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| CN102387669A (en) | 2012-03-21 |
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