MY118114A - Holder for polished work and manufacturing method thereof - Google Patents

Holder for polished work and manufacturing method thereof

Info

Publication number
MY118114A
MY118114A MYPI20013217A MYPI20013217A MY118114A MY 118114 A MY118114 A MY 118114A MY PI20013217 A MYPI20013217 A MY PI20013217A MY PI20013217 A MYPI20013217 A MY PI20013217A MY 118114 A MY118114 A MY 118114A
Authority
MY
Malaysia
Prior art keywords
resin portion
polished work
hole
holder
manufacturing
Prior art date
Application number
MYPI20013217A
Inventor
Motoyuki Nanjo
Kouji Uchihata
Akihiko Uzawa
Kuniyuki Kanai
Original Assignee
Sumitomo Bakelite Co
Artlite Kogyo Co Ltd
Utk System Co Ltd
C R T Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000208289A external-priority patent/JP3439726B2/en
Application filed by Sumitomo Bakelite Co, Artlite Kogyo Co Ltd, Utk System Co Ltd, C R T Co Ltd filed Critical Sumitomo Bakelite Co
Publication of MY118114A publication Critical patent/MY118114A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

THE INNER CIRCUMFERENTIAL SURFACE (41) OF THROUGH HOLES IN A METAL PLATE (4) IS CHAMFERED OR PUT TO ANCHOR FABRICATION AND A THERMOPLASTIC RESIN IS INJECTION MOLDED TO THE INNER CIRCUMFERENTIAL SURFACE (41) OF THE THROUGH HOLE THEREBY FORMING A RESIN PORTION (2) OVER THE ENTIRE SURFACE OF THE THROUGH HOLE AND THE RESIN PORTION IS REMOVED BY GRINDING WHILE LEAVING THE PERIPHERAL PORTION (42) OF THE RESIN PORTION THEREBY FORMING A POLISHED WORK HOLDING HOLE (1). THUS, WHEN A RESIN PORTION (2) IS FORMED TO THE INNER CIRCUMFERENCE (41) OF THE HOLDING HOLE (1) IN A POLISHED WORK HOLDER (10) COMPRISING A METAL PLATE (4), THE PRODUCTION IS HIGH AND THE COST IS REDUCED, AND THE RESIN PORTION (2) IS NOT DETACHED FROM THE BONDING PORTION WITH NO USE OF THE ADHESIVE. (FIGURE 3)
MYPI20013217A 2000-07-10 2001-07-05 Holder for polished work and manufacturing method thereof MY118114A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000208289A JP3439726B2 (en) 2000-07-10 2000-07-10 Material to be polished and method of manufacturing the same

Publications (1)

Publication Number Publication Date
MY118114A true MY118114A (en) 2004-08-30

Family

ID=29695697

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20013217A MY118114A (en) 2000-07-10 2001-07-05 Holder for polished work and manufacturing method thereof

Country Status (4)

Country Link
KR (1) KR20020005980A (en)
MY (1) MY118114A (en)
SG (1) SG99915A1 (en)
TW (1) TW544367B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6792106B2 (en) * 2017-03-30 2020-11-25 スピードファム株式会社 Work carrier and manufacturing method of work carrier

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57177641U (en) * 1981-04-30 1982-11-10
JPS584349U (en) * 1981-06-30 1983-01-12 日立金属株式会社 Carrier for double-sided sanding machine
JPH0727747U (en) * 1993-10-18 1995-05-23 直江津電子工業株式会社 Carrier for polishing semiconductor wafers
JPH09155729A (en) * 1995-12-08 1997-06-17 Seiko Epson Corp Surface polishing plate and surface polishing device using it
JPH1110530A (en) * 1997-06-25 1999-01-19 Shin Etsu Handotai Co Ltd Carrier for both-sided polishing
JP2000015565A (en) * 1998-06-30 2000-01-18 Toshiba Ceramics Co Ltd Carrier
JP2001105303A (en) * 1999-10-04 2001-04-17 U T K Syst:Kk Double side polishing carrier

Also Published As

Publication number Publication date
KR20020005980A (en) 2002-01-18
SG99915A1 (en) 2003-11-27
TW544367B (en) 2003-08-01

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