JP6723788B2 - 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 - Google Patents
硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 Download PDFInfo
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- JP6723788B2 JP6723788B2 JP2016070278A JP2016070278A JP6723788B2 JP 6723788 B2 JP6723788 B2 JP 6723788B2 JP 2016070278 A JP2016070278 A JP 2016070278A JP 2016070278 A JP2016070278 A JP 2016070278A JP 6723788 B2 JP6723788 B2 JP 6723788B2
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- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 4
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- FYNROBRQIVCIQF-UHFFFAOYSA-N pyrrolo[3,2-b]pyrrole-5,6-dione Chemical compound C1=CN=C2C(=O)C(=O)N=C21 FYNROBRQIVCIQF-UHFFFAOYSA-N 0.000 description 1
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- KUAZQDVKQLNFPE-UHFFFAOYSA-N thiram Chemical compound CN(C)C(=S)SSC(=S)N(C)C KUAZQDVKQLNFPE-UHFFFAOYSA-N 0.000 description 1
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- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
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- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/10—Esters
- C08F20/12—Esters of monohydric alcohols or phenols
- C08F20/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F20/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/08—Homopolymers or copolymers of acrylic acid esters
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- Engineering & Computer Science (AREA)
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Polymerisation Methods In General (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
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| JP2016070278A JP6723788B2 (ja) | 2016-03-31 | 2016-03-31 | 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
| TW106101715A TWI726037B (zh) | 2016-03-31 | 2017-01-18 | 硬化性樹脂組成物、乾薄膜、硬化物及印刷電路板 |
| KR1020170039843A KR102315804B1 (ko) | 2016-03-31 | 2017-03-29 | 경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판 |
| CN201710203709.5A CN107272334B (zh) | 2016-03-31 | 2017-03-30 | 固化性树脂组合物、干膜、固化物和印刷电路板 |
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| WO2018123695A1 (ja) * | 2016-12-28 | 2018-07-05 | 太陽インキ製造株式会社 | 硬化性組成物、主剤および硬化剤、ドライフィルム、硬化物、および、プリント配線板 |
| CN109872642B (zh) * | 2017-12-04 | 2021-05-18 | 利亚德光电股份有限公司 | 小间距led显示模块及其制作方法 |
| JP7254511B2 (ja) * | 2018-03-28 | 2023-04-10 | 太陽インキ製造株式会社 | 感光性樹脂組成物、ドライフィルム、およびプリント配線板の製造方法 |
| JP7216480B2 (ja) * | 2018-03-29 | 2023-02-01 | 太陽インキ製造株式会社 | 光硬化性熱硬化性樹脂組成物及びドライフィルム及び硬化物ならびにプリント配線板 |
| JP7032977B2 (ja) * | 2018-03-30 | 2022-03-09 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品 |
| JP2019179223A (ja) * | 2018-03-30 | 2019-10-17 | 太陽インキ製造株式会社 | ドライフィルム、硬化物およびプリント配線板 |
| JP2019178305A (ja) * | 2018-03-30 | 2019-10-17 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、該組成物からなるドライフィルム、硬化物および該硬化物を有するプリント配線板 |
| CN108957954A (zh) * | 2018-08-03 | 2018-12-07 | 广东泰亚达光电有限公司 | 一种新型激光直描成像干膜及其制备方法 |
| JP7316071B2 (ja) * | 2019-03-18 | 2023-07-27 | 太陽ホールディングス株式会社 | 硬化性樹脂組成物、ドライフィルム、硬化物および電子部品 |
| WO2021091308A1 (ko) * | 2019-11-06 | 2021-05-14 | 주식회사 아모그린텍 | 방열 시트, 이의 제조방법 및 이를 포함하는 전자기기 |
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| JP2005115151A (ja) * | 2003-10-09 | 2005-04-28 | Mitsubishi Chemicals Corp | 光硬化性組成物、並びにそれを用いた光硬化性画像形成材料、光硬化性画像形成材、及び画像形成方法 |
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| JP2011197310A (ja) * | 2010-03-18 | 2011-10-06 | Fujifilm Corp | 硬化性組成物、並びに、これを用いた硬化性フィルム、硬化性積層体、永久パターン形成方法、及びプリント基板 |
| JP5857514B2 (ja) * | 2010-08-06 | 2016-02-10 | 日立化成株式会社 | 熱硬化性樹脂組成物、及びこれを用いたプリプレグ、積層板 |
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| WO2013171888A1 (ja) | 2012-05-17 | 2013-11-21 | 太陽インキ製造株式会社 | アルカリ現像型の熱硬化性樹脂組成物、プリント配線板 |
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| JP5809182B2 (ja) * | 2013-03-26 | 2015-11-10 | 株式会社タムラ製作所 | 感光性樹脂組成物 |
| CN103360724B (zh) * | 2013-07-02 | 2017-05-24 | 广东生益科技股份有限公司 | 一种热膨胀系数低的热固性树脂组合物、预浸料及覆金属箔板 |
| JP6359814B2 (ja) * | 2013-09-17 | 2018-07-18 | 太陽インキ製造株式会社 | 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
| KR101587360B1 (ko) * | 2013-09-27 | 2016-01-20 | 다이요 잉키 세이조 가부시키가이샤 | 경화성 수지 조성물, 드라이 필름, 경화물 및 디스플레이 부재 |
| CN106662813B (zh) * | 2014-06-12 | 2021-02-26 | 太阳油墨制造株式会社 | 固化性树脂组合物、干膜、固化物及印刷电路板 |
| JP6354665B2 (ja) * | 2014-06-23 | 2018-07-11 | 信越化学工業株式会社 | 光硬化性コーティング組成物及び被覆物品 |
| JP6495769B2 (ja) * | 2014-07-18 | 2019-04-03 | 株式会社日本触媒 | 硬化性樹脂組成物及びその用途 |
| JP5876182B1 (ja) * | 2014-09-30 | 2016-03-02 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、そのドライフィルムおよび硬化物、並びにこれを有するプリント配線板 |
| CN105440311B (zh) * | 2016-01-07 | 2018-02-27 | 深圳先进技术研究院 | 二氧化硅填料、二氧化硅填料的表面处理方法及环氧树脂复合材料 |
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| KR20170113347A (ko) | 2017-10-12 |
| JP2017181848A (ja) | 2017-10-05 |
| CN107272334B (zh) | 2022-03-25 |
| TW201807482A (zh) | 2018-03-01 |
| CN107272334A (zh) | 2017-10-20 |
| TWI726037B (zh) | 2021-05-01 |
| KR102315804B1 (ko) | 2021-10-22 |
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