JP6642609B2 - 半導体装置および半導体装置の製造方法 - Google Patents
半導体装置および半導体装置の製造方法 Download PDFInfo
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Description
特許文献1 特開2009−99705号公報
特許文献2 国際公開第2013/100155号パンフレット
Claims (28)
- 不純物がドープされた半導体基板を備え、
前記半導体基板は、
前記半導体基板の裏面側に配置され、ドナー濃度が2以上のピークを有するピーク領域と、
前記ピーク領域よりも表面側に配置され、ドナー濃度の分布が前記2以上のピークよりもなだらかな高濃度領域と、
前記高濃度領域よりも表面側に配置され、前記高濃度領域よりもドナー濃度が低い低濃度領域と
を有し、
前記ピーク領域は、前記ドナー濃度の前記2以上のピークに対応して、水素濃度の2以上のピークを有し、
前記ピーク領域の前記ドナー濃度は、前記ピーク領域の前記水素濃度より低く、
前記高濃度領域は、前記半導体基板の裏面側から表面側に向かって、前記ドナー濃度が増加し、且つ、前記水素濃度が減少する増加部を有し、
前記高濃度領域の前記水素濃度は、前記ピーク領域において最も前記高濃度領域側のピークの前記水素濃度より低い
半導体装置。 - 前記高濃度領域は、前記増加部よりも前記半導体基板の表面側に、前記半導体基板の裏面側から表面側に向かって前記ドナー濃度が減少する減少部を有する
請求項1に記載の半導体装置。 - 前記半導体基板は、ドリフト領域を有し、
前記低濃度領域は、前記ドリフト領域に含まれる
請求項1または2に記載の半導体装置。 - 前記高濃度領域の深さ方向における長さは、前記ピーク領域の深さ方向における長さよりも長い
請求項1から3のいずれか一項に記載の半導体装置。 - 前記高濃度領域におけるキャリアライフタイムは、前記低濃度領域におけるキャリアライフタイムよりも長い
請求項1から4のいずれか一項に記載の半導体装置。 - 前記低濃度領域にヘリウムが含まれる
請求項5に記載の半導体装置。 - 前記ピーク領域の前記ドナー濃度のピークとピークの間にヘリウムが含まれる
請求項1から4のいずれか一項に記載の半導体装置。 - 前記半導体基板は、トランジスタが形成されるトランジスタ領域と、ダイオードが形成されるダイオード領域とを有し、
前記ダイオード領域には、前記ピーク領域および前記高濃度領域が形成されており、
前記トランジスタ領域には、前記ピーク領域が形成され、且つ、前記高濃度領域が形成されていない
請求項1から7のいずれか一項に記載の半導体装置。 - 前記高濃度領域の深さ方向における長さが5μm以上である
請求項1から8のいずれか一項に記載の半導体装置。 - 前記高濃度領域における前記ドナー濃度の最大値は、前記低濃度領域における前記ドナー濃度の1.2倍以上である
請求項1から9のいずれか一項に記載の半導体装置。 - 前記2以上のピークのうち、最も表面側のピークのドナー濃度は5×1014/cm3より大きい
請求項1から10のいずれか一項に記載の半導体装置。 - 前記半導体基板がMCZ基板である
請求項1から11のいずれか一項に記載の半導体装置。 - 前記半導体基板における平均酸素濃度が1.0×1016/cm3以上、1.0×1018/cm3以下である
請求項1から11のいずれか一項に記載の半導体装置。 - 前記半導体基板は、前記半導体基板の表面から、前記高濃度領域または前記ピーク領域まで、深さ方向に延伸して形成された欠陥領域を更に備える
請求項1から13のいずれか一項に記載の半導体装置。 - 前記欠陥領域は、前記ピーク領域における前記ドナー濃度の前記ピークの間に注入されたヘリウムを含む
請求項14に記載の半導体装置。 - 前記欠陥領域は、前記ピーク領域における前記ドナー濃度のいずれかの前記ピークと深さ方向において同一の位置に注入されたヘリウムを含む
請求項14に記載の半導体装置。 - 前記半導体基板は、前記半導体基板の裏面から前記低濃度領域まで設けられた欠陥領域を更に備え、
前記欠陥領域の前記半導体基板の深さ方向における先端が、前記低濃度領域に配置されている
請求項1から13のいずれか一項に記載の半導体装置。 - 前記高濃度領域の深さ方向における長さが20μm以上である
請求項1から17のいずれか一項に記載の半導体装置。 - 前記ピーク領域における2以上のピークのうち最も前記高濃度領域側のピークと前記高濃度領域との境界におけるドナー濃度が、前記低濃度領域におけるドナー濃度よりも高い
請求項1から18のいずれか一項に記載の半導体装置。 - 前記ピーク領域において、前記ドナー濃度のピークのうち最も前記半導体基板の表面側のピークと、前記水素濃度のピークのうち最も前記半導体基板の表面側のピークとが、前記半導体基板の深さ方向において同一の位置に設けられている
請求項1から19のいずれか一項に記載の半導体装置。 - 半導体装置の製造方法であって、
半導体基板の裏面側からプロトンをドープする段階であって、前記半導体基板の裏面側に、ドナー濃度が2以上のピークを有し、前記ドナー濃度の前記2以上のピークに対応する水素濃度の2以上のピークを有し、且つ、前記ドナー濃度が前記水素濃度より低いピーク領域を形成する段階と、
前記半導体基板の深さ方向に延伸する欠陥領域を形成する段階と、
前記プロトンをドープする段階より後であって、且つ、前記欠陥領域を形成する段階より後に前記半導体基板をアニールする段階と
を備え、
前記アニールする段階において、前記プロトンをドープする段階における前記プロトンの飛程領域よりも奥に水素を拡散させることで、裏面側から表面側に向かって、前記ドナー濃度が増加し、且つ、前記水素濃度が減少する増加部を有し、且つ、前記ピーク領域において最も前記半導体基板の表面側のピークの前記水素濃度より低い水素濃度を有する高濃度領域を形成し、
前記半導体基板は、前記高濃度領域よりも表面側に配置され、前記高濃度領域よりもドナー濃度が低い低濃度領域を有する製造方法。 - 前記アニールする段階において、前記増加部よりも前記半導体基板の表面側に、前記半導体基板の裏面側から表面側に向かって前記ドナー濃度が減少する減少部を有する前記高濃度領域を形成する
請求項21に記載の製造方法。 - 前記欠陥領域を形成する段階において、前記半導体基板にヘリウムを注入する
請求項21または22に記載の半導体装置の製造方法。 - 前記欠陥領域を形成する段階において、前記半導体基板に、20kGy以上、1500kGy以下の電子線を照射する
請求項21または22に記載の半導体装置の製造方法。 - 前記欠陥領域を形成する段階において、前記半導体基板の表面または裏面から、前記半導体基板の予め定められた深さに欠陥生成物質を注入することで、前記半導体基板の表面または裏面から前記欠陥生成物質の注入位置まで延伸する前記欠陥領域を形成する
請求項21または22に記載の半導体装置の製造方法。 - 前記半導体基板は、トランジスタが形成されるトランジスタ領域と、ダイオードが形成されるダイオード領域とを有し、
前記欠陥領域を形成する段階において、前記トランジスタ領域の少なくとも一部をマスクして前記欠陥生成物質を注入する
請求項25に記載の半導体装置の製造方法。 - 前記ダイオード領域に前記ピーク領域および前記高濃度領域を形成し、
前記トランジスタ領域には、前記ピーク領域を形成し、且つ、前記高濃度領域を形成しない
請求項26に記載の半導体装置の製造方法。 - 前記プロトンのドープ量が1.0×1014/cm2以上である
請求項21から27のいずれか一項に記載の半導体装置の製造方法。
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