JP6560110B2 - 切削装置 - Google Patents

切削装置 Download PDF

Info

Publication number
JP6560110B2
JP6560110B2 JP2015233110A JP2015233110A JP6560110B2 JP 6560110 B2 JP6560110 B2 JP 6560110B2 JP 2015233110 A JP2015233110 A JP 2015233110A JP 2015233110 A JP2015233110 A JP 2015233110A JP 6560110 B2 JP6560110 B2 JP 6560110B2
Authority
JP
Japan
Prior art keywords
cutting
workpiece
chuck table
carry
axis direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015233110A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017103274A (ja
Inventor
聡 花島
聡 花島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2015233110A priority Critical patent/JP6560110B2/ja
Priority to TW105132911A priority patent/TWI691018B/zh
Priority to KR1020160158016A priority patent/KR102463660B1/ko
Priority to CN201611071041.5A priority patent/CN107030902B/zh
Publication of JP2017103274A publication Critical patent/JP2017103274A/ja
Application granted granted Critical
Publication of JP6560110B2 publication Critical patent/JP6560110B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
JP2015233110A 2015-11-30 2015-11-30 切削装置 Active JP6560110B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015233110A JP6560110B2 (ja) 2015-11-30 2015-11-30 切削装置
TW105132911A TWI691018B (zh) 2015-11-30 2016-10-12 切削裝置
KR1020160158016A KR102463660B1 (ko) 2015-11-30 2016-11-25 절삭 장치
CN201611071041.5A CN107030902B (zh) 2015-11-30 2016-11-28 切削装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015233110A JP6560110B2 (ja) 2015-11-30 2015-11-30 切削装置

Publications (2)

Publication Number Publication Date
JP2017103274A JP2017103274A (ja) 2017-06-08
JP6560110B2 true JP6560110B2 (ja) 2019-08-14

Family

ID=59018191

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015233110A Active JP6560110B2 (ja) 2015-11-30 2015-11-30 切削装置

Country Status (4)

Country Link
JP (1) JP6560110B2 (zh)
KR (1) KR102463660B1 (zh)
CN (1) CN107030902B (zh)
TW (1) TWI691018B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7045841B2 (ja) * 2017-12-08 2022-04-01 株式会社ディスコ 切削装置
JP7032122B2 (ja) * 2017-12-22 2022-03-08 株式会社ディスコ 切削装置
CN108573905B (zh) * 2018-04-14 2020-12-01 芜湖拓达电子科技有限公司 一种半导体元件清洗设备及其使用方法
JP7165510B2 (ja) * 2018-05-25 2022-11-04 株式会社ディスコ 搬送用治具及び交換方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4339452B2 (ja) * 1999-07-09 2009-10-07 株式会社ディスコ Ｃｓｐ基板分割装置
JP4616969B2 (ja) * 2000-06-16 2011-01-19 株式会社ディスコ 切断機
JP2002359211A (ja) * 2001-05-30 2002-12-13 Disco Abrasive Syst Ltd 切削機
TWI272673B (en) * 2001-11-21 2007-02-01 Disco Corp Cutting machine
JP4532895B2 (ja) * 2003-12-18 2010-08-25 株式会社ディスコ 板状物の切削装置
KR20060029927A (ko) * 2004-10-04 2006-04-07 삼성전자주식회사 복수의 소잉 블레이드를 갖는 반도체 소잉 장치
JP4571851B2 (ja) * 2004-11-30 2010-10-27 株式会社ディスコ 切削装置
JP4813855B2 (ja) * 2005-09-12 2011-11-09 株式会社ディスコ 切削装置および加工方法
DE102007050471A1 (de) * 2007-10-23 2009-04-30 MAPAL Fabrik für Präzisionswerkzeuge Dr. Kress KG Werkzeug zur spanenden Bearbeitung von Werkstücken
US8116893B2 (en) * 2007-11-19 2012-02-14 Tokyo Seimitsu Co., Ltd. Dicing method
JP5026235B2 (ja) * 2007-11-29 2012-09-12 キヤノンマシナリー株式会社 基板切断装置
JP5420226B2 (ja) * 2008-11-07 2014-02-19 アピックヤマダ株式会社 切断装置
JP5386276B2 (ja) * 2009-09-02 2014-01-15 株式会社ディスコ 切削装置
JP5406676B2 (ja) * 2009-11-10 2014-02-05 株式会社ディスコ ウエーハの加工装置
JP5619559B2 (ja) * 2010-10-12 2014-11-05 株式会社ディスコ 加工装置
JP2013008823A (ja) * 2011-06-24 2013-01-10 Disco Abrasive Syst Ltd 切断装置
JP5947010B2 (ja) * 2011-09-15 2016-07-06 株式会社ディスコ 分割装置
JP5785069B2 (ja) * 2011-12-05 2015-09-24 株式会社ディスコ 切削装置
JP6214901B2 (ja) * 2013-04-04 2017-10-18 株式会社ディスコ 切削装置
JP6441737B2 (ja) * 2015-04-28 2018-12-19 株式会社ディスコ 切削装置

Also Published As

Publication number Publication date
CN107030902A (zh) 2017-08-11
TW201727820A (zh) 2017-08-01
JP2017103274A (ja) 2017-06-08
KR20170063379A (ko) 2017-06-08
CN107030902B (zh) 2020-05-26
TWI691018B (zh) 2020-04-11
KR102463660B1 (ko) 2022-11-03

Similar Documents

Publication Publication Date Title
JP6679157B2 (ja) 加工装置の搬送機構
JP4571851B2 (ja) 切削装置
JP4841939B2 (ja) 半導体ウェハの加工装置
JP6560110B2 (ja) 切削装置
JP6441737B2 (ja) 切削装置
JP6218600B2 (ja) 加工装置
JP5785069B2 (ja) 切削装置
JP2001007058A (ja) 切削装置
JP4813855B2 (ja) 切削装置および加工方法
KR102402403B1 (ko) 절삭 장치
JP6242603B2 (ja) ウエーハ加工装置
JP5179928B2 (ja) ウエーハの搬出方法
JP6329813B2 (ja) 搬送ロボット
JP2016219528A (ja) 加工装置
KR20180113165A (ko) 절삭 장치
JP4763398B2 (ja) 切削装置
TW201830559A (zh) 加工裝置的搬運機構
JP2012175022A (ja) ウエーハ加工装置
JP2005051094A (ja) 切削装置
JP6208587B2 (ja) 切削装置
JP2011125988A (ja) 研削装置
JP4731265B2 (ja) 切削装置
JP6084115B2 (ja) 加工装置
KR102619218B1 (ko) 절삭 장치
JP5841798B2 (ja) 研削装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20180928

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20190613

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20190625

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20190718

R150 Certificate of patent or registration of utility model

Ref document number: 6560110

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250