JP6512632B2 - 異方性接続構造体及び異方性接続構造体の製造方法 - Google Patents

異方性接続構造体及び異方性接続構造体の製造方法 Download PDF

Info

Publication number
JP6512632B2
JP6512632B2 JP2015058069A JP2015058069A JP6512632B2 JP 6512632 B2 JP6512632 B2 JP 6512632B2 JP 2015058069 A JP2015058069 A JP 2015058069A JP 2015058069 A JP2015058069 A JP 2015058069A JP 6512632 B2 JP6512632 B2 JP 6512632B2
Authority
JP
Japan
Prior art keywords
electrode
flexible substrate
bump
anisotropic
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015058069A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016178226A (ja
JP2016178226A5 (enExample
Inventor
康二 江島
康二 江島
堅一 平山
堅一 平山
裕美 久保出
裕美 久保出
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2015058069A priority Critical patent/JP6512632B2/ja
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to KR1020177024610A priority patent/KR102092615B1/ko
Priority to CN201680014091.1A priority patent/CN107409467B/zh
Priority to PCT/JP2016/056610 priority patent/WO2016152441A1/ja
Priority to HK18104097.4A priority patent/HK1244994B/zh
Priority to TW105107194A priority patent/TWI708413B/zh
Publication of JP2016178226A publication Critical patent/JP2016178226A/ja
Publication of JP2016178226A5 publication Critical patent/JP2016178226A5/ja
Application granted granted Critical
Publication of JP6512632B2 publication Critical patent/JP6512632B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2015058069A 2015-03-20 2015-03-20 異方性接続構造体及び異方性接続構造体の製造方法 Active JP6512632B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2015058069A JP6512632B2 (ja) 2015-03-20 2015-03-20 異方性接続構造体及び異方性接続構造体の製造方法
CN201680014091.1A CN107409467B (zh) 2015-03-20 2016-03-03 各向异性连接构造体
PCT/JP2016/056610 WO2016152441A1 (ja) 2015-03-20 2016-03-03 異方性接続構造体
HK18104097.4A HK1244994B (zh) 2015-03-20 2016-03-03 各向异性连接构造体
KR1020177024610A KR102092615B1 (ko) 2015-03-20 2016-03-03 이방성 접속 구조체
TW105107194A TWI708413B (zh) 2015-03-20 2016-03-09 各向異性連接構造體及各向異性連接構造體之製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015058069A JP6512632B2 (ja) 2015-03-20 2015-03-20 異方性接続構造体及び異方性接続構造体の製造方法

Publications (3)

Publication Number Publication Date
JP2016178226A JP2016178226A (ja) 2016-10-06
JP2016178226A5 JP2016178226A5 (enExample) 2018-03-15
JP6512632B2 true JP6512632B2 (ja) 2019-05-15

Family

ID=56977307

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015058069A Active JP6512632B2 (ja) 2015-03-20 2015-03-20 異方性接続構造体及び異方性接続構造体の製造方法

Country Status (5)

Country Link
JP (1) JP6512632B2 (enExample)
KR (1) KR102092615B1 (enExample)
CN (1) CN107409467B (enExample)
TW (1) TWI708413B (enExample)
WO (1) WO2016152441A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI845515B (zh) * 2018-06-06 2024-06-21 日商迪睿合股份有限公司 連接體、連接體之製造方法、連接方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6621766B2 (en) * 2001-08-01 2003-09-16 Fossil, Inc. Flexible timepiece in multiple environments
JP3910527B2 (ja) 2002-03-13 2007-04-25 シャープ株式会社 液晶表示装置およびその製造方法
JP4389447B2 (ja) * 2003-01-28 2009-12-24 セイコーエプソン株式会社 電気光学装置の製造方法
JP2006278637A (ja) * 2005-03-29 2006-10-12 Sharp Corp 基板実装構造および表示装置
WO2008047619A1 (en) * 2006-10-18 2008-04-24 Nec Corporation Circuit substrate device and circuit substrate module device
JP2008165219A (ja) 2006-12-08 2008-07-17 Bridgestone Corp フレキシブルドライバｉｃ
JP5039427B2 (ja) 2007-05-08 2012-10-03 株式会社ブリヂストン フレキシブルドライバｉｃの実装方法およびフレキシブルドライバｉｃ
JP2008281638A (ja) 2007-05-08 2008-11-20 Bridgestone Corp フレキシブルドライバｉｃの実装方法およびそれに用いるフレキシブルドライバｉｃ
KR101878251B1 (ko) * 2011-04-08 2018-07-13 삼성전자주식회사 굽힘 감지 센서 및 그를 제조하는 방법
TWI547369B (zh) * 2011-05-27 2016-09-01 康寧公司 玻璃塑膠積層之裝置、處理線、及方法
JP5508480B2 (ja) * 2011-07-06 2014-05-28 積水化学工業株式会社 異方性導電ペースト、接続構造体及び接続構造体の製造方法
JP5887790B2 (ja) * 2011-09-21 2016-03-16 ソニー株式会社 表示装置および電子機器
US8780568B2 (en) * 2011-12-28 2014-07-15 Panasonic Corporation Flexible display device
JP5910106B2 (ja) * 2012-01-23 2016-04-27 大日本印刷株式会社 タッチパネルモジュールおよびタッチパネル付表示装置
JP2013160942A (ja) * 2012-02-06 2013-08-19 Sony Corp 半導体装置およびその製造方法、並びに電子機器
JP2013210491A (ja) * 2012-03-30 2013-10-10 Sony Corp 表示装置および電子機器
KR101889008B1 (ko) * 2012-06-11 2018-08-20 삼성전자주식회사 플렉서블 디스플레이 장치 및 그 제어 방법
US8960899B2 (en) * 2012-09-26 2015-02-24 Google Inc. Assembling thin silicon chips on a contact lens
EP2743785B1 (fr) * 2012-12-17 2014-12-17 The Swatch Group Research and Development Ltd. Dispositif électronique portable flexible
US9348362B2 (en) * 2013-02-08 2016-05-24 Samsung Electronics Co., Ltd. Flexible portable terminal
CN109375710A (zh) * 2013-05-22 2019-02-22 松下知识产权经营株式会社 可穿戴设备
JP3193457U (ja) * 2014-07-24 2014-10-02 双葉電子工業株式会社 有機ｅｌ表示素子

Also Published As

Publication number Publication date
TWI708413B (zh) 2020-10-21
WO2016152441A1 (ja) 2016-09-29
JP2016178226A (ja) 2016-10-06
CN107409467A (zh) 2017-11-28
KR102092615B1 (ko) 2020-03-24
HK1244994A1 (zh) 2018-08-17
KR20170113621A (ko) 2017-10-12
CN107409467B (zh) 2019-08-06
TW201637260A (zh) 2016-10-16

Similar Documents

Publication Publication Date Title
JP6380591B2 (ja) 異方導電性フィルム及び接続構造体
JP5974147B1 (ja) 配線体アセンブリ、導体層付き構造体、及びタッチセンサ
KR101857331B1 (ko) 이방성 도전 필름, 이방성 도전 필름의 제조 방법, 접속체의 제조 방법 및 접속 방법
JP3910527B2 (ja) 液晶表示装置およびその製造方法
JP6324746B2 (ja) 接続体、接続体の製造方法、電子機器
JP2019197900A (ja) 接続体、接続体の製造方法、電子部品の接続方法、及び電子部品
TWI434383B (zh) 電性連接墊結構及包含有複數個電性連接墊結構的積體電路
CN108476591B (zh) 连接体、连接体的制造方法、检测方法
CN106797080A (zh) 各向异性导电膜及连接结构体
WO2015076234A1 (ja) 異方導電性フィルム及び接続構造体
WO2016152543A1 (ja) 異方性導電接続構造体、異方性導電接続方法、及び異方性導電接着剤
CN106318244A (zh) 核层技术异方性导电胶膜
JP6512632B2 (ja) 異方性接続構造体及び異方性接続構造体の製造方法
KR102573777B1 (ko) 접착제 조성물 및 접속체의 제조 방법
CN1653484A (zh) Rfid标签
HK1244994B (zh) 各向异性连接构造体
JP2009135447A (ja) 回路接続方法
JP2017130525A (ja) 異方性導電接続構造体、表示装置、および異方性導電接続方法
JP6106366B2 (ja) 異方性導電材料を用いた接続方法
JP6457214B2 (ja) 電子部品、接続体、接続体の製造方法及び電子部品の接続方法
TW200840438A (en) Electrical connecting structure and method
KR20130090208A (ko) 본딩 패드 구조체 및 복수의 본딩 패드 구조체를 포함하는 집적 회로
JP2017182708A (ja) 異方性導電接続構造体

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180129

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20180129

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20181002

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20181102

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20190208

TRDD Decision of grant or rejection written
RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20190315

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20190319

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20190322

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20190404

R150 Certificate of patent or registration of utility model

Ref document number: 6512632

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250