TW200840438A - Electrical connecting structure and method - Google Patents

Abstract

An electrical connecting structure and method are disclosed. The electrical connecting structure comprises a first electrical contact, a second electrical contact and a bonding layer. The second electrical contact has a pointed end structure. The bonding layer is formed between the first electrical contact and the second electrical contact for bonding the first electrical contact and the second electrical contact, wherein the pointed end structure of the second electrical contact passes through the bonding layer and contacts with the first electrical contact for forming electrically connecting.

Description

200840438 IX. Description of the Invention: [Technical Field] The present invention relates to an electrical connection structure and method, and in particular to an electrical connection structure capable of forming unidirectional electrical conduction and joint fixation = Method 0 [Previous Technology] With the continuous development of the information and communication industry, the market for liquid crystal displays (liquid portals; LCD) has flourished. LCD display has the advantages of high quality, small size, light weight, low driving voltage, and low power consumption. Therefore, it is widely used in personal digital assistants (p(10) - assis; PDA), mobile phones, video recording Consumer communications or electronic products such as computers, notebook computers, desktop displays, car H, and projection TVs. Coupled with the rapid advancement of the integrated circuit (IC) industry and liquid crystal display manufacturing technologies, these consumer communications or electronic products are also moving toward light, thin, short, and small trends. Especially in terms of computer products, in addition to the south performance, 1% speed desktop computer, the portable notebook computer is greatly concerned and valued. In the field of process applications for manufacturing liquid crystal display screens, many complicated manufacturing processes are involved. Generally, liquid crystal display screens are connected by a plurality of liquid crystal display driving chips (LCD chips) and peripheral driving and control circuits. Formed on a glass substrate, each liquid crystal display screen has a plurality of liquid crystal display driving wafers, and the contact pads on the wafer must be properly aligned and bonded with the wires on the glass substrate, and Provides good electrical conductivity so that the liquid crystal display screen can be transmitted by a good signal to display the correct image of 200840438. In order to achieve the above alignment and conductive characteristics, many bonding methods have been developed, among which are many commonly used methods such as Tape Automated Bonding (TAB). , Chip On Glass (COG) and Chip On Film (COF). In addition to being applicable to the process of liquid crystal display screens, the above methods can also be applied to a variety of different wafers to bond the wafers onto a circuit board or other conductive lines. Taking the TAB technology as an example, the TAB technology is used to connect the driving 1C to the contact pads located in the liquid crystal display panel, and an anisotropic conductive film is attached between the contact pads and the driving 1C (Anisotropic Conductive Film; ACF), electrically connected to the structure contact pad and drive 1C. Among them, the anisotropic conductive film is a film layer containing an adhesive resin material and conductive particles, and has a function of unidirectional conduction and adhesion fixation. However, the cost of ACF is quite expensive. And the conductive particles in the ACF play a key role in vertical conduction. When the number of conductive particles in the ACF is larger or the volume of the conductive particles is larger, the contact resistance in the vertical direction is smaller, and better conductivity can be obtained. . However, excessive or excessively large conductive particles may cause a contact connection between the lateral electrodes during the pressing process, resulting in a short-circuit condition of lateral conduction. As the pitch of the driver 1C continues to shrink, the spacing of the lateral foot electrodes is also narrower, which increases the possibility of ACF lateral short circuit. In addition, when the pitch of the driving 1C is very small, the alignment accuracy in the vertical direction needs to be quite accurate to form a vertical conduction and avoid a lateral short circuit. Therefore, when the pitch of the driving ic continues to shrink, the 200840438 B shou 'hunting by the ACF to carry out the vertical phase of the animal: 奎社 is a relatively difficult connection for the 仃1 direct connection [invention] mouth, the present invention The aspect is to provide an electrical connection between the electrical connection structure and the method to form a unidirectional electrical connection between the two electrical contacts, and the replacement is based on providing an electrical connection structure, thereby causing lateral A short circuit condition that is turned on. That is to say, the cost of reading and the avoidance of the benefits are also provided in the "electrical connection structure", in order to make electrical connection in the process of ... (4) In an embodiment of the present invention, the electrical connection structure of the present invention comprises at least: a young electrical contact, a second electrical contact, and an adhesive layer. At the second point, the contact (four) structure is integrally formed on the second electrical contact to form an electrical connection. The first and second electrical contacts are formed on the first electrical contact and the second electrical contact. </ RTI> used to bond the first electric, _ the embodiment of the invention, the electrical connection method of the present invention. Provide a first electrical contact; form a riding layer on the first electric = second electrical contact to meet [Electrical contact setting, first · = at least - protruding structure, and protruding structure - body forming Ai: electrical contact; with fen_ ^ - μ. ^ ^ make the second electrical contact The structure penetrates the adhesive layer and contacts the first electrical contact to form an electrical connection. Through-and-connection: Forming a single _, 疋, and 无法 鬲 的 的 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 2008 [Embodiment] Referring to Figure 1, there is shown a cross-sectional view of an electrical connection structure in accordance with a first embodiment of the present invention. The electrical connection structure of this embodiment can be used as a unidirectional electrical conduction and joint fixation between two electrical contacts, and can be applied to a process in which high-temperature lead-tin soldering cannot be performed, for example, grain glass bonding ( Chip On Glass; COG), Tape Automated Bonding (TAB), Chip On Film (COF) or Chip On Board (COB); or, in this embodiment The electrical connection structure is used for, for example, a printed circuit board (PCB), a printed-circuit board assembly (PCBA), a flexible printed circuit board (Flexible Printed)

Circuit connection; FPC), plastic substrate (Plastic Substrate), IC (Integrated Circuit) chip or liquid crystal display panel (Liquid Crystal Display Panel) line connection. The electrical connection structure 1 of the present embodiment includes a first electrical contact 110, a first electrical contact 120, and an adhesive layer 130. The second electrical contact 12 has at least one protruding structure 121, preferably a pointed protruding structure, for penetrating the adhesive layer 130 to contact the first electrical contact 110 to form an electrical connection, and at the same time The first electrical contact 11 〇 and the second electrical contact 120 are bonded by the adhesive layer 130, wherein the protruding structure 121 is integrally formed on the second electrical=point. Therefore, a fixed and unidirectional electrical connection can be formed between the first electrical contact 110 and the second electrical contact 12A. ^ Please refer to FIG. 2, which illustrates the application of the electrical connection structure of the first embodiment to the liquid crystal display panel according to the present invention. . For example, when the driving circuit assembly of the liquid crystal display panel is performed by using the COG technology, the electrical connection structures 1 and 100b of the present embodiment are formed in the peripheral circuit region 21 of the liquid crystal display panel 200. The driving 1C wafer 220 and the flexible circuit board 230 are electrically connected to the thin film transistor (TFT) array substrate 240, respectively. At this time, the second electrical contact 12 having the protruding structure 121 of the embodiment is provided. The germanium may be formed on the driver IC wafer 220 and the flexible circuit board 230; or formed on the thin film transistor array substrate. However, the present invention is not limited thereto. Other processes may also use the electrical connection structure 100 of the embodiment. For example, an OLB (Outer Lead Bonding) process connected to the LCD in a TCP/COF package, driving an ic chip followed by TCP (Tape carrier package) ) /COF carrier board (not shown) ILB (Inner Lead Bonding) process or TAP and PCBA electrical connection. As shown in FIG. 1 , the first electrical contact 110 and the second electrical contact 120 of the embodiment are used for electrical connection, such as conductive bumps, electrodes, circuit ends or leads. Foot (Lead). The material of the first electrical contact 11 〇 and the first electrical contact 120 is, for example, silver, gold, platinum, palladium, nickel, tungsten, copper, cadmium, oxidized, tin, tin oxide, indium tin oxide ( IT〇), molybdenum, niobium, money or alloy materials thereof, wherein the first electrical contact 11 〇 and the second electrical contact 120 may be formed on a surface of an electronic component, a circuit board or a substrate, for example: printing Circuit board, electronic printed circuit board assembly, flexible printed circuit board, plastic substrate, tape (Tape), glass substrate, Tcp carrier board, c〇F carrier board, bare chip drive a 曰 film or liquid crystal display panel. The protruding structure 121 of the second electrical contact 12 of the embodiment is formed on the surface of the second electrical contact 12G, and corresponds to the first electrical contact UG. The protruding structure 本2ι of this embodiment is, for example, a polygonal protruding structure for piercing the adhesive layer m to contact the first electrical connection 200840438 to form an electrical connection, wherein the protruding structure 121 can be, for example, developed by etching or laser. Etching to form. The material of the adhesive layer 130 is, for example, a thermosetting or thermoplastic plastic insulating material, such as a resin adhesive, which is formed between the first electrical contact 110 and the second electrical contact 120 to bond and fix the first electrical connection. Point 110 and second electrical contact 120. As shown in FIG. 1, when the electrical connection method of the present embodiment is performed, first, the first electrical contact 110 is provided. Next, an adhesive layer 13 is formed on the first electrical contact 110, and the adhesive layer 130 is formed, for example, by coating. Next, a second electrical contact 12G is provided, wherein the second electrical contact i2G has a protruding structure 121. Next, the protruding structure ΐ2ι of the second electrical contact 12〇 is passed through the adhesive layer 13 0 ′ and is in contact with the first electrical connection ‘point! 1〇, by forming an electrical connection and bonding the first electrical contact 11〇 and the first electrical contact 12G by the adhesive layer 130, the electrical connection structure 1本 of the present embodiment is completed. Wherein, when the material of the adhesive layer 130 is, for example, a thermosetting adhesive material, after the protruding structure 121 of the second electrical contact 12 contacts the first electrical contact, the heating and pressurizing steps may be performed to further The adhesive layer 13() is cured to firmly bond the first electrical contact 1 and the second electrical contact 12A. The electrical connection structure and method of the present invention can have the function of unidirectional electrical conduction = joint fixation, and can be applied to the course of high temperature (four) welding. In addition, since the electrical connection structure of the present embodiment does not require the use of an electrically conductive film to electrically connect, it can replace the anisotropic conductive film and can save the cost of the anisotropic conductive film. Furthermore, when the lateral spacing of the electrical contacts (e.g., the pitch of the drive K:) is reduced, the electrical connection structure (10) of the present embodiment can avoid the short circuit caused by the conduction. Please refer to FIG. 3, which is a cross-sectional view showing the structure of an electrical 200840438 according to a second embodiment of the present invention. In the following, the present embodiment and the embodiment of the first embodiment are described. For the similarity, the second electrical contact of the electrical connection structure 300 of the embodiment is not described herein. I:! is the material hardness) is higher than the first electrical contact 3H) SO: /): If the material of the first electrical connection 'point 310 is silver (hardness is about 50 22 electrical contacts) The material of 320 is copper (hardness is about ~ 〇 ^ 0 ' because the hardness of copper is higher than silver ' and thus the second electrical contact 32 〇 =, , . . . 321 (for example, the central end protruding structure) has penetrated The adhesive layer (4) is inserted into the first electrical contact 31°. Therefore, the bonding structure of the second embodiment can further form a better electrical conduction effect and a stable connection diagram to show the third implementation according to the present invention. For example, the electrical conductivity = the cross-section of the structure m is only described in the context of the present embodiment and the first embodiment, and the description is not repeated here. Compared with the first spring embodiment, the third implementation For example, the electrical connection structure is completely connected to the second electrical contact 4, and the second structure 421 is a mineral-toothed protruding structure, thereby penetrating through the adhesive layer 430:: to the other electrical contact 41〇 'The adhesive layer 4 is bonded to the second contact 4') and the second electrical contact is fine. Therefore, the electrical connection structure of the embodiment can have the effects of unidirectional electrical conduction and joint splicing. Figure 5 is a cross-sectional view of the electrician connection structure according to the fourth embodiment of the present invention. The following is only a description of the differences between the present embodiment and the first embodiment, and the description of the similarities will not be repeated here. Compared with the second electrical contact structure of the first embodiment, the second electrical contact 52 of the fourth embodiment has a structure 521 system-pyramid-shaped protruding structure, and the protruding structure 521 is 52_ The apex is not completely sharp, and has a micro-plane to increase the contact area of the 200840438 structure 521 with the first electrical contact 51, so that the first electrical contact 51 and the second electrical connection can be raised. Electrical conduction of point 52 = = fruit. Because of =, the protruding structure 521 of this embodiment can penetrate the adhesive layer 53 〇 to contact the first electrical contact 51Q, and adhere the first electrical property by the adhesive layer 53G Contact 5H) and second electrical contact 52〇, thereby forming an electrical connection and connection

The δ month refers to the sixth ®, which shows a cross-sectional view (4) of the electrical connecting structure according to the fifth embodiment of the present invention. In the following, only the embodiment of the present embodiment and the first embodiment are carried out, and the following is not repeated here. The first electrical contact (10) has at least a protruding structure 61 and the second electrical contact 620 has at least one protruding structure 62. The protruding structure 611 is compared with the first embodiment. The adhesive layer (4) penetrates through the adhesive layer (4) to contact the second electrical contact 62G' and the protruding structure 621 penetrates the adhesive layer (4) to contact the first electrical point _. Therefore, the fifth complementary electrical connection structure 600 can have the effects of unidirectional electrical conduction and joint fixation. Referring to Figure 7, there is shown a cross-sectional view of the electrical connection structure in accordance with a sixth embodiment of the present invention. The following is only for the present embodiment and the fifth embodiment: (4), and the similarities are not described herein again. Compared with the fifth pain 2 'the electrical connection structure of the sixth embodiment, the dog-out of the electrical contact ^, the structure 711 corresponds to the protruding junction of the second electrical contact 72G, Further, the electrical 7-pass and bonding between the first electrical contact 71G and the second electrical contact are increased. Therefore, the protrusions 711 and the second electrical contacts 72 of the first electrical point 710 of the embodiment can penetrate each other through the adhesive layer 730 to form a unidirectional electrical connection and the implementation of the present invention described above. For example, the electrical connection structure of the present invention and the method of 200840438 can form a unidirectional electric (four) pass and joint fixation, and can be used in a process of high-temperature mis-tin soldering, so that the anisotropic conductive film can be substituted for electrical properties. Connections to save material costs and avoid short-circuit situations where lateral conduction occurs. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to be used in the present invention, and the present invention can be modified and retouched without departing from the spirit of the invention. The scope of protection shall be subject to the definition of the scope of the patent attached to the attached towel. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; A schematic cross-sectional view of an electrical connection. Fig. 2 is a top plan view showing the structure of a driving circuit applied to a liquid crystal display panel according to a first embodiment of the present invention. Fig. 3 is a cross-sectional view showing the Wei-connected structure of the second embodiment of the present invention. Fig. 4 is a schematic cross-sectional view showing the electrical connection structure of the third embodiment of the present invention. Figure 5 is a cross-sectional view showing an electrical connection structure in accordance with a fourth embodiment of the present invention. Figure 6 is a cross-sectional view showing an electrical connection structure in accordance with a fifth embodiment of the present invention. Figure 7 is a cross-sectional view showing the electrical connection structure in accordance with a sixth embodiment of the present invention. 13 200840438 [Description of main component symbols]

100, 100a, 100b: electrical connection structure 110: first electrical contact 120: 121: protruding structure 130: 2 液晶. liquid crystal display panel 210: 220: driver IC wafer 230: 240: thin film transistor array substrate 300 : Electrical connection structure 310 : 320 : second electrical contact 321 : 330 : adhesive layer 400 : electrical connection structure 410 : 420 : second electrical contact 421 · · 4 3 0 · adhesive layer 500 : electrical Connection structure 510: 520 · Second electrical contact 521 : 521a : Top 530 600 : Electrical connection structure 610 620 : Second electrical contact 621 630 : Adhesive layer 700 : Electrical connection structure 710 720 · Second electric Sex contact 721 730: adhesive layer second electrical contact adhesive layer peripheral circuit area flexible circuit board first electrical contact protruding structure first electrical contact protruding structure first electrical contact protruding structure: adhesive layer: The first electrical contact: protruding structure: the first electrical contact • the dog out structure 14

Claims (1)

200840438 X. Patent application scope: 1 · An electrical connection technology gentleman connection structure, at least one first electrical contact; 匕3. A second electrical contact, with a modern body formed in the a second electrically conductive structure </ RTI> wherein the protruding structure is formed to form an electrical connection, and is in contact with the first electrical contact, and an adhesive layer is formed in the first Thai The first electrical contact is formed on the first electronic component by bonding the first electrical contact and the electrical contact of the first electrical contact. 3. The electrical connection structure of claim 2, wherein the first electronic component is selected from the group consisting of a printed circuit board (1&gt; 14114 (1 (^(^^13(^1^; 1) (::]8), Printed-Circuit Board Assembly (PCB A), Integrated Circuit, Thin Film Transistor (TFT) Array Substrate, Tape and Reel (Tape), flexible printed circuit board (FPC), plastic substrate (Plastic Substrate) and liquid crystal display panel (Liquid Crystal Display Panel). 4 · As described in the scope of claim 1 The electrical connection structure, wherein the second electrical contact is formed on a second electronic component. 15 200840438 5. The electrical connection structure of claim 4, wherein the second electronic component is selected from the group consisting of Printed circuit board (PCB), printed circuit board assembly (PCB A), integrated circuit (Integrated Circuit) wafer, thin film transistor (TFT) array substrate, volume (Tape), flexible printed circuit board (FPC), plastic substrate (piastic substrate) - and liquid crystal display panel (Liquid Crystal Display Panel). 6 · As described in the scope of the patent application The electrical connection structure, wherein the first electrical contact is selected from the group consisting of a conductive bump, an electrode, a circuit end, and a lead. 7. As described in claim 1 An electrical connection structure, wherein the second electrical contact is selected from the group consisting of conductive bumps, Rays; ^ ^ ^ &lt; (2) W-shoulder electrode, circuit end and lead (Lead) . 8. If you apply for a patent scope! The electrical connection structure of the item, wherein the material of the first electrical contact is selected from the group consisting of silver, gold, surface m, copper, copper, tin oxide, tin, tin oxide, indium tin oxide (ATQ) mu alloy. a group of people. 9. The material of the second electrical contact as described in claim 1 is selected from the group consisting of silver, gold, and a planar connection structure, wherein the woven, oxidized, tin, tin oxide, indium tin oxide (I) Q&gt;, indium, bismuth, antimony and its 16 200840438 alloys are composed of one group.] 〇·If the patent application scope 哕筮-Ray/4 pull machine item described in the electrical connection structure, and in the brother-new The protruding structure of the joint is a triangular protruding structure.... Let the electric connection of the first electric unit (4) 1 item, the electric contact of the younger in the basin (4) the protruding structure system - the mineral toothed protruding structure α: Please refer to the t-shaped connection structure described in the patent specification (4). The protruding structure of the sexual contact is a pyramid-shaped protruding structure, and the top end of the card has a minute plane. Μ 13. The electrical connection of the second electrical contact as described in the scope of claim 4 is formed by a development process. /4. Please ask for the scope of patents! In the electrical connection structure of the item, the protruding structure of the second electrical contact in the basin is formed by a laser rice etching process. The electrical connection structure of claim i, wherein the material of the adhesive layer is an insulating rubber material. The electrical connection structure of claim i, wherein the protruding structure of the first electrical contact is inserted into the first electrical contact. Π· The electrical connection structure of claim i, wherein 17 200840438 is the material of the first electrical contact, the material hardness of the second electrical contact is high hardness 18. As claimed in the patent scope ! The first electrical contact has at least a protruding structure: wherein the protruding structure penetrates the adhesive layer to contact the electrical connection structure of the item 18, wherein the protrusion of the point, 1(4) The junction should be made of two electrical connections. The electrical connection method includes at least: providing a first electrical contact; T-adhesive layer on the first electrical contact; The contact is disposed relative to the first electrical contact, and is integrally connected to have a at least-protruding structure, the protruding structure, 31 is on the second electrical contact, and a layer, and The protruding structure contacting the third electrical contact penetrates the adhesive-electrical contact to form an electrical connection. The electrical connection method according to claim 20, wherein the electrical-contact is formed on the first electronic component. /, Zhongyi, as described in claim 21, the electrical connection method described in the scope of the patent, the first soap in 7G pieces of Sun △,, &amp; free printed circuit board (Printed circuit b0ard; 18 200840438 PCB), electronic printing Printed-Circuit Board Assembly (PCBA), Integrated Circuit, Thin Film Transistor (TFT) Array Substrate, Tape (Tape), Flexible Printed Circuits (Flexible Printed Circuits) ; FPC), plastic substrate (Plastic Substrate) and liquid crystal display panel (Liquid Crystal Display Panel). The electrical connection method of claim 20, wherein the second electrical contact is formed on a second electronic component. 6 24. The electrical connection as described in claim 23 The second electronic component is selected from the group consisting of a printed circuit board (PCB), a printed circuit board assembly (PCB A), an integrated circuit chip, and a thin film transistor. (Thin Film Transistor; TFT) array substrate, tape (Tape), flexible printed circuit board (FPC), plastic substrate (Plastic Substrate) and liquid crystal display panel (Liquid Crystal Display Panel). The electrical connection method of claim 20, wherein the first electrical contact is selected from the group consisting of a conductive bump, an electrode, a circuit end, and a lead. The electrical connection method of claim 20, wherein the second electrical contact is selected from the group consisting of a conductive bump, an electrode, a circuit end, and a lead leg 19 ----- 200840438 (Lead) The composition of the group. 27' The method of claiming the first electrical contact as described in claim 2, wherein the material of the funeral point is selected from the group consisting of silver, gold, turn, and '铱, 锗 and its cadmium, A group consisting of cadmium oxide, tin, antimony, nickel, tungsten, steel, emulsified tin, indium tin oxide (ITO), and niobium alloy. Declaring the electrical property described in Item 20 of the patent circumference, the second electrical escaping 戥 仏 仏 仏 仏 仏 , , , , , , , , , , , , , , , , , , , , , , , , 电 电 电 电 银 银 银 银A group of spicy, crane, copper, and alloys. Emulsified indium tin (IT〇), molybdenum, niobium, tantalum and the same according to claim 20 of the invention. The protruding structure of the second electrical contact is a triangular protruding structure: On #30·. The electrical connection method according to claim 20, wherein the protruding structure of the first electrical contact is a sawtooth protruding structure. The electrical connection method of claim 2, wherein the protruding structure of the first electrical contact is a pyramid-shaped protruding structure, and the top end of the protruding structure has a minute plane. &quot; 32. The electrical connection method as described in claim 2, wherein. The protruding structure of the first electrical contact of the first layer is formed by a development etching process. The electrical connection method of claim 2, wherein the protruding structure of the second electrical contact is formed by a laser etching process. 34. The electrical connection method as described in claim 2, the material of the adhesive layer is an insulating rubber material. The electrical connection method of claim 20, wherein the protruding structure of the second electrical contact is inserted into the first electrical contact. [36] The electrical connection method of claim 2, wherein the material hardness of the = two electrical contacts is higher than the hardness of the first electrical contact. ▲ The electrical connection method according to claim 20, wherein the point has at least one protruding structure, and the first electrical contact And, the ° system penetrates the adhesive layer to contact the second electrical contact. The electrical connection method of claim 37, wherein the protruding structure of the first electrical contact corresponds to the protruding structure of the = point. The method of claim 37, wherein the protruding structure of the first contact is corresponding to the protruding structure of the second two points. Mao 21 200840438 20 items The electrical connection method, wherein the application of the invention further comprises: after the electrical contact of the child, performing a heating step on the protruding structure contact step to cure the adhesive layer. The electrical connection structure is formed in a driving circuit assembly of a liquid crystal display panel, and the electrical connection structure comprises at least: a first electrical contact; The wire has a protruding structure, wherein the protruding structure is integrally formed on the second electrical electrical contact and contacts the first electrical contact to form an electrical connection; and the adhesive ό is formed on the Between the first electrical contact and the second electrical contact, the first _ Φ k ^ ^ ^ electrical contact and the second electrical contact are bonded. 4 2. The electrical connection structure of item 41, wherein the first electrical property The point is formed on a first electronic component. 43. The electrical connection structure of claim 42, wherein the first electronic component is selected from a printed circuit board (PCB), an electronic printed circuit Printed-Circiiit Board Assembly (PCBA), Integrated Circuit wafer, Thin Film Transistor (TFT) array substrate, Tape (Tape), Flexible Printed Circuits (Flexible Printed Circuits; The electrical connection structure of the invention, wherein the second electrical contact is formed in a second electronic component, wherein the electrical connection structure is formed by the plastic substrate (Plastic Substrate). 45. The electrical connection structure according to claim 44, wherein the second electronic component is selected from a printed circuit board (PCB), an electronic printed circuit board assembly (Printed-Circuit Board Assembly) PCBA), Integrated Circuit, Thin Film Transistor (TFT) Array Substrate, Tape (Tape), Flexible Printing A group of flexible printed circuits (FPC) and plastic substrates (Plastic Substrate). 46. The electrical connection structure of claim 41, wherein the first electrical contact is selected from the group consisting of a conductive bump, an electrode, a circuit end, and a lead. ^ 47. The electrical connection structure as described in claim 41, wherein. The first electrical contact is selected from the group consisting of conductive bumps, electrodes, circuit ends, and leads. For example, the electrical connection structure described in the 41st item of Shenjing Patent Range, wherein the material of a bucking contact is selected from the group consisting of silver, gold, platinum, palladium, nickel, tungsten, copper, and X oxygen I 4匕4ΐι Λ a group consisting of 'barium, tin oxide, indium tin oxide (ITO), molybdenum, niobium, tantalum and alloys thereof. 49 ^ The electrical connection structure described in claim 41 of the patent scope, wherein 23 200840438 the material of the second electrical contact is selected from the group consisting of silver, gold, uranium cadmium, oxidized fu, tin, and oxidized I 4 Nickel, crane, copper, alloy consisting of _ family = tin, Wei indium tin (_, _, silver, recorded and its The structure of the electrical connection structure described in the fourth aspect of the patent, the protruding structure of the straight center is a pyramid-shaped protruding structure, and the top end of the large-out structure has a minute plane. The electrical connection structure described in claim 41, wherein the protruding structure of the x point is formed by a process of lying. 54. The electrical connection structure of claim 4, wherein the protruding structure of the electrical contact is formed by a laser etching process. The structure of the connecting structure, wherein the material of the adhesive layer is an insulating rubber material as described in claim 41 of the patent application. The electrical connection structure of the fourth aspect of the patent, wherein the protruding structure of the second surface is broken into the first surface. The electrical connection structure of claim 41, wherein the material hardness of the first electrical contact is higher than the hardness of the first electrical contact.竹58 jl — The electrical connection structure according to claim 41, wherein the electrical-electrical contact has at least a protruding structure, and the first electrical-point protruding structure penetrates through the adhesive layer to contact The second electrical contact. ... 59. The power of the first electrical contact, as described in item 58 of the patent scope, is connected, , and . The large out structure of (4) corresponds to the protruding structure of the point. 〇 这 这 这 这 这 这 25