KR102092615B1 - 이방성 접속 구조체 - Google Patents

이방성 접속 구조체 Download PDF

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Publication number
KR102092615B1
KR102092615B1 KR1020177024610A KR20177024610A KR102092615B1 KR 102092615 B1 KR102092615 B1 KR 102092615B1 KR 1020177024610 A KR1020177024610 A KR 1020177024610A KR 20177024610 A KR20177024610 A KR 20177024610A KR 102092615 B1 KR102092615 B1 KR 102092615B1
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KR
South Korea
Prior art keywords
bump
anisotropic
connection structure
flexible substrate
electrode
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Korean (ko)
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KR20170113621A (ko
Inventor
고지 에지마
겐이치 히라야마
히로미 구보데
Original Assignee
데쿠세리아루즈 가부시키가이샤
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
KR1020177024610A 2015-03-20 2016-03-03 이방성 접속 구조체 Active KR102092615B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2015-058069 2015-03-20
JP2015058069A JP6512632B2 (ja) 2015-03-20 2015-03-20 異方性接続構造体及び異方性接続構造体の製造方法
PCT/JP2016/056610 WO2016152441A1 (ja) 2015-03-20 2016-03-03 異方性接続構造体

Publications (2)

Publication Number Publication Date
KR20170113621A KR20170113621A (ko) 2017-10-12
KR102092615B1 true KR102092615B1 (ko) 2020-03-24

Family

ID=56977307

Family Applications (1)

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KR1020177024610A Active KR102092615B1 (ko) 2015-03-20 2016-03-03 이방성 접속 구조체

Country Status (5)

Country Link
JP (1) JP6512632B2 (enExample)
KR (1) KR102092615B1 (enExample)
CN (1) CN107409467B (enExample)
TW (1) TWI708413B (enExample)
WO (1) WO2016152441A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI845515B (zh) * 2018-06-06 2024-06-21 日商迪睿合股份有限公司 連接體、連接體之製造方法、連接方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006278637A (ja) * 2005-03-29 2006-10-12 Sharp Corp 基板実装構造および表示装置
WO2013099135A1 (ja) * 2011-12-28 2013-07-04 パナソニック株式会社 フレキシブル表示装置

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US6621766B2 (en) * 2001-08-01 2003-09-16 Fossil, Inc. Flexible timepiece in multiple environments
JP3910527B2 (ja) 2002-03-13 2007-04-25 シャープ株式会社 液晶表示装置およびその製造方法
JP4389447B2 (ja) * 2003-01-28 2009-12-24 セイコーエプソン株式会社 電気光学装置の製造方法
WO2008047619A1 (en) * 2006-10-18 2008-04-24 Nec Corporation Circuit substrate device and circuit substrate module device
JP2008165219A (ja) 2006-12-08 2008-07-17 Bridgestone Corp フレキシブルドライバｉｃ
JP5039427B2 (ja) 2007-05-08 2012-10-03 株式会社ブリヂストン フレキシブルドライバｉｃの実装方法およびフレキシブルドライバｉｃ
JP2008281638A (ja) 2007-05-08 2008-11-20 Bridgestone Corp フレキシブルドライバｉｃの実装方法およびそれに用いるフレキシブルドライバｉｃ
KR101878251B1 (ko) * 2011-04-08 2018-07-13 삼성전자주식회사 굽힘 감지 센서 및 그를 제조하는 방법
TWI547369B (zh) * 2011-05-27 2016-09-01 康寧公司 玻璃塑膠積層之裝置、處理線、及方法
JP5508480B2 (ja) * 2011-07-06 2014-05-28 積水化学工業株式会社 異方性導電ペースト、接続構造体及び接続構造体の製造方法
JP5887790B2 (ja) * 2011-09-21 2016-03-16 ソニー株式会社 表示装置および電子機器
JP5910106B2 (ja) * 2012-01-23 2016-04-27 大日本印刷株式会社 タッチパネルモジュールおよびタッチパネル付表示装置
JP2013160942A (ja) * 2012-02-06 2013-08-19 Sony Corp 半導体装置およびその製造方法、並びに電子機器
JP2013210491A (ja) * 2012-03-30 2013-10-10 Sony Corp 表示装置および電子機器
KR101889008B1 (ko) * 2012-06-11 2018-08-20 삼성전자주식회사 플렉서블 디스플레이 장치 및 그 제어 방법
US8960899B2 (en) * 2012-09-26 2015-02-24 Google Inc. Assembling thin silicon chips on a contact lens
EP2743785B1 (fr) * 2012-12-17 2014-12-17 The Swatch Group Research and Development Ltd. Dispositif électronique portable flexible
US9348362B2 (en) * 2013-02-08 2016-05-24 Samsung Electronics Co., Ltd. Flexible portable terminal
CN109375710A (zh) * 2013-05-22 2019-02-22 松下知识产权经营株式会社 可穿戴设备
JP3193457U (ja) * 2014-07-24 2014-10-02 双葉電子工業株式会社 有機ｅｌ表示素子

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006278637A (ja) * 2005-03-29 2006-10-12 Sharp Corp 基板実装構造および表示装置
WO2013099135A1 (ja) * 2011-12-28 2013-07-04 パナソニック株式会社 フレキシブル表示装置

Also Published As

Publication number Publication date
TWI708413B (zh) 2020-10-21
WO2016152441A1 (ja) 2016-09-29
JP2016178226A (ja) 2016-10-06
CN107409467A (zh) 2017-11-28
HK1244994A1 (zh) 2018-08-17
KR20170113621A (ko) 2017-10-12
CN107409467B (zh) 2019-08-06
JP6512632B2 (ja) 2019-05-15
TW201637260A (zh) 2016-10-16

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