JP6408696B2 - 銅含有導電性ペースト、及び銅含有導電性ペーストから作製された電極 - Google Patents
銅含有導電性ペースト、及び銅含有導電性ペーストから作製された電極 Download PDFInfo
- Publication number
- JP6408696B2 JP6408696B2 JP2017511934A JP2017511934A JP6408696B2 JP 6408696 B2 JP6408696 B2 JP 6408696B2 JP 2017511934 A JP2017511934 A JP 2017511934A JP 2017511934 A JP2017511934 A JP 2017511934A JP 6408696 B2 JP6408696 B2 JP 6408696B2
- Authority
- JP
- Japan
- Prior art keywords
- particles
- weight
- conductive paste
- coated
- containing conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
- C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/04—Processes of manufacture in general
- H01M4/0402—Methods of deposition of the material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
- H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Dispersion Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Manufacturing & Machinery (AREA)
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Powder Metallurgy (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2014/085377 WO2016029397A1 (en) | 2014-08-28 | 2014-08-28 | Copper-containing conductive pastes and electrodes made therefrom |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017528871A JP2017528871A (ja) | 2017-09-28 |
| JP2017528871A5 JP2017528871A5 (enExample) | 2017-11-09 |
| JP6408696B2 true JP6408696B2 (ja) | 2018-10-17 |
Family
ID=55398611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017511934A Active JP6408696B2 (ja) | 2014-08-28 | 2014-08-28 | 銅含有導電性ペースト、及び銅含有導電性ペーストから作製された電極 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9951231B2 (enExample) |
| JP (1) | JP6408696B2 (enExample) |
| CN (1) | CN106605270B (enExample) |
| DE (1) | DE112014006910B4 (enExample) |
| WO (1) | WO2016029397A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112014006903B4 (de) | 2014-08-28 | 2022-07-21 | Solar Paste, Llc | Solarzellen mit Kupferelektroden |
| US10431700B2 (en) * | 2017-06-09 | 2019-10-01 | Giga Solar Materials Corp. | Conductive paste composition for providing enhanced adhesion strength to a semiconductor substrate and its use |
| WO2023078487A1 (de) * | 2021-11-04 | 2023-05-11 | Matthews International GmbH | Walze zur verwendung in einem trockenbeschichtungsverfahren zur herstellung von elektroden |
| CN114749346A (zh) * | 2022-04-08 | 2022-07-15 | 百为智能科技(广州)有限公司 | 一种基于大尺寸玻璃基板电路的制备方法及显示装置 |
| CN115996516B (zh) * | 2023-01-13 | 2025-12-09 | 广东绿展科技有限公司 | 3d印刷线路及其制备方法、焊接方法与应用 |
Family Cites Families (63)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4331714A (en) | 1979-06-29 | 1982-05-25 | E. I. Dupont De Nemours And Company | Process of making flake silver powders with chemisorbed monolayer of dispersant |
| US4273583A (en) | 1979-06-29 | 1981-06-16 | E. I. Du Pont De Nemours And Company | Flake silver powders with chemisorbed monolayer of dispersant |
| US4388347A (en) | 1980-11-11 | 1983-06-14 | Uop Inc. | Conductive pigment-coated surfaces |
| JPH0378906A (ja) | 1989-08-23 | 1991-04-04 | Furukawa Electric Co Ltd:The | 導電性ペースト |
| US5296413A (en) * | 1991-12-03 | 1994-03-22 | E. I. Du Pont De Nemours And Company | Automotive glass thick film conductor paste |
| JP3374194B2 (ja) * | 1992-04-20 | 2003-02-04 | 奥野製薬工業株式会社 | 導電性アルミニウムペースト用組成物 |
| JPH06125026A (ja) * | 1992-10-12 | 1994-05-06 | Ngk Spark Plug Co Ltd | 端子構造とこれを用いた入出力端子部材及び配線基板 |
| JPH08273434A (ja) * | 1995-04-03 | 1996-10-18 | Okuno Chem Ind Co Ltd | 導電性アルミニウム合金ペースト組成物 |
| US6679937B1 (en) | 1997-02-24 | 2004-01-20 | Cabot Corporation | Copper powders methods for producing powders and devices fabricated from same |
| JP4081865B2 (ja) | 1998-07-28 | 2008-04-30 | 株式会社デンソー | 導体組成物の製造方法 |
| JP4864195B2 (ja) * | 2000-08-30 | 2012-02-01 | 三井金属鉱業株式会社 | 被覆銅粉 |
| JP2004002923A (ja) | 2002-05-31 | 2004-01-08 | Murata Mfg Co Ltd | ニッケル粉末の製造方法、及びニッケル粉末 |
| JP4623921B2 (ja) | 2002-09-13 | 2011-02-02 | コーア株式会社 | 抵抗組成物および抵抗器 |
| JP4182234B2 (ja) * | 2002-09-20 | 2008-11-19 | Dowaエレクトロニクス株式会社 | 導電ペースト用銅粉およびその製造方法 |
| JP4144695B2 (ja) | 2002-11-01 | 2008-09-03 | 三井金属鉱業株式会社 | 二層コート銅粉並びにその二層コート銅粉の製造方法及びその二層コート銅粉を用いた導電性ペースト |
| JP4144694B2 (ja) | 2002-11-01 | 2008-09-03 | 三井金属鉱業株式会社 | スズコート銅粉並びにそのスズコート銅粉の製造方法及びそのスズコート銅粉を用いた導電性ペースト |
| JP2004232036A (ja) | 2003-01-30 | 2004-08-19 | Fujikura Ltd | 複合Ni微粒子、その製造方法及び製造装置 |
| JP4586141B2 (ja) * | 2003-10-27 | 2010-11-24 | Dowaエレクトロニクス株式会社 | 導電ペースト |
| JP4066432B2 (ja) * | 2003-10-31 | 2008-03-26 | Necトーキン株式会社 | 積層型圧電セラミックス素子の製造方法 |
| CN1621182A (zh) | 2003-11-25 | 2005-06-01 | 三星电子株式会社 | 含碳的镍粒子粉末及其制造方法 |
| GB2418432A (en) | 2004-09-23 | 2006-03-29 | Middlesex Silver Co Ltd | Silver alloy and its production using a master metal |
| JP2006225692A (ja) | 2005-02-15 | 2006-08-31 | Mitsui Mining & Smelting Co Ltd | スズコート銅粉及び当該スズコート銅粉を用いた複合導電性ペースト |
| JP2006225691A (ja) | 2005-02-15 | 2006-08-31 | Mitsui Mining & Smelting Co Ltd | スズコート銅粉及び当該スズコート銅粉を用いた導電性ペースト |
| US7435361B2 (en) | 2005-04-14 | 2008-10-14 | E.I. Du Pont De Nemours And Company | Conductive compositions and processes for use in the manufacture of semiconductor devices |
| JP4254757B2 (ja) | 2005-07-22 | 2009-04-15 | 富士通株式会社 | 導電材料及び導電性ペースト及び基板 |
| JP2008116739A (ja) | 2006-11-06 | 2008-05-22 | Nikon Corp | 撮像部保持ユニット、レンズ鏡筒、撮像装置 |
| JP2008138266A (ja) | 2006-12-04 | 2008-06-19 | Mitsubishi Materials Corp | ハンダ粉末及び該粉末を用いたハンダ用ペースト |
| CN101246759B (zh) * | 2007-02-15 | 2010-09-08 | 中国船舶重工集团公司第七二五研究所 | 一种用于透明导电材料的纳米均相复合金属氧化物导电粉末及其制造方法 |
| JP5083943B2 (ja) | 2007-04-03 | 2012-11-28 | 株式会社ブリヂストン | ゴム物品補強用スチールコードおよびそれを用いた空気入りタイヤ |
| KR20090053667A (ko) * | 2007-11-22 | 2009-05-27 | 제일모직주식회사 | 입도분포 및 크기가 제어된 알루미늄 분말을 포함하는전극형성용 조성물과 이를 이용하여 제조되는 전극 |
| JP5155743B2 (ja) | 2008-03-04 | 2013-03-06 | 三井金属鉱業株式会社 | 導電性ペースト用銅粉及び導電性ペースト |
| JP2010013730A (ja) * | 2008-06-05 | 2010-01-21 | Mitsui Mining & Smelting Co Ltd | 導電性ペースト用銅粉及び導電性ペースト |
| US8834957B2 (en) | 2008-11-05 | 2014-09-16 | Lg Chem, Ltd. | Preparation method for an electroconductive patterned copper layer |
| JP5018752B2 (ja) | 2008-11-27 | 2012-09-05 | 富士通株式会社 | 導電材料、及び導電材料の製造方法 |
| JP2010126022A (ja) | 2008-11-28 | 2010-06-10 | Toyota Auto Body Co Ltd | 車両用空調装置 |
| JP5612278B2 (ja) | 2009-06-23 | 2014-10-22 | パナソニック株式会社 | 三次元形状造形物の製造方法およびその製造装置 |
| JP2011006739A (ja) * | 2009-06-25 | 2011-01-13 | Mitsui Mining & Smelting Co Ltd | 導電性ペースト用銅粉及び導電性ペースト |
| JP2011006740A (ja) | 2009-06-25 | 2011-01-13 | Mitsui Mining & Smelting Co Ltd | 導電性ペースト用銅粉及び導電性ペースト |
| US8129088B2 (en) | 2009-07-02 | 2012-03-06 | E.I. Du Pont De Nemours And Company | Electrode and method for manufacturing the same |
| JP5358328B2 (ja) | 2009-07-16 | 2013-12-04 | デクセリアルズ株式会社 | 導電性粒子、並びに異方性導電フィルム、接合体、及び接続方法 |
| US20110180137A1 (en) | 2010-01-25 | 2011-07-28 | Hitachi Chemical Company, Ltd. | Paste composition for electrode and photovoltaic cell |
| EP2398061B1 (en) | 2010-06-21 | 2020-04-29 | Lg Electronics Inc. | Solar cell |
| JP2012076086A (ja) | 2010-09-30 | 2012-04-19 | Mitsubishi Materials Corp | ハンダ粉末及びこの粉末を用いたハンダ用ペースト |
| US20110315217A1 (en) | 2010-10-05 | 2011-12-29 | Applied Materials, Inc. | Cu paste metallization for silicon solar cells |
| JP5895344B2 (ja) | 2011-01-31 | 2016-03-30 | 三菱マテリアル株式会社 | ハンダ粉末の製造方法及びこの方法により製造されたハンダ粉末を用いてハンダ用ペーストを製造する方法 |
| JP5754582B2 (ja) | 2011-02-28 | 2015-07-29 | 三菱マテリアル株式会社 | プリコート用ハンダペースト |
| US9067261B2 (en) | 2011-03-08 | 2015-06-30 | E I Du Pont De Nemours And Company | Process for making silver powder particles with very small size crystallites |
| KR101814014B1 (ko) | 2011-03-25 | 2018-01-03 | 삼성전자주식회사 | 도전성 페이스트, 상기 도전성 페이스트를 사용하여 형성된 전극을 포함하는 전자 소자 및 태양 전지 |
| CA2830054C (en) | 2011-04-21 | 2017-07-11 | Shoei Chemical Inc. | Conductive paste |
| US20120312368A1 (en) | 2011-06-13 | 2012-12-13 | E I Du Pont De Nemours And Company | Thick film paste containing bismuth-based oxide and its use in the manufacture of semiconductor devices |
| JP5705713B2 (ja) | 2011-12-05 | 2015-04-22 | 古河電気工業株式会社 | 中空銅コアシリコンナノワイヤー、シリコン複合銅基板及びこれらの製造方法並びにリチウムイオン二次電池 |
| KR20130065445A (ko) | 2011-12-09 | 2013-06-19 | 삼성전자주식회사 | 도전성 페이스트, 상기 도전성 페이스트를 사용하여 형성된 전극을 포함하는 전자 소자 및 태양 전지 |
| WO2013090344A1 (en) | 2011-12-13 | 2013-06-20 | Ferro Corporation | Electrically conductive polymeric compositons, contacts, assemblies, and methods |
| CN103310870A (zh) | 2012-03-12 | 2013-09-18 | 深圳市圣龙特电子有限公司 | 一种硅太阳能电池电极用无铅铜浆及其制备方法 |
| CN102610297B (zh) * | 2012-04-01 | 2015-01-28 | 昆明理工大学 | 太阳能电池正面电极用银包铜导体浆料及其制备方法 |
| US9082901B2 (en) | 2012-04-11 | 2015-07-14 | E I Du Pont De Nemours And Company | Solar cell and manufacturing method of the same |
| KR101565631B1 (ko) | 2012-06-04 | 2015-11-03 | 삼성전기주식회사 | 내부 전극용 도전성 페이스트 조성물, 적층 세라믹 커패시터 및 이의 제조방법 |
| US8815638B2 (en) * | 2012-06-19 | 2014-08-26 | E I Du Pont De Nemours And Company | Method of manufacturing thick-film electrode |
| KR101999795B1 (ko) | 2012-06-27 | 2019-07-12 | 삼성전자주식회사 | 도전성 페이스트, 상기 도전성 페이스트를 사용하여 형성된 전극을 포함하는 전자 소자 및 태양 전지 |
| CN103578561A (zh) | 2012-07-23 | 2014-02-12 | 北京兆易创新科技股份有限公司 | 一种快闪存储器及其擦除校验方法和装置 |
| US8647815B1 (en) | 2012-07-26 | 2014-02-11 | E I Du Pont De Nemours And Company | Method of manufacturing copper electrode |
| CN102773475B (zh) * | 2012-07-31 | 2014-06-11 | 东南大学 | 一种导电浆料用抗氧化铜银复合粉及其制备方法 |
| DE112014006907T5 (de) | 2014-08-28 | 2017-06-08 | E.I. Du Pont De Nemours And Company | Kupfer enthaltende leitfähige Pasten und daraus hergestellte Elektroden |
-
2014
- 2014-08-28 US US15/505,682 patent/US9951231B2/en active Active
- 2014-08-28 WO PCT/CN2014/085377 patent/WO2016029397A1/en not_active Ceased
- 2014-08-28 DE DE112014006910.8T patent/DE112014006910B4/de active Active
- 2014-08-28 JP JP2017511934A patent/JP6408696B2/ja active Active
- 2014-08-28 CN CN201480081423.9A patent/CN106605270B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN106605270A (zh) | 2017-04-26 |
| DE112014006910B4 (de) | 2024-11-28 |
| US9951231B2 (en) | 2018-04-24 |
| WO2016029397A1 (en) | 2016-03-03 |
| CN106605270B (zh) | 2019-03-08 |
| JP2017528871A (ja) | 2017-09-28 |
| DE112014006910T5 (de) | 2017-05-18 |
| US20170275477A1 (en) | 2017-09-28 |
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