DE112014006910B4 - Kupferhaltige leitfähige Pasten - Google Patents

Kupferhaltige leitfähige Pasten Download PDF

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Publication number
DE112014006910B4
DE112014006910B4 DE112014006910.8T DE112014006910T DE112014006910B4 DE 112014006910 B4 DE112014006910 B4 DE 112014006910B4 DE 112014006910 T DE112014006910 T DE 112014006910T DE 112014006910 B4 DE112014006910 B4 DE 112014006910B4
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DE
Germany
Prior art keywords
particles
coated
conductive paste
paste
core
Prior art date
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Active
Application number
DE112014006910.8T
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German (de)
English (en)
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DE112014006910T5 (de
Inventor
Minfang Mu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Solar Paste LLC
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Solar Paste LLC
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Publication date
Application filed by Solar Paste LLC filed Critical Solar Paste LLC
Publication of DE112014006910T5 publication Critical patent/DE112014006910T5/de
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Publication of DE112014006910B4 publication Critical patent/DE112014006910B4/de
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/04—Processes of manufacture in general
    • H01M4/0402—Methods of deposition of the material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H10F77/206—Electrodes for devices having potential barriers
    • H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Powder Metallurgy (AREA)
DE112014006910.8T 2014-08-28 2014-08-28 Kupferhaltige leitfähige Pasten Active DE112014006910B4 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2014/085377 WO2016029397A1 (en) 2014-08-28 2014-08-28 Copper-containing conductive pastes and electrodes made therefrom

Publications (2)

Publication Number Publication Date
DE112014006910T5 DE112014006910T5 (de) 2017-05-18
DE112014006910B4 true DE112014006910B4 (de) 2024-11-28

Family

ID=55398611

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112014006910.8T Active DE112014006910B4 (de) 2014-08-28 2014-08-28 Kupferhaltige leitfähige Pasten

Country Status (5)

Country Link
US (1) US9951231B2 (enExample)
JP (1) JP6408696B2 (enExample)
CN (1) CN106605270B (enExample)
DE (1) DE112014006910B4 (enExample)
WO (1) WO2016029397A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112014006903B4 (de) 2014-08-28 2022-07-21 Solar Paste, Llc Solarzellen mit Kupferelektroden
US10431700B2 (en) * 2017-06-09 2019-10-01 Giga Solar Materials Corp. Conductive paste composition for providing enhanced adhesion strength to a semiconductor substrate and its use
WO2023078487A1 (de) * 2021-11-04 2023-05-11 Matthews International GmbH Walze zur verwendung in einem trockenbeschichtungsverfahren zur herstellung von elektroden
CN114749346A (zh) * 2022-04-08 2022-07-15 百为智能科技(广州)有限公司 一种基于大尺寸玻璃基板电路的制备方法及显示装置
CN115996516B (zh) * 2023-01-13 2025-12-09 广东绿展科技有限公司 3d印刷线路及其制备方法、焊接方法与应用

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008116739A (ja) 2006-11-06 2008-05-22 Nikon Corp 撮像部保持ユニット、レンズ鏡筒、撮像装置
US8129088B2 (en) 2009-07-02 2012-03-06 E.I. Du Pont De Nemours And Company Electrode and method for manufacturing the same
US20120312368A1 (en) 2011-06-13 2012-12-13 E I Du Pont De Nemours And Company Thick film paste containing bismuth-based oxide and its use in the manufacture of semiconductor devices
US20140008587A1 (en) 2011-04-21 2014-01-09 Hiroshi Yoshida Conductive paste

Family Cites Families (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4331714A (en) 1979-06-29 1982-05-25 E. I. Dupont De Nemours And Company Process of making flake silver powders with chemisorbed monolayer of dispersant
US4273583A (en) 1979-06-29 1981-06-16 E. I. Du Pont De Nemours And Company Flake silver powders with chemisorbed monolayer of dispersant
US4388347A (en) 1980-11-11 1983-06-14 Uop Inc. Conductive pigment-coated surfaces
JPH0378906A (ja) 1989-08-23 1991-04-04 Furukawa Electric Co Ltd:The 導電性ペースト
US5296413A (en) * 1991-12-03 1994-03-22 E. I. Du Pont De Nemours And Company Automotive glass thick film conductor paste
JP3374194B2 (ja) * 1992-04-20 2003-02-04 奥野製薬工業株式会社 導電性アルミニウムペースト用組成物
JPH06125026A (ja) * 1992-10-12 1994-05-06 Ngk Spark Plug Co Ltd 端子構造とこれを用いた入出力端子部材及び配線基板
JPH08273434A (ja) * 1995-04-03 1996-10-18 Okuno Chem Ind Co Ltd 導電性アルミニウム合金ペースト組成物
US6679937B1 (en) 1997-02-24 2004-01-20 Cabot Corporation Copper powders methods for producing powders and devices fabricated from same
JP4081865B2 (ja) 1998-07-28 2008-04-30 株式会社デンソー 導体組成物の製造方法
JP4864195B2 (ja) * 2000-08-30 2012-02-01 三井金属鉱業株式会社 被覆銅粉
JP2004002923A (ja) 2002-05-31 2004-01-08 Murata Mfg Co Ltd ニッケル粉末の製造方法、及びニッケル粉末
JP4623921B2 (ja) 2002-09-13 2011-02-02 コーア株式会社 抵抗組成物および抵抗器
JP4182234B2 (ja) * 2002-09-20 2008-11-19 Ｄｏｗａエレクトロニクス株式会社 導電ペースト用銅粉およびその製造方法
JP4144695B2 (ja) 2002-11-01 2008-09-03 三井金属鉱業株式会社 二層コート銅粉並びにその二層コート銅粉の製造方法及びその二層コート銅粉を用いた導電性ペースト
JP4144694B2 (ja) 2002-11-01 2008-09-03 三井金属鉱業株式会社 スズコート銅粉並びにそのスズコート銅粉の製造方法及びそのスズコート銅粉を用いた導電性ペースト
JP2004232036A (ja) 2003-01-30 2004-08-19 Fujikura Ltd 複合Ｎｉ微粒子、その製造方法及び製造装置
JP4586141B2 (ja) * 2003-10-27 2010-11-24 Ｄｏｗａエレクトロニクス株式会社 導電ペースト
JP4066432B2 (ja) * 2003-10-31 2008-03-26 Ｎｅｃトーキン株式会社 積層型圧電セラミックス素子の製造方法
CN1621182A (zh) 2003-11-25 2005-06-01 三星电子株式会社 含碳的镍粒子粉末及其制造方法
GB2418432A (en) 2004-09-23 2006-03-29 Middlesex Silver Co Ltd Silver alloy and its production using a master metal
JP2006225692A (ja) 2005-02-15 2006-08-31 Mitsui Mining & Smelting Co Ltd スズコート銅粉及び当該スズコート銅粉を用いた複合導電性ペースト
JP2006225691A (ja) 2005-02-15 2006-08-31 Mitsui Mining & Smelting Co Ltd スズコート銅粉及び当該スズコート銅粉を用いた導電性ペースト
US7435361B2 (en) 2005-04-14 2008-10-14 E.I. Du Pont De Nemours And Company Conductive compositions and processes for use in the manufacture of semiconductor devices
JP4254757B2 (ja) 2005-07-22 2009-04-15 富士通株式会社 導電材料及び導電性ペースト及び基板
JP2008138266A (ja) 2006-12-04 2008-06-19 Mitsubishi Materials Corp ハンダ粉末及び該粉末を用いたハンダ用ペースト
CN101246759B (zh) * 2007-02-15 2010-09-08 中国船舶重工集团公司第七二五研究所 一种用于透明导电材料的纳米均相复合金属氧化物导电粉末及其制造方法
JP5083943B2 (ja) 2007-04-03 2012-11-28 株式会社ブリヂストン ゴム物品補強用スチールコードおよびそれを用いた空気入りタイヤ
KR20090053667A (ko) * 2007-11-22 2009-05-27 제일모직주식회사 입도분포 및 크기가 제어된 알루미늄 분말을 포함하는전극형성용 조성물과 이를 이용하여 제조되는 전극
JP5155743B2 (ja) 2008-03-04 2013-03-06 三井金属鉱業株式会社 導電性ペースト用銅粉及び導電性ペースト
JP2010013730A (ja) * 2008-06-05 2010-01-21 Mitsui Mining & Smelting Co Ltd 導電性ペースト用銅粉及び導電性ペースト
US8834957B2 (en) 2008-11-05 2014-09-16 Lg Chem, Ltd. Preparation method for an electroconductive patterned copper layer
JP5018752B2 (ja) 2008-11-27 2012-09-05 富士通株式会社 導電材料、及び導電材料の製造方法
JP2010126022A (ja) 2008-11-28 2010-06-10 Toyota Auto Body Co Ltd 車両用空調装置
JP5612278B2 (ja) 2009-06-23 2014-10-22 パナソニック株式会社 三次元形状造形物の製造方法およびその製造装置
JP2011006739A (ja) * 2009-06-25 2011-01-13 Mitsui Mining & Smelting Co Ltd 導電性ペースト用銅粉及び導電性ペースト
JP2011006740A (ja) 2009-06-25 2011-01-13 Mitsui Mining & Smelting Co Ltd 導電性ペースト用銅粉及び導電性ペースト
JP5358328B2 (ja) 2009-07-16 2013-12-04 デクセリアルズ株式会社 導電性粒子、並びに異方性導電フィルム、接合体、及び接続方法
US20110180137A1 (en) 2010-01-25 2011-07-28 Hitachi Chemical Company, Ltd. Paste composition for electrode and photovoltaic cell
EP2398061B1 (en) 2010-06-21 2020-04-29 Lg Electronics Inc. Solar cell
JP2012076086A (ja) 2010-09-30 2012-04-19 Mitsubishi Materials Corp ハンダ粉末及びこの粉末を用いたハンダ用ペースト
US20110315217A1 (en) 2010-10-05 2011-12-29 Applied Materials, Inc. Cu paste metallization for silicon solar cells
JP5895344B2 (ja) 2011-01-31 2016-03-30 三菱マテリアル株式会社 ハンダ粉末の製造方法及びこの方法により製造されたハンダ粉末を用いてハンダ用ペーストを製造する方法
JP5754582B2 (ja) 2011-02-28 2015-07-29 三菱マテリアル株式会社 プリコート用ハンダペースト
US9067261B2 (en) 2011-03-08 2015-06-30 E I Du Pont De Nemours And Company Process for making silver powder particles with very small size crystallites
KR101814014B1 (ko) 2011-03-25 2018-01-03 삼성전자주식회사 도전성 페이스트, 상기 도전성 페이스트를 사용하여 형성된 전극을 포함하는 전자 소자 및 태양 전지
JP5705713B2 (ja) 2011-12-05 2015-04-22 古河電気工業株式会社 中空銅コアシリコンナノワイヤー、シリコン複合銅基板及びこれらの製造方法並びにリチウムイオン二次電池
KR20130065445A (ko) 2011-12-09 2013-06-19 삼성전자주식회사 도전성 페이스트, 상기 도전성 페이스트를 사용하여 형성된 전극을 포함하는 전자 소자 및 태양 전지
WO2013090344A1 (en) 2011-12-13 2013-06-20 Ferro Corporation Electrically conductive polymeric compositons, contacts, assemblies, and methods
CN103310870A (zh) 2012-03-12 2013-09-18 深圳市圣龙特电子有限公司 一种硅太阳能电池电极用无铅铜浆及其制备方法
CN102610297B (zh) * 2012-04-01 2015-01-28 昆明理工大学 太阳能电池正面电极用银包铜导体浆料及其制备方法
US9082901B2 (en) 2012-04-11 2015-07-14 E I Du Pont De Nemours And Company Solar cell and manufacturing method of the same
KR101565631B1 (ko) 2012-06-04 2015-11-03 삼성전기주식회사 내부 전극용 도전성 페이스트 조성물, 적층 세라믹 커패시터 및 이의 제조방법
US8815638B2 (en) * 2012-06-19 2014-08-26 E I Du Pont De Nemours And Company Method of manufacturing thick-film electrode
KR101999795B1 (ko) 2012-06-27 2019-07-12 삼성전자주식회사 도전성 페이스트, 상기 도전성 페이스트를 사용하여 형성된 전극을 포함하는 전자 소자 및 태양 전지
CN103578561A (zh) 2012-07-23 2014-02-12 北京兆易创新科技股份有限公司 一种快闪存储器及其擦除校验方法和装置
US8647815B1 (en) 2012-07-26 2014-02-11 E I Du Pont De Nemours And Company Method of manufacturing copper electrode
CN102773475B (zh) * 2012-07-31 2014-06-11 东南大学 一种导电浆料用抗氧化铜银复合粉及其制备方法
DE112014006907T5 (de) 2014-08-28 2017-06-08 E.I. Du Pont De Nemours And Company Kupfer enthaltende leitfähige Pasten und daraus hergestellte Elektroden

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008116739A (ja) 2006-11-06 2008-05-22 Nikon Corp 撮像部保持ユニット、レンズ鏡筒、撮像装置
US8129088B2 (en) 2009-07-02 2012-03-06 E.I. Du Pont De Nemours And Company Electrode and method for manufacturing the same
US20140008587A1 (en) 2011-04-21 2014-01-09 Hiroshi Yoshida Conductive paste
US20120312368A1 (en) 2011-06-13 2012-12-13 E I Du Pont De Nemours And Company Thick film paste containing bismuth-based oxide and its use in the manufacture of semiconductor devices

Also Published As

Publication number Publication date
CN106605270A (zh) 2017-04-26
US9951231B2 (en) 2018-04-24
WO2016029397A1 (en) 2016-03-03
CN106605270B (zh) 2019-03-08
JP2017528871A (ja) 2017-09-28
JP6408696B2 (ja) 2018-10-17
DE112014006910T5 (de) 2017-05-18
US20170275477A1 (en) 2017-09-28

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