JP6310216B2 - 放射線検出装置及びその製造方法並びに放射線検出システム - Google Patents
放射線検出装置及びその製造方法並びに放射線検出システム Download PDFInfo
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14658—X-ray, gamma-ray or corpuscular radiation imagers
- H01L27/14663—Indirect radiation imagers, e.g. using luminescent members
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
- A61B6/42—Arrangements for detecting radiation specially adapted for radiation diagnosis
- A61B6/4208—Arrangements for detecting radiation specially adapted for radiation diagnosis characterised by using a particular type of detector
- A61B6/4233—Arrangements for detecting radiation specially adapted for radiation diagnosis characterised by using a particular type of detector using matrix detectors
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
- A61B6/46—Arrangements for interfacing with the operator or the patient
- A61B6/461—Displaying means of special interest
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
- A61B6/52—Devices using data or image processing specially adapted for radiation diagnosis
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- H—ELECTRICITY
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- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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- H01L27/14601—Structural or functional details thereof
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- H01L27/144—Devices controlled by radiation
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- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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Description
Claims (8)
- 放射線検出装置の製造方法であって、
第1面と前記第1面の反対側にある第2面とを有し、画素アレイ及び電気接続部が前記第1面側に配置されたセンサパネルを準備する準備工程と、
前記画素アレイを前記センサパネルの前記第2面側から支持する第1支持部を、前記センサパネルに接着層によって接着する接着工程と、
前記電気接続部を前記センサパネルの前記第2面側から支持する第2支持部を、前記センサパネルに固定する固定工程と、
前記電気接続部に配線部材を圧着する圧着工程とを有し、
前記第2支持部の前記圧着工程における弾性率は、前記接着層の前記圧着工程における弾性率よりも高く、
前記第1支持部は、支持基板に含まれ、
前記第2支持部は、枠体に含まれ、
前記支持基板と前記枠体とは、接着剤を用いて接着されることを特徴とする製造方法。 - 前記第2支持部の前記圧着工程における圧縮強度は、90MPa以上であることを特徴とする請求項1に記載の製造方法。
- 前記第2支持部は、前記センサパネルの前記第2面に接していることを特徴とする請求項1又は2に記載の製造方法。
- 前記第2支持部と前記接着層との間に隙間があることを特徴とする請求項1乃至3の何れか1項に記載の製造方法。
- 前記第2支持部は金属性材料で形成されることを特徴とする請求項1乃至4の何れか1項に記載の製造方法。
- 前記画素アレイを覆う位置にシンチレータ層を配置する工程を更に有することを特徴とする請求項1乃至5の何れか1項に記載の製造方法。
- 放射線検出装置であって、
第1面と前記第1面の反対側にある第2面とを有し、画素アレイ及び電気接続部が前記第1面側に配置されたセンサパネルと、
前記画素アレイを前記センサパネルの前記第2面側から緩衝部材を介して支持する第1支持部と、
前記電気接続部を前記センサパネルの前記第2面側から支持する第2支持部と、
前記電気接続部に接続された配線部材とを備え、
前記第2支持部は、前記センサパネルに固定されており、
前記第2支持部の弾性率は、前記緩衝部材の弾性率よりも高く、
前記第1支持部は、支持基板に含まれ、
前記第2支持部は、枠体に含まれ、
前記支持基板と前記枠体とは、接着剤を用いて接着されていることを特徴とする放射線検出装置。 - 請求項7に記載の放射線検出装置と、
前記放射線検出装置によって得られた信号を処理する信号処理手段と
を備えることを特徴とする放射線検出システム。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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JP2013185703A JP6310216B2 (ja) | 2013-09-06 | 2013-09-06 | 放射線検出装置及びその製造方法並びに放射線検出システム |
PCT/JP2014/003730 WO2015033506A1 (ja) | 2013-09-06 | 2014-07-15 | 放射線検出装置及びその製造方法並びに放射線検出システム |
US15/053,045 US10283555B2 (en) | 2013-09-06 | 2016-02-25 | Radiation detection apparatus, manufacturing method therefor, and radiation detection system |
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JP2013185703A JP6310216B2 (ja) | 2013-09-06 | 2013-09-06 | 放射線検出装置及びその製造方法並びに放射線検出システム |
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JP2015052535A JP2015052535A (ja) | 2015-03-19 |
JP2015052535A5 JP2015052535A5 (ja) | 2016-10-20 |
JP6310216B2 true JP6310216B2 (ja) | 2018-04-11 |
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Country Status (3)
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US (1) | US10283555B2 (ja) |
JP (1) | JP6310216B2 (ja) |
WO (1) | WO2015033506A1 (ja) |
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JP7348090B2 (ja) | 2020-01-24 | 2023-09-20 | 日本航空電子工業株式会社 | コネクタ組立体 |
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CN109952647B (zh) * | 2016-08-08 | 2023-03-17 | 索尼半导体解决方案公司 | 成像元件、制造方法和电子设备 |
JP6778118B2 (ja) | 2017-01-13 | 2020-10-28 | キヤノン株式会社 | 放射線撮像装置及び放射線撮像システム |
WO2019012846A1 (ja) | 2017-07-10 | 2019-01-17 | キヤノン株式会社 | 放射線撮像装置および放射線撮像システム |
JP7030478B2 (ja) | 2017-11-09 | 2022-03-07 | キヤノン株式会社 | 撮影台および放射線撮影システム |
JP7314118B2 (ja) | 2018-03-19 | 2023-07-25 | 富士フイルム株式会社 | 放射線検出器、放射線画像撮影装置及び放射線検出器の製造方法 |
JP2019174365A (ja) * | 2018-03-29 | 2019-10-10 | シャープ株式会社 | 撮像パネル |
CN110323235A (zh) * | 2018-03-29 | 2019-10-11 | 夏普株式会社 | 摄像面板 |
JP6659182B2 (ja) * | 2018-07-23 | 2020-03-04 | キヤノン株式会社 | 放射線撮像装置、その製造方法及び放射線撮像システム |
JP7185481B2 (ja) | 2018-10-18 | 2022-12-07 | 浜松ホトニクス株式会社 | 放射線撮像装置 |
JP7181049B2 (ja) * | 2018-10-18 | 2022-11-30 | 浜松ホトニクス株式会社 | 放射線撮像装置、放射線撮像装置の製造方法、及び放射線撮像装置の修復方法 |
JP7181050B2 (ja) * | 2018-10-18 | 2022-11-30 | 浜松ホトニクス株式会社 | 放射線撮像装置 |
JP7289768B2 (ja) * | 2019-10-09 | 2023-06-12 | キヤノン株式会社 | 放射線撮影装置 |
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JP2005197729A (ja) * | 1999-06-14 | 2005-07-21 | Sharp Corp | 外部回路実装方法および熱圧着装置 |
WO2001063321A1 (fr) * | 2000-02-25 | 2001-08-30 | Hamamatsu Photonics K.K. | Dispositif d'imagerie a rayons x et son procede de fabrication |
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