JP6292351B1 - ポリイミド樹脂、ポリイミド樹脂組成物、それを用いたタッチパネルおよびその製造方法、カラーフィルタおよびその製造方法、液晶素子およびその製造方法、有機ｅｌ素子およびその製造方法 - Google Patents

ポリイミド樹脂、ポリイミド樹脂組成物、それを用いたタッチパネルおよびその製造方法、カラーフィルタおよびその製造方法、液晶素子およびその製造方法、有機ｅｌ素子およびその製造方法 Download PDF

Info

Publication number
JP6292351B1
JP6292351B1 JP2017532182A JP2017532182A JP6292351B1 JP 6292351 B1 JP6292351 B1 JP 6292351B1 JP 2017532182 A JP2017532182 A JP 2017532182A JP 2017532182 A JP2017532182 A JP 2017532182A JP 6292351 B1 JP6292351 B1 JP 6292351B1
Authority
JP
Japan
Prior art keywords
polyimide resin
group
polyimide
film
resin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017532182A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2017221776A1 (ja
Inventor
昭典 佐伯
昭典 佐伯
佳奈 河原
佳奈 河原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Application granted granted Critical
Publication of JP6292351B1 publication Critical patent/JP6292351B1/ja
Publication of JPWO2017221776A1 publication Critical patent/JPWO2017221776A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C08K5/3475—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G02F1/133516—Methods for their manufacture, e.g. printing, electro-deposition or photolithography
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • Human Computer Interaction (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Liquid Crystal (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2017532182A 2016-06-24 2017-06-14 ポリイミド樹脂、ポリイミド樹脂組成物、それを用いたタッチパネルおよびその製造方法、カラーフィルタおよびその製造方法、液晶素子およびその製造方法、有機ｅｌ素子およびその製造方法 Active JP6292351B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016125529 2016-06-24
JP2016125529 2016-06-24
PCT/JP2017/021902 WO2017221776A1 (ja) 2016-06-24 2017-06-14 ポリイミド樹脂、ポリイミド樹脂組成物、それを用いたタッチパネルおよびその製造方法、カラーフィルタおよびその製造方法、液晶素子およびその製造方法、有機ｅｌ素子およびその製造方法

Publications (2)

Publication Number Publication Date
JP6292351B1 true JP6292351B1 (ja) 2018-03-14
JPWO2017221776A1 JPWO2017221776A1 (ja) 2018-06-21

Family

ID=60784748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017532182A Active JP6292351B1 (ja) 2016-06-24 2017-06-14 ポリイミド樹脂、ポリイミド樹脂組成物、それを用いたタッチパネルおよびその製造方法、カラーフィルタおよびその製造方法、液晶素子およびその製造方法、有機ｅｌ素子およびその製造方法

Country Status (5)

Country Link
JP (1) JP6292351B1 (ko)
KR (1) KR102134263B1 (ko)
CN (1) CN109348718B (ko)
TW (1) TWI710584B (ko)
WO (1) WO2017221776A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2020095693A1 (ja) * 2018-11-09 2021-09-30 東レ株式会社 ポリイミド前駆体、ポリイミド、ポリイミド樹脂膜、およびフレキシブルデバイス

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI813543B (zh) * 2016-08-10 2023-09-01 日商日鐵化學材料股份有限公司 聚醯亞胺前驅物、聚醯亞胺及透明聚醯亞胺膜的製造方法
JP6890999B2 (ja) * 2016-08-10 2021-06-18 日鉄ケミカル＆マテリアル株式会社 ポリイミド前駆体及びポリイミド
JP6966847B2 (ja) * 2016-08-10 2021-11-17 日鉄ケミカル＆マテリアル株式会社 透明ポリイミドフィルムの製造方法
JP7163920B2 (ja) * 2017-07-28 2022-11-01 日産化学株式会社 液晶配向剤、液晶配向膜及び液晶表示素子
WO2019198709A1 (ja) * 2018-04-10 2019-10-17 三菱瓦斯化学株式会社 ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム
TWI673553B (zh) * 2018-04-26 2019-10-01 台虹科技股份有限公司 觸控面板感應器結構及其製作方法
JP7302595B2 (ja) * 2018-05-01 2023-07-04 三菱瓦斯化学株式会社 ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム
JP2019219525A (ja) * 2018-06-20 2019-12-26 日東電工株式会社 偏光フィルム、粘着剤層付き偏光フィルム、及び画像表示装置
JP7139715B2 (ja) * 2018-06-26 2022-09-21 大日本印刷株式会社 ポリイミドフィルム、積層体、ディスプレイ用表面材、タッチパネル部材、液晶表示装置、及び有機エレクトロルミネッセンス表示装置
CN110156990B (zh) * 2019-05-30 2020-12-08 武汉华星光电半导体显示技术有限公司 一种聚酰亚胺复合物、制备方法及其应用
WO2021033544A1 (ja) * 2019-08-20 2021-02-25 三菱瓦斯化学株式会社 ポリイミド樹脂組成物、ポリイミドワニス及びポリイミドフィルム
JP2021063212A (ja) * 2019-10-15 2021-04-22 住友化学株式会社 光学フィルム
WO2021193530A1 (ja) 2020-03-24 2021-09-30 東レ株式会社 樹脂膜、その製造方法、樹脂組成物、ディスプレイおよびその製造方法
KR20220158227A (ko) 2020-03-24 2022-11-30 도레이 카부시키가이샤 수지 조성물, 그것을 사용한 표시 디바이스 또는 수광 디바이스의 제조 방법, 기판 및 디바이스
TW202215154A (zh) 2020-06-03 2022-04-16 日商富士軟片股份有限公司 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體元件
EP4177296A4 (en) * 2020-07-02 2024-07-24 Zymergen Inc OPTICAL FILM
JPWO2022176919A1 (ko) * 2021-02-17 2022-08-25
KR102592539B1 (ko) * 2021-08-02 2023-10-23 한국기초과학지원연구원 미세 시편의 특성 측정 방법 및 장치
CN113990765B (zh) * 2021-12-28 2023-04-18 深圳市思坦科技有限公司 柔性发光器件的制备方法、柔性发光器件及发光装置
CN114437350B (zh) * 2022-03-04 2022-09-16 波米科技有限公司 一种聚酰亚胺树脂及其制备方法和应用

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03200838A (ja) * 1989-03-09 1991-09-02 Hoechst Celanese Corp 新規ポリアミド‐ポリイミド及びポリベンゾキサゾール‐ポリイミド重合体
WO2013024849A1 (ja) * 2011-08-18 2013-02-21 東レ株式会社 ポリアミド酸樹脂組成物、ポリイミド樹脂組成物およびポリイミドオキサゾール樹脂組成物ならびにそれらを含有するフレキシブル基板
CN103755987A (zh) * 2014-01-20 2014-04-30 江苏冰城电材股份有限公司 耐热高透明性聚酰亚胺薄膜的制备方法
WO2016035593A1 (ja) * 2014-09-02 2016-03-10 東レ株式会社 樹脂および感光性樹脂組成物
WO2016052323A1 (ja) * 2014-09-30 2016-04-07 東レ株式会社 ディスプレイ用支持基板、それを用いたカラーフィルターおよびその製造方法、有機ｅｌ素子およびその製造方法、ならびにフレキシブル有機ｅｌディスプレイ

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5173561A (en) * 1990-07-24 1992-12-22 Daychem Laboratories, Inc. Heat resistant polyimide-benzoxazole polymers and composites thereof
JPH1180350A (ja) 1997-09-12 1999-03-26 Hitachi Chem Co Ltd 光部品用ポリイミド及びこれを用いた光部品
JP3200838B2 (ja) 2000-12-04 2001-08-20 日本ビクター株式会社 エンコード装置、再生装置
CN101568572B (zh) * 2007-10-26 2012-03-21 旭化成电子材料株式会社 聚酰亚胺前体和包含聚酰亚胺前体的感光性树脂组合物
JP2010085992A (ja) 2008-09-08 2010-04-15 Toyobo Co Ltd 光伝送材料、およびそれを用いた光導波路
JP5428950B2 (ja) * 2010-03-08 2014-02-26 富士電機株式会社 半導体素子用絶縁膜
JP6056548B2 (ja) * 2013-02-27 2017-01-11 日本ゼオン株式会社 配線回路基板の製造方法
KR101685035B1 (ko) * 2013-10-24 2016-12-12 한국화학연구원 박막 트랜지스터 유기 절연체용 고분자 화합물 및 이를 이용한 박막 트랜지스터
KR102345844B1 (ko) * 2014-03-31 2021-12-31 닛산 가가쿠 가부시키가이샤 수지 박막의 제조방법 및 수지 박막형성용 조성물
JP2016204569A (ja) 2015-04-27 2016-12-08 宇部興産株式会社 ポリアミック酸溶液組成物およびポリイミドフィルム

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03200838A (ja) * 1989-03-09 1991-09-02 Hoechst Celanese Corp 新規ポリアミド‐ポリイミド及びポリベンゾキサゾール‐ポリイミド重合体
WO2013024849A1 (ja) * 2011-08-18 2013-02-21 東レ株式会社 ポリアミド酸樹脂組成物、ポリイミド樹脂組成物およびポリイミドオキサゾール樹脂組成物ならびにそれらを含有するフレキシブル基板
CN103755987A (zh) * 2014-01-20 2014-04-30 江苏冰城电材股份有限公司 耐热高透明性聚酰亚胺薄膜的制备方法
WO2016035593A1 (ja) * 2014-09-02 2016-03-10 東レ株式会社 樹脂および感光性樹脂組成物
WO2016052323A1 (ja) * 2014-09-30 2016-04-07 東レ株式会社 ディスプレイ用支持基板、それを用いたカラーフィルターおよびその製造方法、有機ｅｌ素子およびその製造方法、ならびにフレキシブル有機ｅｌディスプレイ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2020095693A1 (ja) * 2018-11-09 2021-09-30 東レ株式会社 ポリイミド前駆体、ポリイミド、ポリイミド樹脂膜、およびフレキシブルデバイス
JP7384037B2 (ja) 2018-11-09 2023-11-21 東レ株式会社 ポリイミド前駆体、ポリイミド、ポリイミド樹脂膜、およびフレキシブルデバイス

Also Published As

Publication number Publication date
TWI710584B (zh) 2020-11-21
JPWO2017221776A1 (ja) 2018-06-21
TW201800446A (zh) 2018-01-01
WO2017221776A1 (ja) 2017-12-28
CN109348718A (zh) 2019-02-15
KR102134263B1 (ko) 2020-07-15
CN109348718B (zh) 2021-03-12
KR20190022487A (ko) 2019-03-06

Similar Documents

Publication Publication Date Title
JP6292351B1 (ja) ポリイミド樹脂、ポリイミド樹脂組成物、それを用いたタッチパネルおよびその製造方法、カラーフィルタおよびその製造方法、液晶素子およびその製造方法、有機ｅｌ素子およびその製造方法
JP6787124B2 (ja) 樹脂積層膜、それを含む積層体、ｔｆｔ基板、有機ｅｌ素子カラーフィルターならびにそれらの製造方法。
KR102207439B1 (ko) 폴리이미드 전구체, 그것으로부터 얻어지는 폴리이미드 수지막, 및 그것을 포함하는 표시 소자, 광학 소자, 수광 소자, 터치 패널, 회로 기판, 유기 ｅｌ 디스플레이, 및 유기 ｅｌ 소자 및 컬러 필터의 제조 방법
US9493614B2 (en) Polyimide precursor, polyimide, flexible substrate prepared therewith, color filter and production method thereof, and flexible display device
JP5928447B2 (ja) フレキシブル基板、表示デバイスおよび受光デバイス
JP6206071B2 (ja) 樹脂組成物、それを用いたポリイミド樹脂膜、それを含むカラーフィルタ、ｔｆｔ基板、表示デバイスおよびそれらの製造方法
JP6369141B2 (ja) 樹脂膜、それを含む積層体、それを用いた有機ｅｌ素子基板、カラーフィルター基板およびそれらの製造方法ならびにフレキシブル有機ｅｌディスプレイ
CN111133054B (zh) 聚酰亚胺前体树脂组合物、聚酰亚胺树脂组合物、聚酰亚胺树脂膜
JP2015078254A (ja) 樹脂組成物、それを用いたポリイミド樹脂膜、それを含むカラーフィルタ、ｔｆｔ基板、表示デバイスおよびそれらの製造方法
JP6331314B2 (ja) フレキシブルカラーフィルター、その製造方法ならびにそれを用いたフレキシブル発光デバイス
WO2018029766A1 (ja) 樹脂積層膜、それを含む積層体、ｔｆｔ基板、有機ｅｌ素子カラーフィルターならびにそれらの製造方法
TW201809140A (zh) 樹脂積層膜、含有其之積層體、ｔｆｔ基板、有機ｅｌ元件、彩色濾光片以及彼等之製造方法

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20171212

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20171215

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20180116

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180129

R151 Written notification of patent or utility model registration

Ref document number: 6292351

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151