JP5928447B2 - フレキシブル基板、表示デバイスおよび受光デバイス - Google Patents
フレキシブル基板、表示デバイスおよび受光デバイス Download PDFInfo
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- JP5928447B2 JP5928447B2 JP2013506404A JP2013506404A JP5928447B2 JP 5928447 B2 JP5928447 B2 JP 5928447B2 JP 2013506404 A JP2013506404 A JP 2013506404A JP 2013506404 A JP2013506404 A JP 2013506404A JP 5928447 B2 JP5928447 B2 JP 5928447B2
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- polyimide
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- 239000000758 substrate Substances 0.000 title claims description 53
- 229920001721 polyimide Polymers 0.000 claims description 158
- 239000004642 Polyimide Substances 0.000 claims description 131
- 125000000962 organic group Chemical group 0.000 claims description 58
- ZCQWOFVYLHDMMC-UHFFFAOYSA-N Oxazole Chemical compound C1=COC=N1 ZCQWOFVYLHDMMC-UHFFFAOYSA-N 0.000 claims description 50
- 125000004432 carbon atom Chemical group C* 0.000 claims description 42
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 24
- 125000005843 halogen group Chemical group 0.000 claims description 22
- 230000009477 glass transition Effects 0.000 claims description 12
- 125000002950 monocyclic group Chemical group 0.000 claims description 12
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 9
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 claims description 9
- 229910052717 sulfur Inorganic materials 0.000 claims description 9
- 125000004434 sulfur atom Chemical group 0.000 claims description 9
- 125000000732 arylene group Chemical group 0.000 claims description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 5
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 claims description 3
- BCMCBBGGLRIHSE-UHFFFAOYSA-N 1,3-benzoxazole Chemical compound C1=CC=C2OC=NC2=C1 BCMCBBGGLRIHSE-UHFFFAOYSA-N 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 88
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 72
- 239000010408 film Substances 0.000 description 69
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 68
- -1 alicyclic diamines Chemical class 0.000 description 60
- 239000002966 varnish Substances 0.000 description 60
- 229920005575 poly(amic acid) Polymers 0.000 description 59
- 238000000034 method Methods 0.000 description 47
- 239000011342 resin composition Substances 0.000 description 46
- 229910052757 nitrogen Inorganic materials 0.000 description 34
- 239000000126 substance Substances 0.000 description 34
- 239000002253 acid Substances 0.000 description 32
- 229920006015 heat resistant resin Polymers 0.000 description 28
- 239000000843 powder Substances 0.000 description 27
- 238000005259 measurement Methods 0.000 description 25
- 239000000203 mixture Substances 0.000 description 25
- 239000009719 polyimide resin Substances 0.000 description 21
- 238000002834 transmittance Methods 0.000 description 21
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 19
- 239000004094 surface-active agent Substances 0.000 description 19
- 238000006243 chemical reaction Methods 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 16
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 14
- 125000003118 aryl group Chemical group 0.000 description 14
- 150000004985 diamines Chemical class 0.000 description 14
- 239000000243 solution Substances 0.000 description 14
- 125000002723 alicyclic group Chemical group 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 13
- 229920000642 polymer Polymers 0.000 description 13
- 150000001875 compounds Chemical class 0.000 description 12
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 11
- 239000007787 solid Substances 0.000 description 11
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 10
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- 238000003756 stirring Methods 0.000 description 10
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 9
- 239000001055 blue pigment Substances 0.000 description 9
- 239000011256 inorganic filler Substances 0.000 description 9
- 229910003475 inorganic filler Inorganic materials 0.000 description 9
- 125000006159 dianhydride group Chemical group 0.000 description 8
- 239000006185 dispersion Substances 0.000 description 8
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical compound FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 description 7
- 150000001805 chlorine compounds Chemical class 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 238000006297 dehydration reaction Methods 0.000 description 7
- 150000002148 esters Chemical class 0.000 description 7
- 239000010419 fine particle Substances 0.000 description 7
- 239000000049 pigment Substances 0.000 description 7
- 230000009467 reduction Effects 0.000 description 7
- 239000000377 silicon dioxide Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- WTQZSMDDRMKJRI-UHFFFAOYSA-N 4-diazoniophenolate Chemical class [O-]C1=CC=C([N+]#N)C=C1 WTQZSMDDRMKJRI-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 238000011161 development Methods 0.000 description 6
- 230000035945 sensitivity Effects 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 5
- 0 CC(*)(*(*)C1(*)*C2(*)C(*)(*)C(C)(*)C(C)(*)C(C)(*)C2(*)*)C(C)(*)C(C)(*)C1=* Chemical compound CC(*)(*(*)C1(*)*C2(*)C(*)(*)C(C)(*)C(C)(*)C(C)(*)C2(*)*)C(C)(*)C(C)(*)C1=* 0.000 description 5
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 5
- 150000008065 acid anhydrides Chemical class 0.000 description 5
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 5
- 238000001914 filtration Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000002244 precipitate Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 5
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000006087 Silane Coupling Agent Substances 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 150000008064 anhydrides Chemical class 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 239000003431 cross linking reagent Substances 0.000 description 4
- WOSVXXBNNCUXMT-UHFFFAOYSA-N cyclopentane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1CC(C(O)=O)C(C(O)=O)C1C(O)=O WOSVXXBNNCUXMT-UHFFFAOYSA-N 0.000 description 4
- 230000018044 dehydration Effects 0.000 description 4
- 229940116333 ethyl lactate Drugs 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 229960004592 isopropanol Drugs 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 3
- QPRQEDXDYOZYLA-UHFFFAOYSA-N 2-methylbutan-1-ol Chemical compound CCC(C)CO QPRQEDXDYOZYLA-UHFFFAOYSA-N 0.000 description 3
- MSXVEPNJUHWQHW-UHFFFAOYSA-N 2-methylbutan-2-ol Chemical compound CCC(C)(C)O MSXVEPNJUHWQHW-UHFFFAOYSA-N 0.000 description 3
- CWLKGDAVCFYWJK-UHFFFAOYSA-N 3-aminophenol Chemical compound NC1=CC=CC(O)=C1 CWLKGDAVCFYWJK-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000002981 blocking agent Substances 0.000 description 3
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 3
- MNUOZFHYBCRUOD-UHFFFAOYSA-N hydroxyphthalic acid Natural products OC(=O)C1=CC=CC(O)=C1C(O)=O MNUOZFHYBCRUOD-UHFFFAOYSA-N 0.000 description 3
- 239000002105 nanoparticle Substances 0.000 description 3
- NMRPBPVERJPACX-UHFFFAOYSA-N octan-3-ol Chemical compound CCCCCC(O)CC NMRPBPVERJPACX-UHFFFAOYSA-N 0.000 description 3
- 239000012860 organic pigment Substances 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 229920002577 polybenzoxazole Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 3
- 238000006798 ring closing metathesis reaction Methods 0.000 description 3
- 238000007363 ring formation reaction Methods 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- MQQRFOXFIPBFOV-UHFFFAOYSA-N 1,2-dimethylcyclobutane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1(C)C(C(O)=O)C(C(O)=O)C1(C)C(O)=O MQQRFOXFIPBFOV-UHFFFAOYSA-N 0.000 description 2
- SBHHKGFHJWTZJN-UHFFFAOYSA-N 1,3-dimethylcyclobutane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1(C)C(C(O)=O)C(C)(C(O)=O)C1C(O)=O SBHHKGFHJWTZJN-UHFFFAOYSA-N 0.000 description 2
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- XFRVVPUIAFSTFO-UHFFFAOYSA-N 1-Tridecanol Chemical compound CCCCCCCCCCCCCO XFRVVPUIAFSTFO-UHFFFAOYSA-N 0.000 description 2
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 2
- BBMCTIGTTCKYKF-UHFFFAOYSA-N 1-heptanol Chemical compound CCCCCCCO BBMCTIGTTCKYKF-UHFFFAOYSA-N 0.000 description 2
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 2
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 2
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 2
- CETWDUZRCINIHU-UHFFFAOYSA-N 2-heptanol Chemical compound CCCCCC(C)O CETWDUZRCINIHU-UHFFFAOYSA-N 0.000 description 2
- NGDNVOAEIVQRFH-UHFFFAOYSA-N 2-nonanol Chemical compound CCCCCCCC(C)O NGDNVOAEIVQRFH-UHFFFAOYSA-N 0.000 description 2
- GPXCORHXFPYJEH-UHFFFAOYSA-N 3-[[3-aminopropyl(dimethyl)silyl]oxy-dimethylsilyl]propan-1-amine Chemical compound NCCC[Si](C)(C)O[Si](C)(C)CCCN GPXCORHXFPYJEH-UHFFFAOYSA-N 0.000 description 2
- 229940018563 3-aminophenol Drugs 0.000 description 2
- IJFXRHURBJZNAO-UHFFFAOYSA-N 3-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=CC(O)=C1 IJFXRHURBJZNAO-UHFFFAOYSA-N 0.000 description 2
- MXLMTQWGSQIYOW-UHFFFAOYSA-N 3-methyl-2-butanol Chemical compound CC(C)C(C)O MXLMTQWGSQIYOW-UHFFFAOYSA-N 0.000 description 2
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 2
- KMKWGXGSGPYISJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KMKWGXGSGPYISJ-UHFFFAOYSA-N 0.000 description 2
- KIFDSGGWDIVQGN-UHFFFAOYSA-N 4-[9-(4-aminophenyl)fluoren-9-yl]aniline Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 KIFDSGGWDIVQGN-UHFFFAOYSA-N 0.000 description 2
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
- BKQICAFAUMRYLZ-UHFFFAOYSA-N 4-methylheptan-3-ol Chemical compound CCCC(C)C(O)CC BKQICAFAUMRYLZ-UHFFFAOYSA-N 0.000 description 2
- YGYCECQIOXZODZ-UHFFFAOYSA-N 4415-87-6 Chemical compound O=C1OC(=O)C2C1C1C(=O)OC(=O)C12 YGYCECQIOXZODZ-UHFFFAOYSA-N 0.000 description 2
- QHHKLPCQTTWFSS-UHFFFAOYSA-N 5-[2-(1,3-dioxo-2-benzofuran-5-yl)-1,1,1,3,3,3-hexafluoropropan-2-yl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)(C(F)(F)F)C(F)(F)F)=C1 QHHKLPCQTTWFSS-UHFFFAOYSA-N 0.000 description 2
- FCOUHTHQYOMLJT-UHFFFAOYSA-N 6-methylheptan-2-ol Chemical compound CC(C)CCCC(C)O FCOUHTHQYOMLJT-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 2
- RZKSECIXORKHQS-UHFFFAOYSA-N Heptan-3-ol Chemical compound CCCCC(O)CC RZKSECIXORKHQS-UHFFFAOYSA-N 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- 206010034972 Photosensitivity reaction Diseases 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000003377 acid catalyst Substances 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 125000004849 alkoxymethyl group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- RWZYAGGXGHYGMB-UHFFFAOYSA-N anthranilic acid Chemical compound NC1=CC=CC=C1C(O)=O RWZYAGGXGHYGMB-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 2
- VAYBSUUSYTWKBX-UHFFFAOYSA-N bicyclo[2.2.1]heptane-2,3,3,4-tetracarboxylic acid Chemical compound C1CC2(C(O)=O)C(C(O)=O)(C(O)=O)C(C(=O)O)C1C2 VAYBSUUSYTWKBX-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
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- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 125000004427 diamine group Chemical group 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- 150000001989 diazonium salts Chemical class 0.000 description 1
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- ZXPDYFSTVHQQOI-UHFFFAOYSA-N diethoxysilane Chemical compound CCO[SiH2]OCC ZXPDYFSTVHQQOI-UHFFFAOYSA-N 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- XSWSEQPWKOWORN-UHFFFAOYSA-N dodecan-2-ol Chemical compound CCCCCCCCCCC(C)O XSWSEQPWKOWORN-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000001056 green pigment Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical group 0.000 description 1
- ZNYQHFLBAPNPRC-UHFFFAOYSA-N heptadecan-2-ol Chemical compound CCCCCCCCCCCCCCCC(C)O ZNYQHFLBAPNPRC-UHFFFAOYSA-N 0.000 description 1
- PWSKHLMYTZNYKO-UHFFFAOYSA-N heptane-1,7-diamine Chemical compound NCCCCCCCN PWSKHLMYTZNYKO-UHFFFAOYSA-N 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- NPZTUJOABDZTLV-UHFFFAOYSA-N hydroxybenzotriazole Substances O=C1C=CC=C2NNN=C12 NPZTUJOABDZTLV-UHFFFAOYSA-N 0.000 description 1
- BTFJIXJJCSYFAL-UHFFFAOYSA-N icosan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCCCO BTFJIXJJCSYFAL-UHFFFAOYSA-N 0.000 description 1
- 238000002329 infrared spectrum Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 150000004668 long chain fatty acids Chemical class 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- KBOPZPXVLCULAV-UHFFFAOYSA-N mesalamine Chemical compound NC1=CC=C(O)C(C(O)=O)=C1 KBOPZPXVLCULAV-UHFFFAOYSA-N 0.000 description 1
- 229960004963 mesalazine Drugs 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- QQZOPKMRPOGIEB-UHFFFAOYSA-N n-butyl methyl ketone Natural products CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 1
- OBKARQMATMRWQZ-UHFFFAOYSA-N naphthalene-1,2,5,6-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 OBKARQMATMRWQZ-UHFFFAOYSA-N 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- CHDRADPXNRULGA-UHFFFAOYSA-N naphthalene-1,3-dicarboxylic acid Chemical compound C1=CC=CC2=CC(C(=O)O)=CC(C(O)=O)=C21 CHDRADPXNRULGA-UHFFFAOYSA-N 0.000 description 1
- ABMFBCRYHDZLRD-UHFFFAOYSA-N naphthalene-1,4-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1 ABMFBCRYHDZLRD-UHFFFAOYSA-N 0.000 description 1
- PIBOYDKDKYEQCX-UHFFFAOYSA-N naphthalene-1,5-diamine;naphthalene-2,6-diamine Chemical compound C1=C(N)C=CC2=CC(N)=CC=C21.C1=CC=C2C(N)=CC=CC2=C1N PIBOYDKDKYEQCX-UHFFFAOYSA-N 0.000 description 1
- DFFZOPXDTCDZDP-UHFFFAOYSA-N naphthalene-1,5-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=CC2=C1C(O)=O DFFZOPXDTCDZDP-UHFFFAOYSA-N 0.000 description 1
- VCFXAYFIMPGWMJ-UHFFFAOYSA-N naphthalene-1,5-dione;sulfuryl dichloride;diazide Chemical compound [N-]=[N+]=[N-].[N-]=[N+]=[N-].ClS(Cl)(=O)=O.O=C1C=CC=C2C(=O)C=CC=C21 VCFXAYFIMPGWMJ-UHFFFAOYSA-N 0.000 description 1
- VAWFFNJAPKXVPH-UHFFFAOYSA-N naphthalene-1,6-dicarboxylic acid Chemical compound OC(=O)C1=CC=CC2=CC(C(=O)O)=CC=C21 VAWFFNJAPKXVPH-UHFFFAOYSA-N 0.000 description 1
- JSKSILUXAHIKNP-UHFFFAOYSA-N naphthalene-1,7-dicarboxylic acid Chemical compound C1=CC=C(C(O)=O)C2=CC(C(=O)O)=CC=C21 JSKSILUXAHIKNP-UHFFFAOYSA-N 0.000 description 1
- HRRDCWDFRIJIQZ-UHFFFAOYSA-N naphthalene-1,8-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=C2C(C(=O)O)=CC=CC2=C1 HRRDCWDFRIJIQZ-UHFFFAOYSA-N 0.000 description 1
- DOBFTMLCEYUAQC-UHFFFAOYSA-N naphthalene-2,3,6,7-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=C2C=C(C(O)=O)C(C(=O)O)=CC2=C1 DOBFTMLCEYUAQC-UHFFFAOYSA-N 0.000 description 1
- KHARCSTZAGNHOT-UHFFFAOYSA-N naphthalene-2,3-dicarboxylic acid Chemical compound C1=CC=C2C=C(C(O)=O)C(C(=O)O)=CC2=C1 KHARCSTZAGNHOT-UHFFFAOYSA-N 0.000 description 1
- WPUMVKJOWWJPRK-UHFFFAOYSA-N naphthalene-2,7-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=CC2=CC(C(=O)O)=CC=C21 WPUMVKJOWWJPRK-UHFFFAOYSA-N 0.000 description 1
- QXYWIOWTBOREMG-UHFFFAOYSA-N nonadecan-2-ol Chemical compound CCCCCCCCCCCCCCCCCC(C)O QXYWIOWTBOREMG-UHFFFAOYSA-N 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- UMRZSTCPUPJPOJ-KNVOCYPGSA-N norbornane Chemical compound C1C[C@H]2CC[C@@H]1C2 UMRZSTCPUPJPOJ-KNVOCYPGSA-N 0.000 description 1
- UEYGDIASMOPQFG-UHFFFAOYSA-N octane-1,3,5,7-tetracarboxylic acid Chemical compound OC(=O)C(C)CC(C(O)=O)CC(C(O)=O)CCC(O)=O UEYGDIASMOPQFG-UHFFFAOYSA-N 0.000 description 1
- 239000001053 orange pigment Substances 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- UFOIOXZLTXNHQH-UHFFFAOYSA-N oxolane-2,3,4,5-tetracarboxylic acid Chemical compound OC(=O)C1OC(C(O)=O)C(C(O)=O)C1C(O)=O UFOIOXZLTXNHQH-UHFFFAOYSA-N 0.000 description 1
- HVNWRBWNOPYOER-UHFFFAOYSA-N pentane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C(C)C(C(O)=O)C(C(O)=O)CC(O)=O HVNWRBWNOPYOER-UHFFFAOYSA-N 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- CLYVDMAATCIVBF-UHFFFAOYSA-N pigment red 224 Chemical compound C=12C3=CC=C(C(OC4=O)=O)C2=C4C=CC=1C1=CC=C2C(=O)OC(=O)C4=CC=C3C1=C42 CLYVDMAATCIVBF-UHFFFAOYSA-N 0.000 description 1
- 239000003880 polar aprotic solvent Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- RLUCXJBHKHIDSP-UHFFFAOYSA-N propane-1,2-diol;propanoic acid Chemical compound CCC(O)=O.CC(O)CO RLUCXJBHKHIDSP-UHFFFAOYSA-N 0.000 description 1
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical group CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000001057 purple pigment Substances 0.000 description 1
- JRDBISOHUUQXHE-UHFFFAOYSA-N pyridine-2,3,5,6-tetracarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)N=C1C(O)=O JRDBISOHUUQXHE-UHFFFAOYSA-N 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000001054 red pigment Substances 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 125000005649 substituted arylene group Chemical group 0.000 description 1
- 229950000244 sulfanilic acid Drugs 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 150000003456 sulfonamides Chemical group 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- OAXARSVKYJPDPA-UHFFFAOYSA-N tert-butyl 4-prop-2-ynylpiperazine-1-carboxylate Chemical compound CC(C)(C)OC(=O)N1CCN(CC#C)CC1 OAXARSVKYJPDPA-UHFFFAOYSA-N 0.000 description 1
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 1
- BRGJIIMZXMWMCC-UHFFFAOYSA-N tetradecan-2-ol Chemical compound CCCCCCCCCCCCC(C)O BRGJIIMZXMWMCC-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- QEMXHQIAXOOASZ-UHFFFAOYSA-N tetramethylammonium Chemical compound C[N+](C)(C)C QEMXHQIAXOOASZ-UHFFFAOYSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- NBOMNTLFRHMDEZ-UHFFFAOYSA-N thiosalicylic acid Chemical compound OC(=O)C1=CC=CC=C1S NBOMNTLFRHMDEZ-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 238000000870 ultraviolet spectroscopy Methods 0.000 description 1
- FVHPPQILUTTWCV-UHFFFAOYSA-N undecane-1,3,7,9-tetracarboxylic acid Chemical compound CCC(C(O)=O)CC(C(O)=O)CCCC(C(O)=O)CCC(O)=O FVHPPQILUTTWCV-UHFFFAOYSA-N 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000001052 yellow pigment Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/22—Polybenzoxazoles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Description
6インチのミラーシリコンウェハーに、東京エレクトロン株式会社製の塗布現像装置 Mark−7を用いて、140℃×4分のプリベーク後の膜厚が15±0.5μmになるようにワニスをスピン塗布した。その後、同じくMark−7のホットプレートを用いて140℃×4分のプリベーク処理を行った。プリベーク膜をイナートオーブン(光洋サーモシステム株式会社製 INH−21CD)を用いて窒素気流下(酸素濃度20ppm以下)、3.5℃/minで300℃又は350℃まで昇温し、30分間保持し、5℃/minで50℃まで冷却し耐熱性樹脂膜を作製した。続いてフッ酸に1〜4分間浸漬して耐熱性樹脂膜を基板から剥離し、風乾して耐熱性樹脂膜を得た。
50mm×50mm×1.1mm厚のガラス基板(テンパックス)に、ミカサ株式会社製のスピンコーターMS−A200を用いて140℃×4分のプリベーク後の膜厚が15±0.5μmになるようにワニスをスピン塗布した。その後、大日本スクリーン株式会社製ホットプレートD−SPINを用いて140℃×4分のプリベーク処理を行った。プリベーク膜をイナートオーブン(光洋サーモシステム株式会社製 INH−21CD)を用いて窒素気流下(酸素濃度20ppm以下)、3.5℃/minで300℃又は350℃まで昇温し、30分間保持し、5℃/minで50℃まで冷却し耐熱性樹脂膜(ガラス基板上)を作製した。
1/4に切断した4インチシリコン基板に、ミカサ株式会社製のスピンコーターMS−A200を用いて140℃×4分のプリベーク後の膜厚が5±0.5μmになるようにワニスをスピン塗布した。その後、大日本スクリーン株式会社製ホットプレートD−SPINを用いて140℃×4分のプリベーク処理を行った。プリベーク膜をイナートオーブン(光洋サーモシステム株式会社製 INH−21CD)を用いて窒素気流下(酸素濃度20ppm以下)、3.5℃/minで300℃又は350℃まで昇温し、30分間保持し、5℃/minで50℃まで冷却し耐熱性樹脂膜(シリコン基板上)を作製した。
紫外可視分光光度計(株式会社島津製作所製 MultiSpec1500)を用い、400nmにおける光透過率を測定した。なお、測定には(2)で作製した耐熱性樹脂膜を用いた。
直読ヘーズコンピュータ(スガ試験機株式会社製 HGM2DP、C光源)を用い、(1)で作製した耐熱性樹脂膜の全光線透過率を測定した。なお、Ttとしては1回測定の値を用いた。なお、測定には(1)で作製した耐熱性樹脂膜を用いた。
プリズムカプラー(METRICON社製、PC2010)を用い、波長632.8nmのTE屈折率(n(TE))およびTM屈折率(n(TM))を測定した。n(TE)、n(TM)は、それぞれポリイミド膜面に対して、平行、垂直方向の屈折率である。平均屈折率n(AV)は((2×n(TE)2+n(TM)2)/3)^0.5から算出し、面内/面外複屈折はn(TE)とn(TM)の差(n(TE)−n(TM))として計算した。なお、測定には(3)で作製した耐熱性樹脂膜を用いた。
熱機械分析装置(エスアイアイ・ナノテクノロジー株式会社製 EXSTAR6000 TMA/SS6000)を用いて、窒素気流下で測定を行った。昇温方法は、以下の条件にて行った。第1段階で昇温レート5℃/minで150度まで昇温して試料の吸着水を除去し、第2段階で降温レート5℃/minで室温まで空冷した。第3段階で、昇温レート5℃/minで本測定を行い、ガラス転移温度を求めた。また第3段階における50〜200℃の線膨張係数の平均から線膨張係数(CTE)を求めた。なお、測定には(1)で作製した耐熱性樹脂膜を用いた。
熱重量測定装置(株式会社島津製作所製 TGA−50)を用いて窒素気流下で測定を行った。昇温方法は、以下の条件にて行った。第1段階で、昇温レート3.5℃/minで350度まで昇温して試料の吸着水を除去し、第2段階で、降温レート10℃/min室温まで冷却した。第3段階で、昇温レート10℃/minで本測定を行い、1%熱重量減少温度を求めた。なお、測定には(1)で作製した耐熱性樹脂膜を用いた。
テンシロン(株式会社オリエンテック RTM−100)を用いて測定を行った。各試料につき10サンプル以上測定を行い、JIS個数平均(JIS K−6301)を用いてJIS平均値を算出した。なお、測定には(1)で作製した耐熱性樹脂膜を用いた。
代表的な色空間であるCIELABのb*値の測定をSMカラーコンピューター(スガ試験機株式会社 SM−7−CH)を用いて行った。光源にはC光源を用い、測定は透過光モードで行った。なお、CIELABにおいてb*値は黄色と青色の座標であり、b*>0では黄色寄り、b*<0では青色寄りに対応する。なお、測定には(1)で作製した耐熱性樹脂膜を用いた。
実施例で作製した感光性樹脂組成物(ワニス)を8インチシリコンウエハ上に回転塗布し、次いで、ホットプレート(東京エレクトロン株式会社製、塗布現像装置Mark−7)を用いて、120℃で3分間熱処理(プリベーク)し、厚さ2〜4μmのプリベーク膜を作製した。得られたプリベーク膜を、i線ステッパー(GCA社製、DSW−8000)を用いて20〜320mJ/cm2の露光量にて10mJ/cm2ステップで露光した。露光に用いたライン&スペースパターンは1、2、3、4、5、6、7、8、9、10、15、20、30、50、100μmである。露光後、2.38重量%のテトラメチルアンモニウム(TMAH)水溶液(三菱ガス化学株式会社製、ELM−D)で60秒間現像し、次いで純水でリンスし、レリーフパターンを得た。なお、プリベーク後および現像後の膜厚は、大日本スクリーン製造株式会社製光干渉式膜厚測定装置ラムダエースSTM−602を使用し、屈折率1.63として測定した。
現像膜減り量は以下の式に従って算出した。
現像膜減り量(μm)=プリベーク後の膜厚−現像後の膜厚
露光、現像後、10μm及び20μmのライン&スペースパターン(1L/1S)が1対1に形成される最小の露光量を感度とした。
PMDA−HH:1S,2S,4R,5R−シクロへキサンテトラカルボン酸二無水物
PMDA−HS:1R,2S,4S,5R−シクロへキサンテトラカルボン酸二無水物
BPDA−H:3,3’,4,4’−ジシクロへキサンテトラカルボン酸二無水物
PMDA:ピロメリット酸二無水物
BPDA:3,3’,4,4’−ビフェニルテトラカルボン酸二無水物
ODPA:3,3’,4,4’−オキシジフタル酸二無水物
6FDA:4,4’−(ヘキサフルオロイソプロピリデン)ジフタル酸無水物
HFHA:2,2−ビス[3−(3−アミノベンズアミド)−4−ヒドロキシフェニル]ヘキサフルオロプロパン
FDA:9,9−ビス(4−アミノフェニル)フルオレン
CHDA:trans−1,4−ジアミノシクロへキサン
PDA:p−フェニレンジアミン
m−TB:2,2’−ジメチル−4,4’−ジアミノビフェニル
TFMB:2,2’−ビス(トリフルオロメチル)ベンジジン
m−BAPS:ビス[4−(3−アミノフェノキシ)フェニル]スルホン
SiDA:1,3−ビス(3−アミノプロピル)テトラメチルジシロキサン
MAP:m−アミノフェノール
NMP:N−メチル−2−ピロリドン
GBL:ガンマブチロラクトン
EL:乳酸エチル
DFA:ジメチルホルムアミドジメチルアセタール
乾燥窒素気流下、100mL4つ口フラスコにPMDA−HH2.7704g(12mmol)、HFHA7.4706g(12mmol)、NMP50gを入れて80℃で加熱撹拌した。8時間後、冷却してワニスとした。
乾燥窒素気流下、100mL4つ口フラスコにPMDA−HS2.7704g(12mmol)、HFHA7.4706g(12mmol)、NMP50gを入れて80℃で加熱撹拌した。8時間後、冷却してワニスとした。
乾燥窒素気流下、100mL4つ口フラスコにBPDA−H3.4441g(11mmol)、HFHA6.7969g(11mmol)、NMP50gを入れて80℃で加熱撹拌した。8時間後、冷却してワニスとした。
乾燥窒素気流下、100mL4つ口フラスコにPMDA−HH2.7704g(12mmol)、HFHA6.5286g(10.8mmol)、FDA0.4181g(1.2mmol)NMP50gを入れて80℃で加熱撹拌した。8時間後、冷却してワニスとした。
乾燥窒素気流下、100mL4つ口フラスコにBPDA1.0238g(3.48mmol)、PMDA−HH1.9099g(8.52mmol)、CHDA0.4110g(3.60mmol)、HFHA5.0778g(8.40mmol)、NMP50gを入れて80℃で加熱撹拌した。8時間後、冷却してワニスとした。
乾燥窒素気流下、100mL4つ口フラスコにPMDA−HS3.4345g(15.3mmol)、HFHA8.7985g(14.5mmol)、FDA0.2669g(0.8mmol)、NMP50gを入れて30℃で加熱撹拌した。6時間後、冷却してワニスとした。
乾燥窒素気流下、100mL4つ口フラスコにPMDA−HS3.4893g(15.6mmol)、HFHA8.4683g(14.0mmol)、FDA0.5424g(1.6mmol)、NMP50gを入れて30℃で加熱撹拌した。8時間後、冷却してワニスとした。
乾燥窒素気流下、100mL4つ口フラスコにPMDA−HS3.6042g(16.1mmol)、HFHA7.7753g(12.9mmol)、FDA1.1204g(3.2mmol)、NMP50gを入れて30℃で加熱撹拌した。6時間後、冷却してワニスとした。
乾燥窒素気流下、100mL4つ口フラスコにPMDA−HS3.7270g(16.6mmol)、HFHA7.0351g(11.6mmol)、FDA1.7379g(5.0mmol)、NMP50gを入れて30℃で加熱撹拌した。6時間後、冷却してワニスとした。
乾燥窒素気流下、100mL4つ口フラスコにPMDA−HS3.8584g(17.2mmol)、HFHA6.2427g(10.3mmol)、FDA2.3989g(6.9mmol)、NMP50gを入れて30℃で加熱撹拌した。6時間後、冷却してワニスとした。
乾燥窒素気流下、100mL4つ口フラスコにPMDA−HS3.9994g(17.8mmol)、HFHA5.3924g(8.9mmol)、FDA3.1082g(8.9mmol)、NMP50gを入れて30℃で加熱撹拌した。6時間後、冷却してワニスとした。
乾燥窒素気流下、100mL4つ口フラスコにPMDA2.7154g(12mmol)、HFHA7.5255g(12mmol)、NMP50gを入れて50℃で加熱撹拌した。2時間後、冷却してワニスとした。
乾燥窒素気流下、100mL4つ口フラスコにBPDA3.3527g(11mmol)、HFHA6.8883g(11mmol)、NMP50gを入れて50℃で加熱撹拌した。2時間後、冷却してワニスとした。
乾燥窒素気流下、100mL4つ口フラスコにODPA3.4731g(11mmol)、HFHA6.7679g(11mmol)、NMP50gを入れて50℃で加熱撹拌した。2時間後、冷却してワニスとした。
乾燥窒素気流下、100mL4つ口フラスコにPMDA−HH5.2599g(23mmol)、m−TB4.9811g(23mmol)、NMP50gを入れて50℃で加熱撹拌した。2時間後、冷却してワニスとした。
乾燥窒素気流下、100mL4つ口フラスコに6FDA7.0599g(15.9mmol)、HFHA9.6068g(15.9mmol)、NMP50gを入れて30℃で加熱撹拌した。6時間後、冷却してワニスとした。
乾燥窒素気流下、100mL4つ口フラスコに6FDA7.2639g(16.4mmol)、TFMB5.2361g(16.4mmol)、NMP50gを入れて30℃で加熱撹拌した。6時間後、冷却してワニスとした。
乾燥窒素気流下、100mL4つ口フラスコに6FDA8.4450g(19.0mmol)、m−BAPS8.2216g(19.0mmol)、NMP50gを入れて30℃で加熱撹拌した。6時間後、冷却してワニスとした。
乾燥窒素気流下、100mL4つ口フラスコに6FDA7.824g(17.6mmol)、FDA2.4547g(7.0mmol)、HFHA6・3879g(10.6mmol)、NMP50gを入れて30℃で加熱撹拌した。6時間後、冷却してワニスとした。
乾燥窒素気流下、100mL4つ口フラスコにPMDA−HH5.1472g(23mmol)、TFMB7.3528g(23mmol)、NMP50gを入れて50℃で加熱撹拌した。6時間後、冷却してワニスとした。
乾燥窒素気流下、100mL4つ口フラスコにPMDA−HS5.6897g(25.4mmol)、m−BAPS10.9770g(25.4mmol)、NMP50gを入れて50℃で加熱撹拌した。6時間後、冷却してワニスとした。
乾燥窒素気流下、100mL4つ口フラスコにBPDA−H9.2384g(30.2mmol)、PDA3.2616g(30.2mmol)、NMP50gを入れて50℃で加熱撹拌した。6時間後、冷却してワニスとした。
乾燥窒素気流下、HFHA121.5804g(0.201mol)をNMP400gに溶解した。ここにPMDA−HS45.5372g(0.203mol)をNMP100gとともに加えて、30℃で6時間撹拌した。その後、室温で12時間撹拌した。その後、180℃で4時間撹拌した。撹拌終了後、溶液を水3Lに投入して、ポリマー固体の沈殿をろ過で集めた。さらに水3Lで5回洗浄を行い、集めたポリマー固体を50℃の乾燥機で72時間乾燥し、ポリイミド粉末を得た。得られたポリイミド粉末15gにGBL47.5gを加えてポリイミドワニスを得た。
乾燥窒素気流下、HFHA62.4272g(0.103mol)、FDA23.9891g(0.069mol)をNMP400gに溶解した。ここにPMDA−HS38.9695g(0.174mol)をNMP100gとともに加えて、30℃で6時間撹拌した。その後、室温で12時間撹拌した。その後、180℃で4時間撹拌した。撹拌終了後、溶液を水3Lに投入して、ポリマー固体の沈殿をろ過で集めた。さらに水3Lで5回洗浄を行い、集めたポリマー固体を50℃の乾燥機で72時間乾燥し、ポリイミド粉末を得た。得られたポリイミド粉末15gにGBL47.5gを加えてポリイミドワニスを得た。
乾燥窒素気流下、HFHA121.5804g(0.201mol)をNMP400gに溶解した。ここにPMDA−HS45.5372g(0.203mol)をNMP100gとともに加えて、30℃で6時間撹拌した。その後、室温で12時間撹拌した。その後、180℃で4時間撹拌した。撹拌終了後、溶液を水3Lに投入して、ポリマー固体の沈殿をろ過で集めた。さらに水3Lで5回洗浄を行い、集めたポリマー固体を50℃の乾燥機で72時間乾燥し、ポリイミド粉末を得た。得られたポリイミド粉末を窒素気流下350℃のオーブンで30分間熱処理し、ポリイミドオキサゾール粉末を得た。得られたポリイミドオキサゾール粉末15gにNMP47.5gを加えてポリイミドオキサゾールワニスを得た。
乾燥窒素気流下、HFHA62.4272g(0.103mol)、FDA23.9891g(0.069mol)をNMP400gに溶解した。ここにPMDA−HS38.9695g(0.174mol)をNMP100gとともに加えて、30℃で6時間撹拌した。その後、室温で12時間撹拌した。その後、180℃で4時間撹拌した。撹拌終了後、溶液を水3Lに投入して、ポリマー固体の沈殿をろ過で集めた。さらに水3Lで5回洗浄を行い、集めたポリマー固体を50℃の乾燥機で72時間乾燥し、ポリイミド粉末を得た。得られたポリイミド粉末を窒素気流下350℃のオーブンで30分間熱処理し、ポリイミドオキサゾール粉末を得た。得られたポリイミドオキサゾール粉末15gにNMP47.5gを加えてポリイミドオキサゾールワニスを得た。
実施例1で得たワニス100重量部に対してシリカ微粒子が10重量部となるように、ポリアミド酸ワニスにオルガノシリカゾル(日産化学工業株式会社製、商品名PMA−ST、粒子径10−30nm)を添加し、ポリアミド酸−シリカナノ粒子ワニスを得た。
実施例1で得たワニス100重量部に対してシリカ微粒子が20重量部となるように、ポリアミド酸ワニスにオルガノシリカゾル(日産化学工業株式会社製、商品名PMA−ST、粒子径10−30nm)を添加し、ポリアミド酸−シリカナノ粒子ワニスを得た。
実施例1で得たワニス100重量部に対してシリカ微粒子が30重量部となるように、ポリアミド酸ワニスにオルガノシリカゾル(日産化学工業株式会社製、商品名PMA−ST、粒子径10−30nm)を添加し、ポリアミド酸−シリカナノ粒子ワニスを得た。
実施例13で得たポリイミド粉末4gに界面活性剤ポリフロー77(商品名、共栄社化学株式会社製)0.044g、GBL13.47gを加えてポリイミドワニスを得た。
実施例13で得たポリイミド粉末4gに界面活性剤ポリフロー77(商品名、共栄社化学株式会社製)0.044g、エピクロン850−S(商品名、大日本インキ化学工業株式会社)0.2g、GBL13.47gを加えてポリイミドワニスを得た。
実施例13で得たポリイミド粉末4gに界面活性剤ポリフロー77(商品名、共栄社化学株式会社製)0.044g、エピクロン850−S(商品名、大日本インキ化学工業株式会社)0.4g、GBL13.47gを加えてポリイミドワニスを得た。
実施例13で得たポリイミド粉末4gに界面活性剤ポリフロー77(商品名、共栄社化学株式会社製)0.044g、エピクロン850−S(商品名、大日本インキ化学工業株式会社)0.8g、GBL13.47gを加えてポリイミドワニスを得た。
117gのPB15:6(平均一次粒径30nm)、140gの味の素ファインテクノ製“アジスパー”PB821のプロピレングリコールモノメチルエーテルアセテート溶液(30重量%)、93gのダイセル化学工業株式会社製“サイクロマー”ACA250(45重量%溶液)、および627gのプロピレングリコールモノメチルエーテルアセテートをホモディスパーで攪拌してスラリーを作製した。このスラリーを入れたビーカーを循環式ビーズミル分散機(ウイリー・エ・バッコーフェン社製“ダイノーミル”KDL−A)とチューブでつなぎ、メディアとして直径0.3mmのジルコニアビーズを使用して、3200rpm、3時間の分散処理を行い、青色顔料分散液を得た。得られた青色顔料分散液0.4167gにGBL49.5833gを加え希釈溶液を得た。
実施例13で得たポリイミド粉末13gに界面活性剤ポリフロー77(商品名、共栄社化学株式会社製)0.013g、GBL36.3gを加えてポリイミドワニスを得た。
実施例13で得たポリイミド粉末13gに界面活性剤ポリフロー77(商品名、共栄社化学株式会社製)0.013g、参考例1で得た青色顔料分散液0.325g、GBL36.3gを加えてポリイミドワニスを得た。
実施例13で得たポリイミド粉末13gに界面活性剤ポリフロー77(商品名、共栄社化学株式会社製)0.013g、参考例1で得た青色顔料分散液0.650g、GBL36.3gを加えてポリイミドワニスを得た。
実施例13で得たポリイミド粉末13gに界面活性剤ポリフロー77(商品名、共栄社化学株式会社製)0.013g、参考例1で得た青色顔料分散液0.975g、GBL36.3gを加えてポリイミドワニスを得た。
実施例13で得たポリイミド粉末13gに界面活性剤ポリフロー77(商品名、共栄社化学株式会社製)0.013g、参考例1で得た青色顔料分散液1.300g、GBL36.3gを加えてポリイミドワニスを得た。
実施例13で得たポリイミド粉末13gに界面活性剤ポリフロー77(商品名、共栄社化学株式会社製)0.013g、参考例1で得た青色顔料分散液1.625g、GBL36.3gを加えてポリイミドワニスを得た。
実施例13で得たポリイミド粉末13gに界面活性剤ポリフロー77(商品名、共栄社化学株式会社製)0.013g、参考例1で得た青色顔料分散液2.600g、GBL36.3gを加えてポリイミドワニスを得た。
乾燥窒素気流下、HFHA22.4g(0.037モル)、SiDA0.58g(0.0023モル)をNMP105gに溶解した。ここにODPA5.75g(0.018モル)をNMP20gとともに加えて、40℃で1時間撹拌した。その後、PMDA−HH6.23gをNMP20gとともに加え、80℃で8時間撹拌し、続いて室温で11時間撹拌した。その後、MAP1.011gをNMP15gとともに加えて、60℃で1時間撹拌した。その後、DFA4.60g(0.038モル)をNMP10gで希釈した溶液を滴下し、滴下後、60℃で1時間撹拌を続けた。その後、同様の操作を2回行った。その後、室温下で酢酸16.69gを加え、1時間撹拌した。撹拌終了後、溶液を水2Lに投入して、ポリマー固体の沈殿をろ過で集めた。さらに水2Lで5回洗浄を行い、集めたポリマー固体を50℃の乾燥機で72時間乾燥し、ポリアミド酸エステル粉末を得た。
実施例12で得たポリイミド粉末4.646gにキノンジアジド化合物HAP−170(東洋合成株式会社製)0.929g、熱架橋剤HMOM(本州化学株式会社製)0.664g、界面活性剤ポリフロー77(商品名、共栄社化学株式会社製)0.011g、GBL18.75gを加えて感光性樹脂組成物のワニスを得た。得られたワニスを用いて上記(9)の方法でレリーフパターンを作製し感光性評価を行ったところ、現像膜減り量は1.27μm、感度は125mJ/cm2であった。
Claims (13)
- 一般式(2)中のR1が、下記一般式(4)〜(10)から選ばれた1以上であることを特徴とする請求項1に記載のフレキシブル基板。
(一般式(4)〜(10)中、R4〜R79は各々独立に水素原子、ハロゲン原子またはハロゲン原子で水素原子が置換されていてもよい炭素数1〜3の1価の有機基を示す。一般式(7)中、X3は、酸素原子、硫黄原子、スルホニル基もしくはハロゲン原子で水素原子が置換されていてもよい炭素数1〜3の2価の有機基またはそれらが2以上連結してなる2価の架橋構造である。一般式(10)中、X4は直接結合、酸素原子、硫黄原子、スルホニル基、ハロゲン原子で水素原子が置換されていてもよい炭素数1〜3の2価の有機基もしくはハロゲン原子で水素原子が置換されていてもよいアリーレン基または酸素原子、硫黄原子、スルホニル基、ハロゲン原子で水素原子が置換されていてもよい炭素数1〜3の2価の有機基およびハロゲン原子で水素原子が置換されていてもよいアリーレン基から選ばれた2以上が連結してなる2価の架橋構造である。) - 前記ポリイミドの複屈折が0.01以下であることを特徴とする請求項1〜4のいずれかに記載のフレキシブル基板。
- 前記ポリイミドのガラス転位温度が300℃以上であることを特徴とする請求項5に記載のフレキシブル基板。
- 一般式(3)で表される構造単位を主成分とするポリイミドオキサゾールを含有することを特徴とするフレキシブル基板。
(一般式(3)中、R1は単環式もしくは縮合多環式の脂環構造を有する炭素数4〜40の4価の有機基または単環式の脂環構造を有する有機基が直接もしくは架橋構造を介して相互に連結された炭素数4〜40の4価の有機基を示す。R3は炭素数2〜40の4価の有機基を示す。ただし、一般式(3)で表される構造単位を主成分とするポリイミドオキサゾールは、一般式(37)で表される構造単位を10%〜50%含む。)
(一般式(37)中、R 1 は単環式もしくは縮合多環式の脂環構造を有する炭素数4〜40の4価の有機基または単環式の脂環構造を有する有機基が直接もしくは架橋構造を介して相互に連結された炭素数4〜40の4価の有機基を示す。) - 一般式(3)中のR1が、下記一般式(4)〜(10)から選ばれた1以上であることを特徴とする請求項7または8に記載のフレキシブル基板。
(一般式(4)〜(10)中、R4〜R79は各々独立に水素原子、ハロゲン原子またはハロゲン原子で水素原子が置換されていてもよい炭素数1〜3の1価の有機基を示す。一般式(7)中、X3は、酸素原子、硫黄原子、スルホニル基もしくはハロゲン原子で水素原子が置換されていてもよい炭素数1〜3の2価の有機基またはそれらが2以上連結してなる2価の架橋構造である。一般式(10)中、X4は直接結合、酸素原子、硫黄原子、スルホニル基、ハロゲン原子で水素原子が置換されていてもよい炭素数1〜3の2価の有機基もしくはハロゲン原子で水素原子が置換されていてもよいアリーレン基または酸素原子、硫黄原子、スルホニル基、ハロゲン原子で水素原子が置換されていてもよい炭素数1〜3の2価の有機基およびハロゲン原子で水素原子が置換されていてもよいアリーレン基から選ばれた2以上が連結してなる2価の架橋構造である。) - 前記ポリイミドオキサゾールの複屈折が0.01以下であることを特徴とする請求項7〜9のいずれかに記載のフレキシブル基板。
- 前記ポリイミドオキサゾールのガラス転移温度が300℃以上であることを特徴とする請求項10に記載のフレキシブル基板。
- 前記請求項1〜11のいずれかに記載のフレキシブル基板を備えたことを特徴とする表示デバイス。
- 前記請求項1〜11のいずれかに記載のフレキシブル基板を備えたことを特徴とする受光デバイス。
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KR102384507B1 (ko) * | 2014-09-02 | 2022-04-08 | 도레이 카부시키가이샤 | 수지 및 감광성 수지 조성물 |
KR102656566B1 (ko) * | 2015-03-26 | 2024-04-12 | 도레이 카부시키가이샤 | 수지 적층막, 그것을 포함하는 적층체, tft 기판, 유기 el 소자 컬러 필터 및 그들의 제조 방법 |
CN107406673B (zh) * | 2015-03-30 | 2019-09-06 | 东丽株式会社 | 着色树脂组合物、着色膜、装饰基板及触摸面板 |
CN104830169A (zh) * | 2015-05-11 | 2015-08-12 | 黄强 | 用于汽车发动机的耐磨涂料 |
JP6819292B2 (ja) * | 2015-10-23 | 2021-01-27 | 東レ株式会社 | ディスプレイ基板用樹脂組成物、並びに、それを用いた耐熱性樹脂フィルム、有機elディスプレイ基板及び有機elディスプレイの製造方法 |
JP6718678B2 (ja) * | 2015-12-25 | 2020-07-08 | ソマール株式会社 | ポリイミド共重合体及びそれを用いた成形体 |
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KR102127033B1 (ko) * | 2016-04-26 | 2020-06-25 | 주식회사 엘지화학 | 네가티브 타입 감광성 수지 조성물 및 이를 포함하는 유기 발광 소자 블랙 매트릭스 |
US20190161581A1 (en) * | 2016-05-06 | 2019-05-30 | Mitsubishi Gas Chemical Company, Inc. | Polyimide resin |
JP6768234B2 (ja) * | 2016-05-09 | 2020-10-14 | 三菱瓦斯化学株式会社 | ポリイミド及びポリイミドフィルム |
JP6292351B1 (ja) * | 2016-06-24 | 2018-03-14 | 東レ株式会社 | ポリイミド樹脂、ポリイミド樹脂組成物、それを用いたタッチパネルおよびその製造方法、カラーフィルタおよびその製造方法、液晶素子およびその製造方法、有機el素子およびその製造方法 |
CN109311297A (zh) * | 2016-07-15 | 2019-02-05 | 宇部兴产株式会社 | 聚酰亚胺层叠体的制造方法及柔性电路基板的制造方法 |
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WO2018062296A1 (ja) * | 2016-09-30 | 2018-04-05 | 住友化学株式会社 | ポリイミド系高分子ワニスの製造方法、ポリイミド系高分子フィルムの製造方法、及び、透明ポリイミド系高分子フィルム |
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CN113166409B (zh) * | 2018-11-09 | 2023-07-28 | 东丽株式会社 | 聚酰亚胺前体、聚酰亚胺、聚酰亚胺树脂膜、及柔性器件 |
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