JP6263846B2 - 電磁波シールド用フィルム、および電子部品の被覆方法 - Google Patents
電磁波シールド用フィルム、および電子部品の被覆方法 Download PDFInfo
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- JP6263846B2 JP6263846B2 JP2013051098A JP2013051098A JP6263846B2 JP 6263846 B2 JP6263846 B2 JP 6263846B2 JP 2013051098 A JP2013051098 A JP 2013051098A JP 2013051098 A JP2013051098 A JP 2013051098A JP 6263846 B2 JP6263846 B2 JP 6263846B2
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0031—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields combining different shielding materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/027—Thermal properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/03—3 layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013051098A JP6263846B2 (ja) | 2012-08-16 | 2013-03-13 | 電磁波シールド用フィルム、および電子部品の被覆方法 |
KR1020147035705A KR101799631B1 (ko) | 2012-08-16 | 2013-08-14 | 전자파 차폐용 필름, 및 전자부품의 피복 방법 |
PCT/JP2013/071923 WO2014027673A1 (ja) | 2012-08-16 | 2013-08-14 | 電磁波シールド用フィルム、および電子部品の被覆方法 |
SG11201501162UA SG11201501162UA (en) | 2012-08-16 | 2013-08-14 | Electromagnetic shielding film and method of covering electronic component |
CN201380043449.XA CN104584707A (zh) | 2012-08-16 | 2013-08-14 | 电磁波屏蔽用膜和电子部件的覆盖方法 |
TW102129544A TW201419996A (zh) | 2012-08-16 | 2013-08-16 | 電磁波遮蔽用膜片及電子零件之被覆方法 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012180537 | 2012-08-16 | ||
JP2012180537 | 2012-08-16 | ||
JP2013051098A JP6263846B2 (ja) | 2012-08-16 | 2013-03-13 | 電磁波シールド用フィルム、および電子部品の被覆方法 |
Publications (2)
Publication Number | Publication Date |
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JP2014057041A JP2014057041A (ja) | 2014-03-27 |
JP6263846B2 true JP6263846B2 (ja) | 2018-01-24 |
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Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
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JP2013051098A Active JP6263846B2 (ja) | 2012-08-16 | 2013-03-13 | 電磁波シールド用フィルム、および電子部品の被覆方法 |
JP2013051100A Active JP6263847B2 (ja) | 2012-08-16 | 2013-03-13 | 電磁波シールド用フィルム、および電子部品の被覆方法 |
JP2013051099A Expired - Fee Related JP6225437B2 (ja) | 2012-08-16 | 2013-03-13 | 電磁波シールド用フィルム、および電子部品の被覆方法 |
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JP6225437B2 (ja) | 2017-11-08 |
JP6225436B2 (ja) | 2017-11-08 |
KR101799630B1 (ko) | 2017-11-20 |
SG11201501162UA (en) | 2015-04-29 |
TWI675617B (zh) | 2019-10-21 |
JP2014057041A (ja) | 2014-03-27 |
WO2014027673A1 (ja) | 2014-02-20 |
JP2014057042A (ja) | 2014-03-27 |
JP6263847B2 (ja) | 2018-01-24 |
KR20150042747A (ko) | 2015-04-21 |
TW201419996A (zh) | 2014-05-16 |
KR20150044853A (ko) | 2015-04-27 |
SG11201501165XA (en) | 2015-05-28 |
JP2014057043A (ja) | 2014-03-27 |
TW201419997A (zh) | 2014-05-16 |
CN104584707A (zh) | 2015-04-29 |
CN104584708A (zh) | 2015-04-29 |
KR101799631B1 (ko) | 2017-11-20 |
JP2014057040A (ja) | 2014-03-27 |
WO2014027672A1 (ja) | 2014-02-20 |
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