JP6192646B2 - 高性能な電気的に安定した半導電性の金属酸化物層の製造法、当該方法により製造された層および当該層の使用 - Google Patents
高性能な電気的に安定した半導電性の金属酸化物層の製造法、当該方法により製造された層および当該層の使用 Download PDFInfo
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- JP6192646B2 JP6192646B2 JP2014533817A JP2014533817A JP6192646B2 JP 6192646 B2 JP6192646 B2 JP 6192646B2 JP 2014533817 A JP2014533817 A JP 2014533817A JP 2014533817 A JP2014533817 A JP 2014533817A JP 6192646 B2 JP6192646 B2 JP 6192646B2
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- metal oxide
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- metal
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- 239000012702 metal oxide precursor Substances 0.000 claims description 48
- 230000015572 biosynthetic process Effects 0.000 claims description 40
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- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 29
- 239000000758 substrate Substances 0.000 claims description 29
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- 229910001195 gallium oxide Inorganic materials 0.000 claims description 24
- 239000011787 zinc oxide Substances 0.000 claims description 24
- 239000012298 atmosphere Substances 0.000 claims description 23
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| PCT/EP2012/067804 WO2013050221A1 (de) | 2011-10-07 | 2012-09-12 | Verfahren zur herstellung von hochperformanten und elektrisch stabilen, halbleitenden metalloxidschichten, nach dem verfahren hergestellte schichten und deren verwendung |
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| DE102012209918A1 (de) | 2012-06-13 | 2013-12-19 | Evonik Industries Ag | Verfahren zur Herstellung Indiumoxid-haltiger Schichten |
| DE102013212018A1 (de) | 2013-06-25 | 2015-01-08 | Evonik Industries Ag | Metalloxid-Prekursoren, sie enthaltende Beschichtungszusammensetzungen, und ihre Verwendung |
| DE102013109451B9 (de) | 2013-08-30 | 2017-07-13 | Osram Oled Gmbh | Verfahren zur Herstellung eines optoelektronischen Bauelements |
| EP2874187B1 (en) | 2013-11-15 | 2020-01-01 | Evonik Operations GmbH | Low contact resistance thin film transistor |
| DE102014202718A1 (de) | 2014-02-14 | 2015-08-20 | Evonik Degussa Gmbh | Beschichtungszusammensetzung, Verfahren zu ihrer Herstellung und ihre Verwendung |
| US10892327B2 (en) | 2015-09-14 | 2021-01-12 | University College Cork | Semi-metal rectifying junction |
| US9515158B1 (en) | 2015-10-20 | 2016-12-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor structure with insertion layer and method for manufacturing the same |
| DE102015121067B4 (de) * | 2015-12-03 | 2018-10-18 | Technische Universität Dresden | Verfahren zur Reparaturvorbereitung von Faser-Kunststoff-Verbünden |
| GB2549951B (en) * | 2016-05-03 | 2019-11-20 | Metodiev Lavchiev Ventsislav | Light emitting structures and systems on the basis of group-IV material(s) for the ultra violet and visible spectral range |
| KR101914835B1 (ko) * | 2016-11-18 | 2018-11-02 | 아주대학교산학협력단 | 금속산화물 이종 접합 구조, 이의 제조방법 및 이를 포함하는 박막트랜지스터 |
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| WO2019200164A1 (en) * | 2018-04-11 | 2019-10-17 | The Regents Of The University Of California | Devices and methods for detecting/discriminating complementary and mismatched nucleic acids using ultrathin film field-effect transistors |
| US11282966B2 (en) | 2019-03-06 | 2022-03-22 | Hewlett-Packard Development Company, L.P. | Semiconductor materials |
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| US7604839B2 (en) * | 2000-07-31 | 2009-10-20 | Los Alamos National Security, Llc | Polymer-assisted deposition of films |
| US20060088962A1 (en) | 2004-10-22 | 2006-04-27 | Herman Gregory S | Method of forming a solution processed transistor having a multilayer dielectric |
| JP4021435B2 (ja) * | 2004-10-25 | 2007-12-12 | ヒタチグローバルストレージテクノロジーズネザーランドビーブイ | 垂直磁気記録媒体、その製造方法及び磁気記録再生装置 |
| US7374984B2 (en) * | 2004-10-29 | 2008-05-20 | Randy Hoffman | Method of forming a thin film component |
| RU2305346C2 (ru) * | 2004-11-29 | 2007-08-27 | Федеральное Государственное Унитарное Предприятие "Научно-исследовательский физико-химический институт им. Л.Я. Карпова" (НИФХИ им. Л.Я. Карпова) | Тонкопленочный материал диэлектрика затвора с высокой диэлектрической проницаемостью и способ его получения (варианты) |
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-
2011
- 2011-10-07 DE DE102011084145A patent/DE102011084145A1/de not_active Ceased
-
2012
- 2012-09-12 EP EP12758475.3A patent/EP2748857B1/de not_active Not-in-force
- 2012-09-12 US US14/348,948 patent/US9059299B2/en not_active Expired - Fee Related
- 2012-09-12 WO PCT/EP2012/067804 patent/WO2013050221A1/de not_active Ceased
- 2012-09-12 IN IN3328CHN2014 patent/IN2014CN03328A/en unknown
- 2012-09-12 JP JP2014533817A patent/JP6192646B2/ja not_active Expired - Fee Related
- 2012-09-12 KR KR1020147011596A patent/KR102060492B1/ko not_active Expired - Fee Related
- 2012-09-12 CN CN201280060170.8A patent/CN103959478B/zh not_active Expired - Fee Related
- 2012-09-12 RU RU2014118033/28A patent/RU2601210C2/ru not_active IP Right Cessation
- 2012-10-03 TW TW101136507A patent/TWI555088B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI555088B (zh) | 2016-10-21 |
| US9059299B2 (en) | 2015-06-16 |
| CN103959478B (zh) | 2016-10-26 |
| EP2748857A1 (de) | 2014-07-02 |
| IN2014CN03328A (enExample) | 2015-07-03 |
| KR20140072148A (ko) | 2014-06-12 |
| JP2015501529A (ja) | 2015-01-15 |
| WO2013050221A1 (de) | 2013-04-11 |
| US20150053966A1 (en) | 2015-02-26 |
| TW201334070A (zh) | 2013-08-16 |
| DE102011084145A1 (de) | 2013-04-11 |
| CN103959478A (zh) | 2014-07-30 |
| EP2748857B1 (de) | 2018-06-13 |
| KR102060492B1 (ko) | 2020-02-11 |
| RU2014118033A (ru) | 2015-11-27 |
| RU2601210C2 (ru) | 2016-10-27 |
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