JP6160775B2 - 電子材料用エポキシ樹脂組成物、その硬化物および電子部材 - Google Patents
電子材料用エポキシ樹脂組成物、その硬化物および電子部材 Download PDFInfo
- Publication number
- JP6160775B2 JP6160775B2 JP2016531415A JP2016531415A JP6160775B2 JP 6160775 B2 JP6160775 B2 JP 6160775B2 JP 2016531415 A JP2016531415 A JP 2016531415A JP 2016531415 A JP2016531415 A JP 2016531415A JP 6160775 B2 JP6160775 B2 JP 6160775B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- electronic materials
- electronic
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003822 epoxy resin Substances 0.000 title claims description 208
- 229920000647 polyepoxide Polymers 0.000 title claims description 208
- 239000000203 mixture Substances 0.000 title claims description 116
- 239000012776 electronic material Substances 0.000 title claims description 101
- 239000000463 material Substances 0.000 claims description 38
- 239000000945 filler Substances 0.000 claims description 36
- 239000004065 semiconductor Substances 0.000 claims description 33
- 239000011231 conductive filler Substances 0.000 claims description 31
- 239000000853 adhesive Substances 0.000 claims description 25
- 230000001070 adhesive effect Effects 0.000 claims description 25
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 23
- 239000003566 sealing material Substances 0.000 claims description 21
- 239000003795 chemical substances by application Substances 0.000 claims description 18
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 10
- 239000000377 silicon dioxide Substances 0.000 claims description 8
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 7
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims description 6
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- 239000000395 magnesium oxide Substances 0.000 claims description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 6
- 229910052582 BN Inorganic materials 0.000 claims description 5
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 5
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 5
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000010432 diamond Substances 0.000 claims description 4
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- 229910052580 B4C Inorganic materials 0.000 claims description 2
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims description 2
- -1 magnesium halide Chemical class 0.000 description 46
- 238000000034 method Methods 0.000 description 36
- 229920005989 resin Polymers 0.000 description 33
- 239000011347 resin Substances 0.000 description 33
- 238000001723 curing Methods 0.000 description 31
- 239000003063 flame retardant Substances 0.000 description 29
- 239000000047 product Substances 0.000 description 29
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 28
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 26
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 26
- 238000005259 measurement Methods 0.000 description 25
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 24
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 21
- 239000011342 resin composition Substances 0.000 description 19
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 18
- 239000010410 layer Substances 0.000 description 18
- 239000002245 particle Substances 0.000 description 18
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 17
- 239000002904 solvent Substances 0.000 description 17
- 239000011521 glass Substances 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000002184 metal Substances 0.000 description 16
- 239000004305 biphenyl Substances 0.000 description 14
- 235000010290 biphenyl Nutrition 0.000 description 14
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 14
- 239000003960 organic solvent Substances 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 13
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 12
- 239000002313 adhesive film Substances 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 11
- 150000001875 compounds Chemical class 0.000 description 11
- 238000002844 melting Methods 0.000 description 11
- 229920003986 novolac Polymers 0.000 description 11
- 239000000243 solution Substances 0.000 description 11
- 239000000758 substrate Substances 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 239000004593 Epoxy Substances 0.000 description 10
- 239000002585 base Substances 0.000 description 10
- 239000007822 coupling agent Substances 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 10
- 230000008018 melting Effects 0.000 description 10
- 238000002156 mixing Methods 0.000 description 10
- 238000003786 synthesis reaction Methods 0.000 description 10
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 9
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 9
- 229910052736 halogen Inorganic materials 0.000 description 9
- 150000002367 halogens Chemical class 0.000 description 9
- 150000002989 phenols Chemical class 0.000 description 9
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 8
- 239000011256 inorganic filler Substances 0.000 description 8
- 229910003475 inorganic filler Inorganic materials 0.000 description 8
- 229910052757 nitrogen Inorganic materials 0.000 description 8
- 229910052698 phosphorus Inorganic materials 0.000 description 8
- 238000005406 washing Methods 0.000 description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 7
- 239000007864 aqueous solution Substances 0.000 description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 239000004744 fabric Substances 0.000 description 7
- 150000002430 hydrocarbons Chemical group 0.000 description 7
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 7
- 239000011574 phosphorus Substances 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 229920000877 Melamine resin Polymers 0.000 description 6
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 6
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- 239000000654 additive Substances 0.000 description 6
- 239000004760 aramid Substances 0.000 description 6
- 235000014113 dietary fatty acids Nutrition 0.000 description 6
- 239000000194 fatty acid Substances 0.000 description 6
- 229930195729 fatty acid Natural products 0.000 description 6
- 238000011049 filling Methods 0.000 description 6
- 229920001296 polysiloxane Polymers 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- SXLICQAHDZSUJO-UHFFFAOYSA-N 2-[[3-[3,5-bis(oxiran-2-ylmethoxy)phenyl]-5-(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical group C(C1CO1)OC=1C=C(C=C(C=1)OCC1CO1)C1=CC(=CC(=C1)OCC1CO1)OCC1CO1 SXLICQAHDZSUJO-UHFFFAOYSA-N 0.000 description 5
- HZRWLEPSEHEGBC-UHFFFAOYSA-N 2-[[4-[2,4-bis(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C1OC1COC(C=C1)=CC=C1C(C(=C1)OCC2OC2)=CC=C1OCC1CO1 HZRWLEPSEHEGBC-UHFFFAOYSA-N 0.000 description 5
- JXIHHSCVRHCBET-UHFFFAOYSA-N C(C1CO1)OC=1C=C(C=C(C=1)OCC1CO1)C1=CC=C(C=C1)OCC1CO1 Chemical group C(C1CO1)OC=1C=C(C=C(C=1)OCC1CO1)C1=CC=C(C=C1)OCC1CO1 JXIHHSCVRHCBET-UHFFFAOYSA-N 0.000 description 5
- 239000004793 Polystyrene Substances 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229920003235 aromatic polyamide Polymers 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000000835 fiber Substances 0.000 description 5
- 239000005350 fused silica glass Substances 0.000 description 5
- 230000005484 gravity Effects 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- 239000000976 ink Substances 0.000 description 5
- 239000011229 interlayer Substances 0.000 description 5
- 238000003475 lamination Methods 0.000 description 5
- 239000000155 melt Substances 0.000 description 5
- 229920000098 polyolefin Polymers 0.000 description 5
- 235000013824 polyphenols Nutrition 0.000 description 5
- 229920002223 polystyrene Polymers 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 5
- 125000001424 substituent group Chemical group 0.000 description 5
- 238000004381 surface treatment Methods 0.000 description 5
- 239000003643 water by type Substances 0.000 description 5
- XRBNDLYHPCVYGC-UHFFFAOYSA-N 4-phenylbenzene-1,2,3-triol Chemical group OC1=C(O)C(O)=CC=C1C1=CC=CC=C1 XRBNDLYHPCVYGC-UHFFFAOYSA-N 0.000 description 4
- NWDURASZIAUTSB-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetrol Chemical group OC1=C(O)C(O)=CC(C=2C=CC=CC=2)=C1O NWDURASZIAUTSB-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 150000007973 cyanuric acids Chemical class 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 150000004665 fatty acids Chemical class 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- 239000012796 inorganic flame retardant Substances 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000004745 nonwoven fabric Substances 0.000 description 4
- 125000002524 organometallic group Chemical group 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- 150000003018 phosphorus compounds Chemical class 0.000 description 4
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 4
- 239000005060 rubber Substances 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- VERMEZLHWFHDLK-UHFFFAOYSA-N tetrahydroxybenzene Natural products OC1=CC=C(O)C(O)=C1O VERMEZLHWFHDLK-UHFFFAOYSA-N 0.000 description 4
- 239000001993 wax Substances 0.000 description 4
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 3
- XOSCKTQMAZSFBZ-UHFFFAOYSA-N 2-[[1-[[2,7-bis(oxiran-2-ylmethoxy)naphthalen-1-yl]methyl]-7-(oxiran-2-ylmethoxy)naphthalen-2-yl]oxymethyl]oxirane Chemical compound C1OC1COC(C=C1C=2CC=3C4=CC(OCC5OC5)=CC=C4C=CC=3OCC3OC3)=CC=C1C=CC=2OCC1CO1 XOSCKTQMAZSFBZ-UHFFFAOYSA-N 0.000 description 3
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 3
- 150000001408 amides Chemical class 0.000 description 3
- 125000003710 aryl alkyl group Chemical group 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 238000010533 azeotropic distillation Methods 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 229930003836 cresol Natural products 0.000 description 3
- 239000003085 diluting agent Substances 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000012774 insulation material Substances 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000000691 measurement method Methods 0.000 description 3
- 229910000000 metal hydroxide Inorganic materials 0.000 description 3
- 150000004692 metal hydroxides Chemical class 0.000 description 3
- 238000001471 micro-filtration Methods 0.000 description 3
- 239000006082 mold release agent Substances 0.000 description 3
- 230000007935 neutral effect Effects 0.000 description 3
- 239000004843 novolac epoxy resin Substances 0.000 description 3
- 150000002903 organophosphorus compounds Chemical class 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 229960001755 resorcinol Drugs 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- 238000001721 transfer moulding Methods 0.000 description 3
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 2
- SSUJUUNLZQVZMO-UHFFFAOYSA-N 1,2,3,4,8,9,10,10a-octahydropyrimido[1,2-a]azepine Chemical compound C1CCC=CN2CCCNC21 SSUJUUNLZQVZMO-UHFFFAOYSA-N 0.000 description 2
- ULQISTXYYBZJSJ-UHFFFAOYSA-N 12-hydroxyoctadecanoic acid Chemical compound CCCCCCC(O)CCCCCCCCCCC(O)=O ULQISTXYYBZJSJ-UHFFFAOYSA-N 0.000 description 2
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 2
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 description 2
- DNVXWIINBUTFEP-UHFFFAOYSA-N 2-[(2-phenylphenoxy)methyl]oxirane Chemical group C1OC1COC1=CC=CC=C1C1=CC=CC=C1 DNVXWIINBUTFEP-UHFFFAOYSA-N 0.000 description 2
- KUDMLFNTBWSXMA-UHFFFAOYSA-N 2-[[2-[2,4-bis(oxiran-2-ylmethoxy)phenyl]-5-(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical group C1OC1COC(C=1)=CC=C(C=2C(=CC(OCC3OC3)=CC=2)OCC2OC2)C=1OCC1CO1 KUDMLFNTBWSXMA-UHFFFAOYSA-N 0.000 description 2
- ZMMYFBNHTSBCNX-UHFFFAOYSA-N 2-[[2-[2,5-bis(oxiran-2-ylmethoxy)phenyl]-4-(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=C(C=C1)OCC1CO1)C1=C(C=CC(=C1)OCC1CO1)OCC1CO1 ZMMYFBNHTSBCNX-UHFFFAOYSA-N 0.000 description 2
- JNNQZXVGWSQQCF-UHFFFAOYSA-N 2-[[4-[2,6-bis(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C(=CC=C1)OCC1CO1)C1=CC=C(C=C1)OCC1CO1 JNNQZXVGWSQQCF-UHFFFAOYSA-N 0.000 description 2
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 2
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- XSTITJMSUGCZDH-UHFFFAOYSA-N 4-(4-hydroxy-2,6-dimethylphenyl)-3,5-dimethylphenol Chemical compound CC1=CC(O)=CC(C)=C1C1=C(C)C=C(O)C=C1C XSTITJMSUGCZDH-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical class [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- NJYZCEFQAIUHSD-UHFFFAOYSA-N acetoguanamine Chemical compound CC1=NC(N)=NC(N)=N1 NJYZCEFQAIUHSD-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000000304 alkynyl group Chemical group 0.000 description 2
- 150000004645 aluminates Chemical class 0.000 description 2
- ZRIUUUJAJJNDSS-UHFFFAOYSA-N ammonium phosphates Chemical compound [NH4+].[NH4+].[NH4+].[O-]P([O-])([O-])=O ZRIUUUJAJJNDSS-UHFFFAOYSA-N 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 150000001639 boron compounds Chemical class 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 229910002026 crystalline silica Inorganic materials 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 2
- PPQREHKVAOVYBT-UHFFFAOYSA-H dialuminum;tricarbonate Chemical compound [Al+3].[Al+3].[O-]C([O-])=O.[O-]C([O-])=O.[O-]C([O-])=O PPQREHKVAOVYBT-UHFFFAOYSA-H 0.000 description 2
- 239000000539 dimer Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 229910001701 hydrotalcite Inorganic materials 0.000 description 2
- 229960001545 hydrotalcite Drugs 0.000 description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 150000002484 inorganic compounds Chemical class 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 2
- 239000001095 magnesium carbonate Substances 0.000 description 2
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 2
- 239000000347 magnesium hydroxide Substances 0.000 description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 239000005078 molybdenum compound Substances 0.000 description 2
- 150000002752 molybdenum compounds Chemical class 0.000 description 2
- JKQOBWVOAYFWKG-UHFFFAOYSA-N molybdenum trioxide Chemical compound O=[Mo](=O)=O JKQOBWVOAYFWKG-UHFFFAOYSA-N 0.000 description 2
- VSWALKINGSNVAR-UHFFFAOYSA-N naphthalen-1-ol;phenol Chemical compound OC1=CC=CC=C1.C1=CC=C2C(O)=CC=CC2=C1 VSWALKINGSNVAR-UHFFFAOYSA-N 0.000 description 2
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 2
- GLDOVTGHNKAZLK-UHFFFAOYSA-N octadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCCO GLDOVTGHNKAZLK-UHFFFAOYSA-N 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- 150000002894 organic compounds Chemical group 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 239000003444 phase transfer catalyst Substances 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 235000021317 phosphate Nutrition 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000002798 polar solvent Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- 238000010125 resin casting Methods 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 2
- 150000004756 silanes Chemical class 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 230000000930 thermomechanical effect Effects 0.000 description 2
- 150000003918 triazines Chemical class 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 230000004580 weight loss Effects 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- XAEWLETZEZXLHR-UHFFFAOYSA-N zinc;dioxido(dioxo)molybdenum Chemical compound [Zn+2].[O-][Mo]([O-])(=O)=O XAEWLETZEZXLHR-UHFFFAOYSA-N 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KGSFMPRFQVLGTJ-UHFFFAOYSA-N 1,1,2-triphenylethylbenzene Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(C=1C=CC=CC=1)CC1=CC=CC=C1 KGSFMPRFQVLGTJ-UHFFFAOYSA-N 0.000 description 1
- BOJZPUPAXYETRK-UHFFFAOYSA-N 1,1-diphenylethane-1,2-diamine Chemical compound C=1C=CC=CC=1C(N)(CN)C1=CC=CC=C1 BOJZPUPAXYETRK-UHFFFAOYSA-N 0.000 description 1
- QMMJWQMCMRUYTG-UHFFFAOYSA-N 1,2,4,5-tetrachloro-3-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=C(Cl)C(Cl)=CC(Cl)=C1Cl QMMJWQMCMRUYTG-UHFFFAOYSA-N 0.000 description 1
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical class NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- LDVVTQMJQSCDMK-UHFFFAOYSA-N 1,3-dihydroxypropan-2-yl formate Chemical compound OCC(CO)OC=O LDVVTQMJQSCDMK-UHFFFAOYSA-N 0.000 description 1
- VDFVNEFVBPFDSB-UHFFFAOYSA-N 1,3-dioxane Chemical compound C1COCOC1 VDFVNEFVBPFDSB-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- IVORCBKUUYGUOL-UHFFFAOYSA-N 1-ethynyl-2,4-dimethoxybenzene Chemical compound COC1=CC=C(C#C)C(OC)=C1 IVORCBKUUYGUOL-UHFFFAOYSA-N 0.000 description 1
- LHENQXAPVKABON-UHFFFAOYSA-N 1-methoxypropan-1-ol Chemical compound CCC(O)OC LHENQXAPVKABON-UHFFFAOYSA-N 0.000 description 1
- 229940114072 12-hydroxystearic acid Drugs 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- PISLZQACAJMAIO-UHFFFAOYSA-N 2,4-diethyl-6-methylbenzene-1,3-diamine Chemical compound CCC1=CC(C)=C(N)C(CC)=C1N PISLZQACAJMAIO-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- CZAZXHQSSWRBHT-UHFFFAOYSA-N 2-(2-hydroxyphenyl)-3,4,5,6-tetramethylphenol Chemical compound OC1=C(C)C(C)=C(C)C(C)=C1C1=CC=CC=C1O CZAZXHQSSWRBHT-UHFFFAOYSA-N 0.000 description 1
- QLVPICNVQBBOQP-UHFFFAOYSA-N 2-(4,6-diamino-1,3,5-triazin-2-yl)guanidine Chemical compound NC(N)=NC1=NC(N)=NC(N)=N1 QLVPICNVQBBOQP-UHFFFAOYSA-N 0.000 description 1
- VVHFXJOCUKBZFS-UHFFFAOYSA-N 2-(chloromethyl)-2-methyloxirane Chemical compound ClCC1(C)CO1 VVHFXJOCUKBZFS-UHFFFAOYSA-N 0.000 description 1
- SFRDXVJWXWOTEW-UHFFFAOYSA-N 2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)CO SFRDXVJWXWOTEW-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- POMPZOFEAYYLPI-UHFFFAOYSA-N 2-[[1-[[2,7-bis(oxiran-2-ylmethoxy)naphthalen-1-yl]-phenylmethyl]-7-(oxiran-2-ylmethoxy)naphthalen-2-yl]oxymethyl]oxirane Chemical compound C1OC1COC(C=C1C=2C(C=3C=CC=CC=3)C=3C4=CC(OCC5OC5)=CC=C4C=CC=3OCC3OC3)=CC=C1C=CC=2OCC1CO1 POMPZOFEAYYLPI-UHFFFAOYSA-N 0.000 description 1
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 1
- ZPOSDFKOVORWDE-UHFFFAOYSA-N 2-[[2,3,4-tris(oxiran-2-ylmethoxy)-5-phenylphenoxy]methyl]oxirane Chemical group C1OC1COC(C(=C1OCC2OC2)OCC2OC2)=CC(C=2C=CC=CC=2)=C1OCC1CO1 ZPOSDFKOVORWDE-UHFFFAOYSA-N 0.000 description 1
- VNUKLQYQCJHDEH-UHFFFAOYSA-N 2-[[2,3,5-tris(oxiran-2-ylmethoxy)-6-phenylphenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C(=CC(=C1OCC1CO1)OCC1CO1)OCC1CO1)C1=CC=CC=C1 VNUKLQYQCJHDEH-UHFFFAOYSA-N 0.000 description 1
- RSFLEKSVJYAMAC-UHFFFAOYSA-N 2-[[2,3-bis(oxiran-2-ylmethoxy)-4-[2-(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=CC(=C1OCC1CO1)OCC1CO1)C1=C(C=CC=C1)OCC1CO1 RSFLEKSVJYAMAC-UHFFFAOYSA-N 0.000 description 1
- UGENTTUZINEAAY-UHFFFAOYSA-N 2-[[2,3-bis(oxiran-2-ylmethoxy)-4-[3-(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=CC(=C1OCC1CO1)OCC1CO1)C1=CC(=CC=C1)OCC1CO1 UGENTTUZINEAAY-UHFFFAOYSA-N 0.000 description 1
- QAYOBGLKUAILLR-UHFFFAOYSA-N 2-[[2,3-bis(oxiran-2-ylmethoxy)-4-phenylphenoxy]methyl]oxirane Chemical group C1OC1COC(C=1OCC2OC2)=CC=C(C=2C=CC=CC=2)C=1OCC1CO1 QAYOBGLKUAILLR-UHFFFAOYSA-N 0.000 description 1
- VQXSGVDHZUVLPK-UHFFFAOYSA-N 2-[[2,3-bis(oxiran-2-ylmethoxy)-5-phenylphenoxy]methyl]oxirane Chemical group C(C1CO1)OC=1C=C(C=C(C=1OCC1CO1)OCC1CO1)C1=CC=CC=C1 VQXSGVDHZUVLPK-UHFFFAOYSA-N 0.000 description 1
- CTSNVMIQEVYJGA-UHFFFAOYSA-N 2-[[2,4,5-tris(oxiran-2-ylmethoxy)-3-phenylphenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C(=C(C=C1OCC1CO1)OCC1CO1)OCC1CO1)C1=CC=CC=C1 CTSNVMIQEVYJGA-UHFFFAOYSA-N 0.000 description 1
- CFBLZDFTMWHFFN-UHFFFAOYSA-N 2-[[2,4-bis(oxiran-2-ylmethoxy)-3-[2-(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C(=CC=C1OCC1CO1)OCC1CO1)C1=C(C=CC=C1)OCC1CO1 CFBLZDFTMWHFFN-UHFFFAOYSA-N 0.000 description 1
- SXMXXNSHJUXXNG-UHFFFAOYSA-N 2-[[2,4-bis(oxiran-2-ylmethoxy)-3-[3-(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C(=CC=C1OCC1CO1)OCC1CO1)C1=CC(=CC=C1)OCC1CO1 SXMXXNSHJUXXNG-UHFFFAOYSA-N 0.000 description 1
- DZMFZLPIMIMBPR-UHFFFAOYSA-N 2-[[2,4-bis(oxiran-2-ylmethoxy)-3-phenylphenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C(=CC=C1OCC1CO1)OCC1CO1)C1=CC=CC=C1 DZMFZLPIMIMBPR-UHFFFAOYSA-N 0.000 description 1
- RLJFLOKZRRSEGL-UHFFFAOYSA-N 2-[[2,4-bis(oxiran-2-ylmethoxy)-6-[3-(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=C(C=C1OCC1CO1)OCC1CO1)C1=CC(=CC=C1)OCC1CO1 RLJFLOKZRRSEGL-UHFFFAOYSA-N 0.000 description 1
- NRIAIMGEQWHJGR-UHFFFAOYSA-N 2-[[2,4-bis(oxiran-2-ylmethoxy)-6-[4-(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=C(C=C1OCC1CO1)OCC1CO1)C1=CC=C(C=C1)OCC1CO1 NRIAIMGEQWHJGR-UHFFFAOYSA-N 0.000 description 1
- ODXQUHUXEFJQAD-UHFFFAOYSA-N 2-[[2,4-bis(oxiran-2-ylmethoxy)-6-phenylphenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=C(C=C1OCC1CO1)OCC1CO1)C1=CC=CC=C1 ODXQUHUXEFJQAD-UHFFFAOYSA-N 0.000 description 1
- NVENZNXDZVKNRQ-UHFFFAOYSA-N 2-[[2,5-bis(oxiran-2-ylmethoxy)-4-[2-(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=C(C(=C1)OCC1CO1)OCC1CO1)C1=C(C=CC=C1)OCC1CO1 NVENZNXDZVKNRQ-UHFFFAOYSA-N 0.000 description 1
- NJVJIQBTUDJBLT-UHFFFAOYSA-N 2-[[2,5-bis(oxiran-2-ylmethoxy)-4-[3-(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=C(C(=C1)OCC1CO1)OCC1CO1)C1=CC(=CC=C1)OCC1CO1 NJVJIQBTUDJBLT-UHFFFAOYSA-N 0.000 description 1
- QSLLUNPCDALKRQ-UHFFFAOYSA-N 2-[[2,5-bis(oxiran-2-ylmethoxy)-4-[4-(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=C(C(=C1)OCC1CO1)OCC1CO1)C1=CC=C(C=C1)OCC1CO1 QSLLUNPCDALKRQ-UHFFFAOYSA-N 0.000 description 1
- HMQWKUNQXDKGQS-UHFFFAOYSA-N 2-[[2,5-bis(oxiran-2-ylmethoxy)-4-phenylphenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=C(C(=C1)OCC1CO1)OCC1CO1)C1=CC=CC=C1 HMQWKUNQXDKGQS-UHFFFAOYSA-N 0.000 description 1
- UORFYVIVSBCLKN-UHFFFAOYSA-N 2-[[2,6-bis(oxiran-2-ylmethoxy)-3-[4-(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=CC(=C1OCC1CO1)OCC1CO1)C1=CC=C(C=C1)OCC1CO1 UORFYVIVSBCLKN-UHFFFAOYSA-N 0.000 description 1
- BNZRTMJYRUGMAL-UHFFFAOYSA-N 2-[[2,6-bis(oxiran-2-ylmethoxy)-4-[2-(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=CC=C1)C1=CC(=C(C(=C1)OCC1CO1)OCC1CO1)OCC1CO1 BNZRTMJYRUGMAL-UHFFFAOYSA-N 0.000 description 1
- HWTDPEOGPJLZGT-UHFFFAOYSA-N 2-[[2,6-bis(oxiran-2-ylmethoxy)-4-[3-(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C(C1CO1)OC=1C=C(C=C(C=1OCC1CO1)OCC1CO1)C1=CC(=CC=C1)OCC1CO1 HWTDPEOGPJLZGT-UHFFFAOYSA-N 0.000 description 1
- RYOHOKHQHUOVPG-UHFFFAOYSA-N 2-[[2,6-bis(oxiran-2-ylmethoxy)-4-[4-(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C(C1CO1)OC=1C=C(C=C(C=1OCC1CO1)OCC1CO1)C1=CC=C(C=C1)OCC1CO1 RYOHOKHQHUOVPG-UHFFFAOYSA-N 0.000 description 1
- VBCWYMUDZFADBW-UHFFFAOYSA-N 2-[[2-[2,3-bis(oxiran-2-ylmethoxy)phenyl]-3-(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=CC=C1OCC1CO1)C1=C(C=CC=C1OCC1CO1)OCC1CO1 VBCWYMUDZFADBW-UHFFFAOYSA-N 0.000 description 1
- BKTRTUHEFZGAMX-UHFFFAOYSA-N 2-[[2-[2,3-bis(oxiran-2-ylmethoxy)phenyl]-6-(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=CC=C1OCC1CO1)C1=C(C(=CC=C1)OCC1CO1)OCC1CO1 BKTRTUHEFZGAMX-UHFFFAOYSA-N 0.000 description 1
- CLEOULQLYWQUBC-UHFFFAOYSA-N 2-[[2-[2,3-bis(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=CC=C1OCC1CO1)C1=C(C=CC=C1)OCC1CO1 CLEOULQLYWQUBC-UHFFFAOYSA-N 0.000 description 1
- MSKMETISNLSUMF-UHFFFAOYSA-N 2-[[2-[2,4-bis(oxiran-2-ylmethoxy)phenyl]-6-(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=CC=C1OCC1CO1)C1=C(C=C(C=C1)OCC1CO1)OCC1CO1 MSKMETISNLSUMF-UHFFFAOYSA-N 0.000 description 1
- CUFZQFKUFKHOEB-UHFFFAOYSA-N 2-[[2-[2,4-bis(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=CC(=C1)OCC1CO1)C1=C(C=CC=C1)OCC1CO1 CUFZQFKUFKHOEB-UHFFFAOYSA-N 0.000 description 1
- LULWFBVVQLVAAP-UHFFFAOYSA-N 2-[[2-[2,5-bis(oxiran-2-ylmethoxy)phenyl]-3-(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=C(C=C1)OCC1CO1)C1=C(C=CC=C1OCC1CO1)OCC1CO1 LULWFBVVQLVAAP-UHFFFAOYSA-N 0.000 description 1
- KSCVCDLFGUVIKK-UHFFFAOYSA-N 2-[[2-[2,5-bis(oxiran-2-ylmethoxy)phenyl]-5-(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=CC(=C1)OCC1CO1)C1=C(C=CC(=C1)OCC1CO1)OCC1CO1 KSCVCDLFGUVIKK-UHFFFAOYSA-N 0.000 description 1
- QDLCHWAIFRIIBU-UHFFFAOYSA-N 2-[[2-[2,5-bis(oxiran-2-ylmethoxy)phenyl]-6-(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=CC=C1OCC1CO1)C1=C(C=CC(=C1)OCC1CO1)OCC1CO1 QDLCHWAIFRIIBU-UHFFFAOYSA-N 0.000 description 1
- GWWMOGBURKNPPJ-UHFFFAOYSA-N 2-[[2-[2,5-bis(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=C(C=C1)OCC1CO1)C1=C(C=CC=C1)OCC1CO1 GWWMOGBURKNPPJ-UHFFFAOYSA-N 0.000 description 1
- FJARUTJTKCCOEY-UHFFFAOYSA-N 2-[[2-[2,6-bis(oxiran-2-ylmethoxy)phenyl]-3-(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C(=CC=C1)OCC1CO1)C1=C(C=CC=C1OCC1CO1)OCC1CO1 FJARUTJTKCCOEY-UHFFFAOYSA-N 0.000 description 1
- NMACIRYAMZCWKT-UHFFFAOYSA-N 2-[[2-[2,6-bis(oxiran-2-ylmethoxy)phenyl]-5-(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=CC(=C1)OCC1CO1)C1=C(C=CC=C1OCC1CO1)OCC1CO1 NMACIRYAMZCWKT-UHFFFAOYSA-N 0.000 description 1
- WTLLKSFUKUZHEF-UHFFFAOYSA-N 2-[[2-[2,6-bis(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C(=CC=C1)OCC1CO1)C1=C(C=CC=C1)OCC1CO1 WTLLKSFUKUZHEF-UHFFFAOYSA-N 0.000 description 1
- CHHXOVKKOAJZRR-UHFFFAOYSA-N 2-[[2-[3,4-bis(oxiran-2-ylmethoxy)phenyl]-3-(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C(=CC=C1)OCC1CO1)C1=CC(=C(C=C1)OCC1CO1)OCC1CO1 CHHXOVKKOAJZRR-UHFFFAOYSA-N 0.000 description 1
- GDSBBTFDPDLQGF-UHFFFAOYSA-N 2-[[2-[3,4-bis(oxiran-2-ylmethoxy)phenyl]-4-(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=C(C=C1)OCC1CO1)C1=CC(=C(C=C1)OCC1CO1)OCC1CO1 GDSBBTFDPDLQGF-UHFFFAOYSA-N 0.000 description 1
- BOSKCNVVRDJTMV-UHFFFAOYSA-N 2-[[2-[3,4-bis(oxiran-2-ylmethoxy)phenyl]-6-(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=CC=C1OCC1CO1)C1=CC(=C(C=C1)OCC1CO1)OCC1CO1 BOSKCNVVRDJTMV-UHFFFAOYSA-N 0.000 description 1
- HVIAPNPXERXJEC-UHFFFAOYSA-N 2-[[2-[3,4-bis(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=CC=C1)C1=CC(=C(C=C1)OCC1CO1)OCC1CO1 HVIAPNPXERXJEC-UHFFFAOYSA-N 0.000 description 1
- KEDXGOKQWWEJMR-UHFFFAOYSA-N 2-[[2-[3,5-bis(oxiran-2-ylmethoxy)phenyl]-3-(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C(=CC=C1)OCC1CO1)C1=CC(=CC(=C1)OCC1CO1)OCC1CO1 KEDXGOKQWWEJMR-UHFFFAOYSA-N 0.000 description 1
- VUGNJBVWLFUFAP-UHFFFAOYSA-N 2-[[2-[3,5-bis(oxiran-2-ylmethoxy)phenyl]-5-(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=CC(=C1)OCC1CO1)C1=CC(=CC(=C1)OCC1CO1)OCC1CO1 VUGNJBVWLFUFAP-UHFFFAOYSA-N 0.000 description 1
- BYAPVYAWLGQLFT-UHFFFAOYSA-N 2-[[2-[3,5-bis(oxiran-2-ylmethoxy)phenyl]-6-(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=CC=C1OCC1CO1)C1=CC(=CC(=C1)OCC1CO1)OCC1CO1 BYAPVYAWLGQLFT-UHFFFAOYSA-N 0.000 description 1
- PWFWRMAXGFPABD-UHFFFAOYSA-N 2-[[2-[3,5-bis(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=CC=C1)C1=CC(=CC(=C1)OCC1CO1)OCC1CO1 PWFWRMAXGFPABD-UHFFFAOYSA-N 0.000 description 1
- VVXGOQFTUIBSDE-UHFFFAOYSA-N 2-[[3,5-bis(oxiran-2-ylmethoxy)-2-[2-(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C(=CC(=C1)OCC1CO1)OCC1CO1)C1=C(C=CC=C1)OCC1CO1 VVXGOQFTUIBSDE-UHFFFAOYSA-N 0.000 description 1
- RGZHDXVNFPNMLD-UHFFFAOYSA-N 2-[[3,5-bis(oxiran-2-ylmethoxy)-2-[3-(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C(=CC(=C1)OCC1CO1)OCC1CO1)C1=CC(=CC=C1)OCC1CO1 RGZHDXVNFPNMLD-UHFFFAOYSA-N 0.000 description 1
- YBNAQRJUFYSPCD-UHFFFAOYSA-N 2-[[3,5-bis(oxiran-2-ylmethoxy)-2-[4-(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C(=CC(=C1)OCC1CO1)OCC1CO1)C1=CC=C(C=C1)OCC1CO1 YBNAQRJUFYSPCD-UHFFFAOYSA-N 0.000 description 1
- PMUJIQDBMIIYMK-UHFFFAOYSA-N 2-[[3,5-bis(oxiran-2-ylmethoxy)-2-phenylphenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C(=CC(=C1)OCC1CO1)OCC1CO1)C1=CC=CC=C1 PMUJIQDBMIIYMK-UHFFFAOYSA-N 0.000 description 1
- GWWASWWOYYRGEX-UHFFFAOYSA-N 2-[[3-[2,3-bis(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=CC=C1OCC1CO1)C1=CC(=CC=C1)OCC1CO1 GWWASWWOYYRGEX-UHFFFAOYSA-N 0.000 description 1
- AAOXIXQWBSPFEP-UHFFFAOYSA-N 2-[[3-[2,5-bis(oxiran-2-ylmethoxy)phenyl]-5-(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=C(C=C1)OCC1CO1)C1=CC(=CC(=C1)OCC1CO1)OCC1CO1 AAOXIXQWBSPFEP-UHFFFAOYSA-N 0.000 description 1
- HRJQNCWRNMYXJA-UHFFFAOYSA-N 2-[[3-[2,5-bis(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=C(C=C1)OCC1CO1)C1=CC(=CC=C1)OCC1CO1 HRJQNCWRNMYXJA-UHFFFAOYSA-N 0.000 description 1
- YFBHWPNASADRBV-UHFFFAOYSA-N 2-[[3-[2,6-bis(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C(=CC=C1)OCC1CO1)C1=CC(=CC=C1)OCC1CO1 YFBHWPNASADRBV-UHFFFAOYSA-N 0.000 description 1
- JQKFKYSEQZMMCO-UHFFFAOYSA-N 2-[[3-[3,4-bis(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C(C1CO1)OC=1C=C(C=CC=1OCC1CO1)C1=CC(=CC=C1)OCC1CO1 JQKFKYSEQZMMCO-UHFFFAOYSA-N 0.000 description 1
- FSYPIGPPWAJCJG-UHFFFAOYSA-N 2-[[4-(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical compound C1OC1COC(C=C1)=CC=C1OCC1CO1 FSYPIGPPWAJCJG-UHFFFAOYSA-N 0.000 description 1
- SNHZSTXGRRPGIQ-UHFFFAOYSA-N 2-[[4-[2,3-bis(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=CC=C1OCC1CO1)C1=CC=C(C=C1)OCC1CO1 SNHZSTXGRRPGIQ-UHFFFAOYSA-N 0.000 description 1
- MANNQAZJTYDTLN-UHFFFAOYSA-N 2-[[4-[2,5-bis(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C(C1CO1)OC1=C(C=C(C=C1)OCC1CO1)C1=CC=C(C=C1)OCC1CO1 MANNQAZJTYDTLN-UHFFFAOYSA-N 0.000 description 1
- CEKHSFJOKNRUCF-UHFFFAOYSA-N 2-[[4-[3,4-bis(oxiran-2-ylmethoxy)phenyl]-2-(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical group C1OC1COC1=CC=C(C=2C=C(OCC3OC3)C(OCC3OC3)=CC=2)C=C1OCC1CO1 CEKHSFJOKNRUCF-UHFFFAOYSA-N 0.000 description 1
- GSXPVGZZUNUGKM-UHFFFAOYSA-N 2-[[4-[3,4-bis(oxiran-2-ylmethoxy)phenyl]phenoxy]methyl]oxirane Chemical group C1OC1COC(C=C1)=CC=C1C(C=C1OCC2OC2)=CC=C1OCC1CO1 GSXPVGZZUNUGKM-UHFFFAOYSA-N 0.000 description 1
- MEVBAGCIOOTPLF-UHFFFAOYSA-N 2-[[5-(oxiran-2-ylmethoxy)naphthalen-2-yl]oxymethyl]oxirane Chemical compound C1OC1COC(C=C1C=CC=2)=CC=C1C=2OCC1CO1 MEVBAGCIOOTPLF-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- UUODQIKUTGWMPT-UHFFFAOYSA-N 2-fluoro-5-(trifluoromethyl)pyridine Chemical compound FC1=CC=C(C(F)(F)F)C=N1 UUODQIKUTGWMPT-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- OVEUFHOBGCSKSH-UHFFFAOYSA-N 2-methyl-n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound CC1=CC=CC=C1N(CC1OC1)CC1OC1 OVEUFHOBGCSKSH-UHFFFAOYSA-N 0.000 description 1
- GSKNLOOGBYYDHV-UHFFFAOYSA-N 2-methylphenol;naphthalen-1-ol Chemical compound CC1=CC=CC=C1O.C1=CC=C2C(O)=CC=CC2=C1 GSKNLOOGBYYDHV-UHFFFAOYSA-N 0.000 description 1
- YZEZMSPGIPTEBA-UHFFFAOYSA-N 2-n-(4,6-diamino-1,3,5-triazin-2-yl)-1,3,5-triazine-2,4,6-triamine Chemical compound NC1=NC(N)=NC(NC=2N=C(N)N=C(N)N=2)=N1 YZEZMSPGIPTEBA-UHFFFAOYSA-N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- HSZOQEGJICWJDP-UHFFFAOYSA-N 3,4',5-Biphenyltriol Chemical group C1=CC(O)=CC=C1C1=CC(O)=CC(O)=C1 HSZOQEGJICWJDP-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- ATVJXMYDOSMEPO-UHFFFAOYSA-N 3-prop-2-enoxyprop-1-ene Chemical compound C=CCOCC=C ATVJXMYDOSMEPO-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- CDABMPUGYTZWIY-UHFFFAOYSA-N 4-(4-hydroxyphenyl)benzene-1,3-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1O CDABMPUGYTZWIY-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- HDPBBNNDDQOWPJ-UHFFFAOYSA-N 4-[1,2,2-tris(4-hydroxyphenyl)ethyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)C(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 HDPBBNNDDQOWPJ-UHFFFAOYSA-N 0.000 description 1
- WFCQTAXSWSWIHS-UHFFFAOYSA-N 4-[bis(4-hydroxyphenyl)methyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 WFCQTAXSWSWIHS-UHFFFAOYSA-N 0.000 description 1
- CXXSQMDHHYTRKY-UHFFFAOYSA-N 4-amino-2,3,5-tris(oxiran-2-ylmethyl)phenol Chemical compound C1=C(O)C(CC2OC2)=C(CC2OC2)C(N)=C1CC1CO1 CXXSQMDHHYTRKY-UHFFFAOYSA-N 0.000 description 1
- INTKLIPLFSTUMR-UHFFFAOYSA-N 5,5-bis(oxiran-2-ylmethyl)imidazolidine-2,4-dione Chemical compound N1C(=O)NC(=O)C1(CC1OC1)CC1OC1 INTKLIPLFSTUMR-UHFFFAOYSA-N 0.000 description 1
- VZLUGGCFYPMLMI-UHFFFAOYSA-N 5-(3,5-dihydroxyphenyl)benzene-1,3-diol Chemical group OC1=CC(O)=CC(C=2C=C(O)C=C(O)C=2)=C1 VZLUGGCFYPMLMI-UHFFFAOYSA-N 0.000 description 1
- ZUHMEUFBTDOKPX-UHFFFAOYSA-N 6-[2-(4,6-diamino-1,3,5-triazin-2-yl)ethyl]-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(CCC=2N=C(N)N=C(N)N=2)=N1 ZUHMEUFBTDOKPX-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 1
- GJCOSYZMQJWQCA-UHFFFAOYSA-N 9H-xanthene Chemical compound C1=CC=C2CC3=CC=CC=C3OC2=C1 GJCOSYZMQJWQCA-UHFFFAOYSA-N 0.000 description 1
- IXCOKTMGCRJMDR-UHFFFAOYSA-N 9h-fluorene;phenol Chemical compound OC1=CC=CC=C1.OC1=CC=CC=C1.C1=CC=C2CC3=CC=CC=C3C2=C1 IXCOKTMGCRJMDR-UHFFFAOYSA-N 0.000 description 1
- 239000004254 Ammonium phosphate Substances 0.000 description 1
- 239000004114 Ammonium polyphosphate Substances 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- WMUOYOBXIOJYOU-UHFFFAOYSA-N C(C1CO1)OC1=C(C2=CC(=CC=C2C=C1)OCC1CO1)CCC(CC)OCC1CO1 Chemical compound C(C1CO1)OC1=C(C2=CC(=CC=C2C=C1)OCC1CO1)CCC(CC)OCC1CO1 WMUOYOBXIOJYOU-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 244000241257 Cucumis melo Species 0.000 description 1
- 235000015510 Cucumis melo subsp melo Nutrition 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000005696 Diammonium phosphate Substances 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- VEHBSMLBMVUCDE-UHFFFAOYSA-N NCC(=O)COCCC[Si](OCC)(OCC)C Chemical compound NCC(=O)COCCC[Si](OCC)(OCC)C VEHBSMLBMVUCDE-UHFFFAOYSA-N 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- GWFGDXZQZYMSMJ-UHFFFAOYSA-N Octadecansaeure-heptadecylester Natural products CCCCCCCCCCCCCCCCCOC(=O)CCCCCCCCCCCCCCCCC GWFGDXZQZYMSMJ-UHFFFAOYSA-N 0.000 description 1
- 240000002834 Paulownia tomentosa Species 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920000388 Polyphosphate Polymers 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 1
- 238000006069 Suzuki reaction reaction Methods 0.000 description 1
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 238000006887 Ullmann reaction Methods 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- FMRLDPWIRHBCCC-UHFFFAOYSA-L Zinc carbonate Chemical compound [Zn+2].[O-]C([O-])=O FMRLDPWIRHBCCC-UHFFFAOYSA-L 0.000 description 1
- FJJCIZWZNKZHII-UHFFFAOYSA-N [4,6-bis(cyanoamino)-1,3,5-triazin-2-yl]cyanamide Chemical compound N#CNC1=NC(NC#N)=NC(NC#N)=N1 FJJCIZWZNKZHII-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910000288 alkali metal carbonate Inorganic materials 0.000 description 1
- 150000008041 alkali metal carbonates Chemical class 0.000 description 1
- 229910001860 alkaline earth metal hydroxide Inorganic materials 0.000 description 1
- 150000001343 alkyl silanes Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- DTOSIQBPPRVQHS-PDBXOOCHSA-N alpha-linolenic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCC(O)=O DTOSIQBPPRVQHS-PDBXOOCHSA-N 0.000 description 1
- 235000020661 alpha-linolenic acid Nutrition 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 229940118662 aluminum carbonate Drugs 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- LFVGISIMTYGQHF-UHFFFAOYSA-N ammonium dihydrogen phosphate Chemical compound [NH4+].OP(O)([O-])=O LFVGISIMTYGQHF-UHFFFAOYSA-N 0.000 description 1
- 229910000387 ammonium dihydrogen phosphate Inorganic materials 0.000 description 1
- 229910000148 ammonium phosphate Inorganic materials 0.000 description 1
- 235000019289 ammonium phosphates Nutrition 0.000 description 1
- 235000019826 ammonium polyphosphate Nutrition 0.000 description 1
- 229920001276 ammonium polyphosphate Polymers 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 150000003934 aromatic aldehydes Chemical class 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- QBLDFAIABQKINO-UHFFFAOYSA-N barium borate Chemical compound [Ba+2].[O-]B=O.[O-]B=O QBLDFAIABQKINO-UHFFFAOYSA-N 0.000 description 1
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 description 1
- 229910001863 barium hydroxide Inorganic materials 0.000 description 1
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 description 1
- OGBUMNBNEWYMNJ-UHFFFAOYSA-N batilol Chemical class CCCCCCCCCCCCCCCCCCOCC(O)CO OGBUMNBNEWYMNJ-UHFFFAOYSA-N 0.000 description 1
- VBQRUYIOTHNGOP-UHFFFAOYSA-N benzo[c][2,1]benzoxaphosphinine 6-oxide Chemical compound C1=CC=C2P(=O)OC3=CC=CC=C3C2=C1 VBQRUYIOTHNGOP-UHFFFAOYSA-N 0.000 description 1
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical group C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical compound C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- IDSLNGDJQFVDPQ-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-yl) hexanedioate Chemical compound C1CC2OC2CC1OC(=O)CCCCC(=O)OC1CC2OC2CC1 IDSLNGDJQFVDPQ-UHFFFAOYSA-N 0.000 description 1
- JRPRCOLKIYRSNH-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) benzene-1,2-dicarboxylate Chemical compound C=1C=CC=C(C(=O)OCC2OC2)C=1C(=O)OCC1CO1 JRPRCOLKIYRSNH-UHFFFAOYSA-N 0.000 description 1
- KTPIWUHKYIJBCR-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) cyclohex-4-ene-1,2-dicarboxylate Chemical compound C1C=CCC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 KTPIWUHKYIJBCR-UHFFFAOYSA-N 0.000 description 1
- XFUOBHWPTSIEOV-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) cyclohexane-1,2-dicarboxylate Chemical compound C1CCCC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 XFUOBHWPTSIEOV-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229940049676 bismuth hydroxide Drugs 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- TZSXPYWRDWEXHG-UHFFFAOYSA-K bismuth;trihydroxide Chemical compound [OH-].[OH-].[OH-].[Bi+3] TZSXPYWRDWEXHG-UHFFFAOYSA-K 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- VTJUKNSKBAOEHE-UHFFFAOYSA-N calixarene Chemical compound COC(=O)COC1=C(CC=2C(=C(CC=3C(=C(C4)C=C(C=3)C(C)(C)C)OCC(=O)OC)C=C(C=2)C(C)(C)C)OCC(=O)OC)C=C(C(C)(C)C)C=C1CC1=C(OCC(=O)OC)C4=CC(C(C)(C)C)=C1 VTJUKNSKBAOEHE-UHFFFAOYSA-N 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 229910021446 cobalt carbonate Inorganic materials 0.000 description 1
- ZOTKGJBKKKVBJZ-UHFFFAOYSA-L cobalt(2+);carbonate Chemical compound [Co+2].[O-]C([O-])=O ZOTKGJBKKKVBJZ-UHFFFAOYSA-L 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000011437 continuous method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 150000003983 crown ethers Chemical class 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000000298 cyclopropenyl group Chemical group [H]C1=C([H])C1([H])* 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 description 1
- 229910000388 diammonium phosphate Inorganic materials 0.000 description 1
- 235000019838 diammonium phosphate Nutrition 0.000 description 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 230000000447 dimerizing effect Effects 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- GKIPXFAANLTWBM-UHFFFAOYSA-N epibromohydrin Chemical compound BrCC1CO1 GKIPXFAANLTWBM-UHFFFAOYSA-N 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- WLPKFQRBARNCNR-UHFFFAOYSA-N ethene 1,3,5-triazine-2,4,6-triamine Chemical compound C=C.NC1=NC(N)=NC(N)=N1.NC1=NC(N)=NC(N)=N1 WLPKFQRBARNCNR-UHFFFAOYSA-N 0.000 description 1
- HDERJYVLTPVNRI-UHFFFAOYSA-N ethene;ethenyl acetate Chemical group C=C.CC(=O)OC=C HDERJYVLTPVNRI-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- KTWOOEGAPBSYNW-UHFFFAOYSA-N ferrocene Chemical compound [Fe+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 KTWOOEGAPBSYNW-UHFFFAOYSA-N 0.000 description 1
- RAQDACVRFCEPDA-UHFFFAOYSA-L ferrous carbonate Chemical compound [Fe+2].[O-]C([O-])=O RAQDACVRFCEPDA-UHFFFAOYSA-L 0.000 description 1
- 239000003733 fiber-reinforced composite Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 150000002357 guanidines Chemical class 0.000 description 1
- 229940083094 guanine derivative acting on arteriolar smooth muscle Drugs 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 150000003944 halohydrins Chemical class 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- FEEPBTVZSYQUDP-UHFFFAOYSA-N heptatriacontanediamide Chemical compound NC(=O)CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(N)=O FEEPBTVZSYQUDP-UHFFFAOYSA-N 0.000 description 1
- 150000002391 heterocyclic compounds Chemical class 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 1
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 1
- 229940091173 hydantoin Drugs 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- QDLAGTHXVHQKRE-UHFFFAOYSA-N lichenxanthone Natural products COC1=CC(O)=C2C(=O)C3=C(C)C=C(OC)C=C3OC2=C1 QDLAGTHXVHQKRE-UHFFFAOYSA-N 0.000 description 1
- 229960004488 linolenic acid Drugs 0.000 description 1
- KQQKGWQCNNTQJW-UHFFFAOYSA-N linolenic acid Natural products CC=CCCC=CCC=CCCCCCCCC(O)=O KQQKGWQCNNTQJW-UHFFFAOYSA-N 0.000 description 1
- 235000021388 linseed oil Nutrition 0.000 description 1
- 239000000944 linseed oil Substances 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 150000002641 lithium Chemical class 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000007974 melamines Chemical class 0.000 description 1
- YSRVJVDFHZYRPA-UHFFFAOYSA-N melem Chemical compound NC1=NC(N23)=NC(N)=NC2=NC(N)=NC3=N1 YSRVJVDFHZYRPA-UHFFFAOYSA-N 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 125000001434 methanylylidene group Chemical group [H]C#[*] 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- 238000002715 modification method Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- 235000019837 monoammonium phosphate Nutrition 0.000 description 1
- 239000006012 monoammonium phosphate Substances 0.000 description 1
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- WGARMULIELDQEH-UHFFFAOYSA-N n-cyclohexyl-1,3-benzothiazole-2-sulfinamide Chemical compound N=1C2=CC=CC=C2SC=1S(=O)NC1CCCCC1 WGARMULIELDQEH-UHFFFAOYSA-N 0.000 description 1
- GOQYKNQRPGWPLP-UHFFFAOYSA-N n-heptadecyl alcohol Natural products CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 150000004780 naphthols Chemical class 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000004923 naphthylmethyl group Chemical group C1(=CC=CC2=CC=CC=C12)C* 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 1
- NKBWPOSQERPBFI-UHFFFAOYSA-N octadecyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCCCCCCCCCCCCCCCC NKBWPOSQERPBFI-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 235000019198 oils Nutrition 0.000 description 1
- FATBGEAMYMYZAF-KTKRTIGZSA-N oleamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(N)=O FATBGEAMYMYZAF-KTKRTIGZSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 125000001477 organic nitrogen group Chemical group 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005691 oxidative coupling reaction Methods 0.000 description 1
- MPQXHAGKBWFSNV-UHFFFAOYSA-N oxidophosphanium Chemical class [PH3]=O MPQXHAGKBWFSNV-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 125000001484 phenothiazinyl group Chemical class C1(=CC=CC=2SC3=CC=CC=C3NC12)* 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical class O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- 150000004850 phospholanes Chemical class 0.000 description 1
- 150000003009 phosphonic acids Chemical class 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 239000001205 polyphosphate Substances 0.000 description 1
- 235000011176 polyphosphates Nutrition 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 125000002568 propynyl group Chemical group [*]C#CC([H])([H])[H] 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical compound NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 description 1
- 239000004328 sodium tetraborate Substances 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 150000003458 sulfonic acid derivatives Chemical class 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- FOZHTJJTSSSURD-UHFFFAOYSA-J titanium(4+);dicarbonate Chemical compound [Ti+4].[O-]C([O-])=O.[O-]C([O-])=O FOZHTJJTSSSURD-UHFFFAOYSA-J 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910001930 tungsten oxide Inorganic materials 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 239000011667 zinc carbonate Substances 0.000 description 1
- 235000004416 zinc carbonate Nutrition 0.000 description 1
- 229910000010 zinc carbonate Inorganic materials 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- BNEMLSQAJOPTGK-UHFFFAOYSA-N zinc;dioxido(oxo)tin Chemical compound [Zn+2].[O-][Sn]([O-])=O BNEMLSQAJOPTGK-UHFFFAOYSA-N 0.000 description 1
- PZRXQXJGIQEYOG-UHFFFAOYSA-N zinc;oxido(oxo)borane Chemical compound [Zn+2].[O-]B=O.[O-]B=O PZRXQXJGIQEYOG-UHFFFAOYSA-N 0.000 description 1
- 150000003755 zirconium compounds Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/08—Ingredients agglomerated by treatment with a binding agent
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/045—Carbides composed of metals from groups of the periodic table
- H01L2924/0454—4th Group
- H01L2924/04541—TiC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/045—Carbides composed of metals from groups of the periodic table
- H01L2924/0463—13th Group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/045—Carbides composed of metals from groups of the periodic table
- H01L2924/0464—14th Group
- H01L2924/04642—SiC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/049—Nitrides composed of metals from groups of the periodic table
- H01L2924/0503—13th Group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/049—Nitrides composed of metals from groups of the periodic table
- H01L2924/0503—13th Group
- H01L2924/05032—AlN
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/049—Nitrides composed of metals from groups of the periodic table
- H01L2924/0504—14th Group
- H01L2924/05042—Si3N4
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/053—Oxides composed of metals from groups of the periodic table
- H01L2924/0532—2nd Group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/053—Oxides composed of metals from groups of the periodic table
- H01L2924/0542—12th Group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/053—Oxides composed of metals from groups of the periodic table
- H01L2924/0543—13th Group
- H01L2924/05432—Al2O3
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/053—Oxides composed of metals from groups of the periodic table
- H01L2924/0544—14th Group
- H01L2924/05442—SiO2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/186—Material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
本発明に用いるエポキシ樹脂は、トリグリシジルオキシビフェニルもしくはテトラグリシジルオキシビフェニルである多官能ビフェニル型エポキシ樹脂であり、上記式(1)で表されるエポキシ樹脂である。上記式(1)で表されるエポキシ樹脂としては、例えば、2,3,4−トリグリシジルオキシビフェニル、2,3,5−トリグリシジルオキシビフェニル、2,3,6−トリグリシジルオキシビフェニル、2,4,5−トリグリシジルオキシビフェニル、2,4,6−トリグリシジルオキシビフェニル、3,4,5−トリグリシジルオキシビフェニル、2,2’,3−トリグリシジルオキシビフェニル、2,2’,4−トリグリシジルオキシビフェニル、2,2’,5−トリグリシジルオキシビフェニル、2,2’,6−トリグリシジルオキシビフェニル、2,3’,4’−トリグリシジルオキシビフェニル、2,3’,5’−トリグリシジルオキシビフェニル、2,3,3’−トリグリシジルオキシビフェニル、2,3’,4−トリグリシジルオキシビフェニル、2,3’,5−トリグリシジルオキシビフェニル、2,3’,6−トリグリシジルオキシビフェニル、3,3’,4−トリグリシジルオキシビフェニル、3,3’5−トリグリシジルオキシビフェニル、2,3,4’−トリグリシジルオキシビフェニル、2,4,4’−トリグリシジルオキシビフェニル、2,4’,5−トリグリシジルオキシビフェニル、2,4’,6−トリグリシジルオキシビフェニル、3,4,4’−トリグリシジルオキシビフェニル、3,4’,5−トリグリシジルオキシビフェニル、2,3,4,5−テトラグリシジルオキシビフェニル、2,3,4,6−テトラグリシジルオキシビフェニル、2,3,5,6−テトラグリシジルオキシビフェニル、2,2’,3,4−テトラグリシジルオキシビフェニル、2,2’,3,5−テトラグリシジルオキシビフェニル、2,2’,3,6−テトラグリシジルオキシビフェニル、2,2’,4,5−テトラグリシジルオキシビフェニル、2,2’,4,6−テトラグリシジルオキシビフェニル、2,3’,4’,5’−テトラグリシジルオキシビフェニル、2,3,3’,4−テトラグリシジルオキシビフェニル、2,3,3’,5−テトラグリシジルオキシビフェニル、2,3,3’,6−テトラグリシジルオキシビフェニル、2,3’,4,5−テトラグリシジルオキシビフェニル、2,3’,4,6−テトラグリシジルオキシビフェニル、3,3’,4,5−テトラグリシジルオキシビフェニル、2,3,4,4’−テトラグリシジルオキシビフェニル、2,3,4’,5−テトラグリシジルオキシビフェニル、2,3,4’,6−テトラグリシジルオキシビフェニル、2,4,4’,5−テトラグリシジルオキシビフェニル、2,4,4’,6−テトラグリシジルオキシビフェニル、3,4,4’,5−テトラグリシジルオキシビフェニル、2,2’,3,3’−テトラグリシジルオキシビフェニル、2,2’,3,4’−テトラグリシジルオキシビフェニル、2,2’,3,5’−テトラグリシジルオキシビフェニル、2,2’,3,6’−テトラグリシジルオキシビフェニル、2,3,3’,4’−テトラグリシジルオキシビフェニル、2,3,3’,5’−テトラグリシジルオキシビフェニル、2,2’,4,4’−テトラグリシジルオキシビフェニル、2,2’,4,5’−テトラグリシジルオキシビフェニル、2,2’,4,6’−テトラグリシジルオキシビフェニル、2,3’,4,4’−テトラグリシジルオキシビフェニル、2,3’,4,5’−テトラグリシジルオキシビフェニル、2,2’,5,5’−テトラグリシジルオキシビフェニル、2,2’,5,6’−テトラグリシジルオキシビフェニル、2,3’,4’,5−テトラグリシジルオキシビフェニル、2,3’,5,5’−テトラグリシジルオキシビフェニル、2,2’,6,6’−テトラグリシジルオキシビフェニル、2,3’,4’,6−テトラグリシジルオキシビフェニル、2,3’,5’,6−テトラグリシジルオキシビフェニル、3,3’,4,4’−テトラグリシジルオキシビフェニル、3,3’,4,5’−テトラグリシジルオキシビフェニル、3,3’,5,5’−テトラグリシジルオキシビフェニルが挙げられる。なかでも、エポキシ樹脂の高熱伝導化には分子の配向性が高い構造が有利であるため、4,4’位に置換基を有する2,4,4’−トリグリシジルオキシビフェニル、2,4,4’,6−テトラグリシジルオキシビフェニル、2,2’,4,4’−テトラグリシジルオキシビフェニル;分子対称性に優れた2,4’,6−トリグリシジルオキシビフェニル、3,4’,5−トリグリシジルオキシビフェニル、2,2’,5,5’−テトラグリシジルオキシビフェニル、3,3’,5,5’−テトラグリシジルオキシビフェニルが好適である。
なお、工業生産を行う際、エポキシ樹脂生産の初バッチでは仕込みに用いるエピハロヒドリン類の全てが新しいものであるが、次バッチ以降は、粗反応生成物から回収されたエピハロヒドリン類と、反応で消費される分で消失する分に相当する新しいエピハロヒドリン類とを併用することが可能であり、経済的に好ましい。この時、使用するエピハロヒドリンは特に限定されないが、例えばエピクロルヒドリン、エピブロモヒドリン、β−メチルエピクロルヒドリン等が挙げられる。なかでも工業的入手が容易なことからエピクロルヒドリンが好ましい。
前記の熱伝導性フィラーの平均粒子径は特に限定されないが、好ましい下限が0.2μm、好ましい上限が50μmである。上記の熱伝導性フィラーの平均粒子径が0.2μm未満であると、電子材料用エポキシ樹脂組成物の粘度が高くなって、作業性等が低下することがある。上記の熱伝導性フィラーの平均粒子径が50μmを超えたものを多量に使用すると、電子材料用エポキシ樹脂組成物の硬化物と基材との接着力が不足して、電子部品の反りが大きくなったり、冷熱サイクル下等においてクラック又は剥離が生じたり、接着界面で剥離が生じたりすることがある。上記の熱伝導性フィラーの平均粒子径のより好ましい下限は0.4μm、より好ましい上限は30μmである。
〜75重量%、平均粒子径0.4〜1.0μm(小粒子径)を25〜55重量%の範囲の割合で混合すると、熱伝導率の温度依存性が小さくなるので好ましい。
本発明の電子材料用エポキシ樹脂組成物は、優れた溶剤溶解性を発現することを特徴としている。従って、本発明の電子材料用エポキシ樹脂組成物は、有機溶剤を配合しても良い。ここで使用し得る有機溶剤としては、特に限定はないが、メチルエチルケトン、アセトン、ジメチルホルムアミド、メチルイソブチルケトン、メトキシプロパノール、シクロヘキサノン、メチルセロソルブ、エチルジグリコールアセテート、プロピレングリコールモノメチルエーテルアセテート等が挙げられ、その選択や適正な使用量は用途によって適宜選択し得るが、例えば、プリント配線基板用途では、メチルエチルケトン、アセトン、ジメチルホルムアミド等の沸点が160℃以下の極性溶剤であることが好ましく、また、不揮発分40〜80質量%となる割合で使用することが好ましい。一方、ビルドアップ用接着フィルム用途では、有機溶剤として、例えば、アセトン、メチルエチルケトン、シクロヘキサノン等のケトン類、酢酸エチル、酢酸ブチル、セロソルブアセテート、プロピレングリコールモノメチルエーテルアセテート、カルビトールアセテート等の酢酸エステル類、セロソルブ、ブチルカルビトール等のカルビトール類、トルエン、キシレン等の芳香族炭化水素類、ジメチルホルムアミド、ジメチルアセトアミド、N−メチルピロリドン等のアミド類等を用いることが好ましく、また、不揮発分30〜60質量%となる割合で使用することが好ましい。
前記の窒素系難燃剤としては、例えば、トリアジン化合物、シアヌル酸化合物、イソシアヌル酸化合物、フェノチアジン等が挙げられ、トリアジン化合物、シアヌル酸化合物、イソシアヌル酸化合物が好ましい。
また、前記の窒素系難燃剤を使用する際、金属水酸化物、モリブデン化合物等を併用してもよい。
前記の有機金属塩系難燃剤の配合量としては、有機金属塩系難燃剤の種類、電子材料用エポキシ樹脂組成物の他の成分、所望の難燃性の程度によって適宜選択されるものであるが、例えば、電子材料用エポキシ樹脂組成物、非ハロゲン系難燃剤及びその他の充填材や添加剤等全てを配合した電子材料用エポキシ樹脂組成物に対して、0.005〜10質量%の範囲で配合することが好ましい。
例えば熱伝導性接着剤として用いる場合、パワーモジュールなどの電気・電子機器の放熱させたい部位と放熱部材(例えば、金属板やヒートシンク)を接着させ、良好な放熱を発現させるために使用される。その際の使用される電子材料用エポキシ樹脂組成物の形態には特に制限はないが、液状あるいはペースト状に設計した電子材料用エポキシ樹脂組成物の場合は、液状あるいはペースト状の電子材料用エポキシ樹脂組成物を接着面の界面に注入後、接着し、硬化させれば良い。固形状に設計されたものは、粉体状、チップ状あるいはシート状にしたものを、接着面の界面に置き、熱溶融させる事で接着し、硬化させれば良い。また、本発明のエポキシ樹脂組成物を半硬化した状態のものを熱伝導性接着剤として用いてもよく、たとえばシート状にしたエポキシ樹脂組成物を半硬化させた状態で接着させたい部材と接触させた上で、最終硬化させることでも使用することができる。
例えば、半導体封止材料に用いられる電子材料用エポキシ樹脂組成物を作製するためには、前記のトリグリシジルオキシビフェニルもしくはテトラグリシジルオキシビフェニルである多官能ビフェニル型エポキシ樹脂と前記の硬化剤を、例えば、押出機、ニ−ダ、ロ−ル等を用いて均一になるまで充分に混合して溶融混合型の電子材料用エポキシ樹脂組成物を得ればよい。その際、フィラーとしては、シリカ、アルミナ、窒化珪素、窒化ホウ素、窒化アルミが用いられ、その充填率は電子材料用エポキシ樹脂組成物100質量部当たり、充填剤を30〜95質量%の範囲で用いられる。中でも、難燃性や耐湿性や耐ハンダクラック性の向上、線膨張係数の低下を図るためには、65質量%以上が好ましく、70質量%以上が特に好ましく、それらの効果を格段に上げるためには、80質量%以上が一層その効果を高めることができる。
前記の炭化水素系としては、パラフィンワックス、ポリオレフィン系ワックス等が挙げられる。ポリオレフィン系ワックスは、酸化されていない無極性のポリオレフィンワックスと酸化ポリオレフィンワックスに大別され、それぞれにポリエチレン系,ポリプロピレン系、および酢ビ−エチレン共重合系がある。
本発明の電子回路基板に用いられる電子材料用エポキシ樹脂組成物は、具体的には、プリント配線基板材料、フレキシルブル配線基板材料、ビルドアップ基板用層間絶縁材料、導電ペースト、ビルドアップ用接着フィルム材料、レジストインキ、樹脂注型材料、接着剤等に用いられる。また、これら各種用途のうち、プリント配線基板、フレキシルブル配線基板材料、ビルドアップ基板用層間絶縁材料およびビルドアップ用接着フィルムの用途では、コンデンサ等の受動部品やICチップ等の能動部品を基板内に埋め込んだ、いわゆる電子部品内蔵用基板用の絶縁材料として用いることができる。これらの中でも、高難燃性、高耐熱性、低熱膨張性、及び溶剤溶解性といった特性からフレキシルブル配線基板用樹脂組成物、ビルドアップ基板用層間絶縁材料に用いることが好ましい。
前記した支持フィルム及び保護フィルムは、ポリエチレン、ポリプロピレン、ポリ塩化ビニル等のポリオレフィン、ポリエチレンテレフタレート(以下「PET」と略称することがある。)、ポリエチレンナフタレート等のポリエステル、ポリカーボネート、ポリイミド、更には離型紙や銅箔、アルミニウム箔等の金属箔などを挙げることができる。なお、支持フィルム及び保護フィルムはマッド処理、コロナ処理の他、離型処理を施してあってもよい。
本発明の電子材料用エポキシ樹脂組成物から硬化物を得る方法としては、一般的な硬化性樹脂組成物の硬化方法に準拠すればよいが、例えば加熱温度条件は、組み合わせる硬化剤の種類や用途等によって、適宜選択すればよいが、上記方法によって得られた組成物を、室温〜250℃程度の温度範囲で加熱すればよい。
1)150℃における溶融粘度:ASTM D4287に準拠し、以下の機器で測定した。
機器名 :(株)コーデックス製 MODEL CV−1S
2)融点:示差熱熱量重量同時測定装置(日立ハイテクサイエンス社製TG/DTA6200)を用いて測定した。
測定条件
測定温度:室温〜300℃
測定雰囲気:窒素
昇温速度:10℃/min
3)GPC:測定条件は以下の通り。
測定装置 :昭和電工株式会社製「Shodex GPC−104」、
カラム:昭和電工株式会社製「Shodex KF−401HQ」
+昭和電工株式会社製「Shodex KF−401HQ」
+昭和電工株式会社製「Shodex KF−402HQ」
+昭和電工株式会社製「Shodex KF−402HQ」
検出器: RI(示差屈折率計)
データ処理:ウォーターズ株式会社製「Empower 2」
測定条件: カラム温度 40℃
移動相: テトラヒドロフラン
流速: 1.0ml/分
標準 : (使用ポリスチレン)
ウォーターズ株式会社製「Polystyrene Standard 400」
ウォーターズ株式会社製「Polystyrene Standard 530」
ウォーターズ株式会社製「Polystyrene Standard 950」
ウォーターズ株式会社製「Polystyrene Standard 2800」
試料 : 樹脂固形分換算で1.0質量%のテトラヒドロフラン溶液をマイクロフィルターでろ過したもの(50μl)。
(2,4,4’−トリグリシジルオキシビフェニルの合成)
温度計、滴下ロート、冷却管、撹拌機を取り付けたフラスコに、窒素ガスパージを施しながら、2,4,4’−トリヒドロキシビフェニル43g、エピクロルヒドリン295g、n−ブタノール103gを仕込み溶解させた。40℃に昇温した後に、48質量%水酸化ナトリウム水溶液53gを8時間要して添加し、その後更に50℃に昇温し更に1時間反応させた。反応終了後、水83gを加えて静置した後、下層を棄却した。その後、150℃減圧下で未反応エピクロルヒドリンを留去した。それで得られた粗エポキシ樹脂にメチルイソブチルケトン118gを加え溶解した。更にこの溶液に10質量%水酸化ナトリウム水溶液67gを添加して80℃で2時間反応させた後に洗浄液のpHが中性となるまで水洗を3回繰り返した。次いで共沸によって系内を脱水し、精密濾過を経た後に、溶媒を減圧下で留去して目的のエポキシ樹脂である2,4,4’−トリグリシジルオキシビフェニル(A−1)63gを得た。得られたエポキシ樹脂(A−1)は943Pa・sの液状で、溶融粘度(測定法:ICI粘度計法、測定温度:150℃)は0.14dPa・s、エポキシ当量は131g/当量であった。GPC測定により面積比で80%以上が目的物であり、MS測定により、2,4,4’−トリグリシジルオキシビフェニル(A−1)を示す370のピークを確認した。
(3,4’,5−トリグリシジルオキシビフェニルの合成)
温度計、滴下ロート、冷却管、撹拌機を取り付けたフラスコに、窒素ガスパージを施しながら、3,4’,5−トリヒドロキシビフェニル43g、エピクロルヒドリン295g、n−ブタノール103gを仕込み溶解させた。40℃に昇温した後に、48質量%水酸化ナトリウム水溶液53gを8時間要して添加し、その後更に50℃に昇温し更に1時間反応させた。反応終了後、水83gを加えて静置した後、下層を棄却した。その後、150℃減圧下で未反応エピクロルヒドリンを留去した。それで得られた粗エポキシ樹脂にメチルイソブチルケトン118gを加え溶解した。更にこの溶液に10質量%水酸化ナトリウム水溶液67gを添加して80℃で2時間反応させた後に洗浄液のpHが中性となるまで水洗を3回繰り返した。次いで共沸によって系内を脱水し、精密濾過を経た後に、溶媒を減圧下で留去して目的のエポキシ樹脂である3,4’,5−トリグリシジルオキシビフェニル(A−2)62gを得た。得られたエポキシ樹脂(A−2)は常温で融点97℃の結晶で、溶融粘度(測定法:ICI粘度計法、測定温度:150℃)は0.27dPa・s、エポキシ当量は135g/当量であった。GPC測定により面積比で79%以上が目的物であり、MSスペクトルから3,4’,5−トリグリシジルオキシビフェニル(A−2)を示す370のピークが検出された。
(3,3’,5,5’−テトラグリシジルオキシビフェニルの合成)
温度計、滴下ロート、冷却管、撹拌機を取り付けたフラスコに、窒素ガスパージを施しながら、3,3’,5,5’−テトラヒドロキシビフェニル35g、エピクロルヒドリン297g、n−ブタノール104gを仕込み溶解させた。40℃に昇温した後に、48%水酸化ナトリウム水溶液53gを8時間要して添加し、その後更に50℃に昇温し更に1時間反応させた。反応終了後、水84gを加えて静置した後、下層を棄却した。その後、150℃減圧下で未反応エピクロルヒドリンを留去した。それで得られた粗エポキシ樹脂にメチルイソブチルケトンの106gを加え溶解した。更にこの溶液に10質量%水酸化ナトリウム水溶液67gを添加して80℃で2時間反応させた後に洗浄液のpHが中性となるまで水洗を3回繰り返した。次いで共沸によって系内を脱水し、精密濾過を経た後に、溶媒を減圧下で留去して目的のエポキシ樹脂である3,3’,5,5’−テトラグリシジルオキシビフェニル(A−3)60gを得た。得られたエポキシ樹脂(A−3)は融点115℃の固体で、溶融粘度(測定法:ICI粘度計法、測定温度:150℃)は0.57dPa・s、エポキシ当量は121g/当量であった。GPC測定により面積比で78%以上が目的物であり、MSスペクトルから3,3’,5,5’−テトラグリシジルオキシビフェニル(A−3)を示す442のピークが検出された。
合成例1〜3で得られた本発明のエポキシ樹脂(A−1、A−2、A−3)および比較用エポキシ樹脂として、3,3’ ,5,5’−テトラメチル−4,4’−ビフェノール型エポキシ樹脂(A−4)、硬化促進剤としてイミダゾール(2E4MZ(四国化成工業(株)社製))を用いて表1に示した組成で配合し、それぞれ配合物を6cm×11cm×0.8mmの型枠に流し込み、110℃の温度で2時間仮硬化した後、型枠から成型物を取出し、次いで、250℃の温度で2時間硬化し、硬化物を作製した。また、ナフタレン型4官能エポキシ樹脂HP−4700(DIC(株)社製)(A−5)、硬化促進剤としてイミダゾール(2PHZ−PW(四国化成工業(株)社製))を用いて表1に示した組成で配合し、配合物を6cm×11cm×0.8mmの型枠に流し込み、170℃の温度で2時間硬化し、硬化物を作製した。得られた硬化物について耐熱性、線膨張係数、熱伝導度を評価した。また、本発明のエポキシ樹脂(A−1、A−2、A−3)および比較用のエポキシ樹脂(A−4、A−5)についての溶剤溶解性を下記の方法で測定した。結果を表1に示す。
粘弾性測定装置(DMA:レオメトリック社製固体粘弾性測定装置RSAII、レクタンギュラーテンション法;周波数3.5Hz、昇温速度3℃/min)を用いて、弾性率変化が最大となる(tanδ変化率が最も大きい)温度をガラス転移温度として評価した。
<耐熱性(5%重量減少温度)>
示差熱熱量重量同時測定装置(エスアイアイ・ナノテクノロジー社製TG/DTA6200)を用いて、アルミパン容器に樹脂塗膜を秤量し、室温から500℃まで昇温し、5%重量減少温度を測定した。
測定条件
測定温度:室温〜500℃
測定雰囲気:窒素
昇温速度:10℃/min
<線膨張係数>
熱機械分析装置(TMA:島津製作所社製TMA−50)を用いて、引張モードで熱機械分析を行った。
測定条件
荷重:1.5g
昇温速度:10℃/分で2回
測定温度範囲:50℃から300℃
上記条件での測定を同一サンプルにつき2回実施し、2回目の測定における、25℃か
ら280℃の温度範囲における平均膨張係数を線膨張係数として評価した。
<熱伝導度>
熱伝導率(λ)を、比重(ρ)、熱拡散率(α)、比熱容量(C)を用いて、λ=αρCの式に基づき、算出した。比重、熱拡散率および比熱容量は、それぞれ、以下に示す方法により求めた。
(1)比重
電子天秤CP224Sおよび比重測定キットYDK01CP(ザルトリウス社製)を用いて、比重を測定した。
(2)熱拡散率
熱拡散率測定装置LFA447Nanoflash(NETZSCH社製)を用いて、25℃における熱拡散率を測定した。
(3)比熱容量
示差走査熱量計EXSTAR7200(日立ハイテクサイエンス社製)により、25℃における比熱容量を算出した。
測定条件
測定温度:−20〜100℃
測定雰囲気:窒素
昇温速度:10℃/min
<溶剤溶解性>
エポキシ樹脂10部とメチルエチルケトン4.3部をサンプル瓶中、密閉状態60℃で溶解させた。その後、25℃まで冷却し、結晶が析出するか評価した。結晶が析出しない場合は○、結晶が析出した場合は×として判定した。
合成例1で得られた本発明のエポキシ樹脂(A−1)および比較用エポキシ樹脂として、3,3’ ,5,5’−テトラメチル−4,4’−ビフェノール型エポキシ樹脂(A−4)、ナフタレン型4官能エポキシ樹脂HP−4700(DIC(株)社製)(A−5)、反応性希釈剤としてトリメチロールプロパンポリグリシジエーテル(SR−TMPL(坂本薬品工業(株)社製)、硬化促進剤としてイミダゾール(2P4MHZ−PW(四国化成工業(株)社製))、無機充填材として市販のシランカップリング処理アルミナ(アドマテックス(株)社製、AC9500−SCX)を用いて表2に示した組成で配合し、3本ロールで樹脂の溶融温度以上で混練し、脱泡することで樹脂組成物を作製した。得られた樹脂組成物を用いて、熱プレス成形により樹脂硬化物試験片(60×110×0.8mm)を作成した(仮硬化条件170℃×20分、本硬化条件170℃×2時間)。得られた硬化物について前記の方法で熱伝導度を測定した。さらに、得られた硬化物を175℃の乾燥機中で1000時間放置した後、熱伝導度を測定し、熱伝導率の維持率が90%以上の場合を○、90%以下の場合を×で判定した。結果を表2に示す。
Claims (15)
- エポキシ樹脂と、硬化剤または硬化促進剤の少なくとも一種とを含有するエポキシ樹脂組成物であって、前記エポキシ樹脂が下記式(1)で示されるエポキシ樹脂であることを特徴とする、電子材料用エポキシ樹脂組成物。
- 更にフィラーを含有する、請求項1に記載の電子材料用エポキシ樹脂組成物。
- フィラーがシリカである、請求項2に記載の電子材料用エポキシ樹脂組成物。
- フィラーが熱伝導性フィラーである請求項2に記載の電子材料用エポキシ樹脂組成物。
- 熱伝導性フィラーが10W/m/K以上の熱伝導率を有する、請求項4に記載の電子材料用エポキシ樹脂組成物。
- 熱伝導性フィラーが、アルミナ、酸化マグネシウム、酸化亜鉛、ベリリア、窒化ホウ素、窒化アルミニウム、窒化ケイ素、炭化ケイ素、炭化ホウ素、炭化チタン、ダイヤモンドから選択される少なくとも1種である、請求項4または5に記載のエポキシ樹脂組成物。
- 更に、繊維質基材を含有する、請求項1〜6のいずれかに記載の電子材料用エポキシ樹脂組成物。
- 熱伝導性接着剤である請求項1〜6のいずれかに記載の電子材料用エポキシ樹脂組成物。
- 半導体封止材料用である、請求項1〜6のいずれかに記載の電子材料用エポキシ樹脂組成物。
- 電子回路基板材料用である、請求項1〜7のいずれかに記載の電子材料用エポキシ樹脂組成物。
- 請求項1〜10のいずれかに記載の電子材料用エポキシ樹脂組成物を硬化反応させてなることを特徴とする、電子材料用エポキシ樹脂硬化物。
- 請求項11に記載の電子材料用エポキシ樹脂硬化物を含有する、電子部材。
- 熱伝導接着剤である請求項12に記載の電子部材。
- 半導体封止材である、請求項12に記載の電子部材。
- 電子回路基板である、請求項12に記載の電子部材。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014136773 | 2014-07-02 | ||
JP2014136773 | 2014-07-02 | ||
PCT/JP2015/068957 WO2016002833A1 (ja) | 2014-07-02 | 2015-07-01 | 電子材料用エポキシ樹脂組成物、その硬化物および電子部材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2016002833A1 JPWO2016002833A1 (ja) | 2017-04-27 |
JP6160775B2 true JP6160775B2 (ja) | 2017-07-12 |
Family
ID=55019363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016531415A Active JP6160775B2 (ja) | 2014-07-02 | 2015-07-01 | 電子材料用エポキシ樹脂組成物、その硬化物および電子部材 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20170158807A1 (ja) |
EP (1) | EP3165549B1 (ja) |
JP (1) | JP6160775B2 (ja) |
KR (1) | KR102362604B1 (ja) |
CN (1) | CN106471035B (ja) |
TW (1) | TWI673319B (ja) |
WO (1) | WO2016002833A1 (ja) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170033886A (ko) * | 2014-07-22 | 2017-03-27 | 사빅 글로벌 테크놀러지스 비.브이. | 고온 모노머 및 이들의 용도의 방법 |
JP6121074B1 (ja) * | 2015-09-16 | 2017-04-26 | 大日精化工業株式会社 | アルミナ系熱伝導性酸化物及びその製造方法 |
JP6740254B2 (ja) * | 2015-12-24 | 2020-08-12 | 株式会社カネカ | 樹脂組成物およびそれを用いた半硬化性熱伝導フィルムおよび回路基板および接着シート |
JP7167441B2 (ja) * | 2016-05-06 | 2022-11-09 | Dic株式会社 | 樹脂組成物、成形体、積層体及び接着剤 |
JP6891639B2 (ja) * | 2016-07-14 | 2021-06-18 | 住友ベークライト株式会社 | 半導体装置、半導体装置の製造方法、半導体封止用エポキシ樹脂組成物および樹脂セット |
JP2018093030A (ja) * | 2016-12-01 | 2018-06-14 | 三菱電機株式会社 | 電子機器および電子機器の製造方法 |
JP6209695B1 (ja) * | 2017-03-02 | 2017-10-04 | 大日精化工業株式会社 | アルミナ系熱伝導性酸化物及びその製造方法 |
CN113410182A (zh) * | 2017-03-31 | 2021-09-17 | 日立化成株式会社 | 电子电路用保护材料、电子电路用保护材料用密封材料、密封方法和半导体装置的制造方法 |
CN107492433B (zh) * | 2017-07-05 | 2019-08-16 | 铜陵江威科技有限公司 | 一种掺杂改性镍粉的铁基软磁复合材料及其制备方法 |
CN107828358B (zh) * | 2017-10-12 | 2021-05-04 | 烟台德邦科技股份有限公司 | 一种低介电常数环保型底部填充胶及其制备方法 |
FR3073223B1 (fr) | 2017-11-07 | 2019-11-15 | Arianegroup Sas | Composes biphenyles pluriepoxydes, preparation et utilisations |
JP6896591B2 (ja) * | 2017-11-14 | 2021-06-30 | Eneos株式会社 | プリプレグ、繊維強化複合材料及び成形体 |
KR102137550B1 (ko) * | 2017-12-12 | 2020-07-24 | 삼성에스디아이 주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 장치 |
JP7294317B2 (ja) * | 2018-03-08 | 2023-06-20 | Tdk株式会社 | 樹脂組成物、樹脂シート、樹脂硬化物および樹脂基板 |
JP7108436B2 (ja) * | 2018-03-22 | 2022-07-28 | 三井化学株式会社 | ビフェニル骨格含有エポキシ化合物の製造方法 |
CN108867152A (zh) * | 2018-03-26 | 2018-11-23 | 江苏亚威变压器有限公司 | 一种变压器绝缘纸及其制备方法 |
JP2019172937A (ja) * | 2018-03-29 | 2019-10-10 | Jnc株式会社 | 放熱部材用組成物、放熱部材、電子機器 |
EP3873986A4 (en) * | 2018-10-29 | 2022-06-22 | Henkel AG & Co. KGaA | THERMOCONDUCTIVE COATING COMPOSITION |
JP7293623B2 (ja) * | 2018-11-28 | 2023-06-20 | 住友ベークライト株式会社 | 熱硬化性樹脂組成物 |
JP7234607B2 (ja) * | 2018-11-28 | 2023-03-08 | 住友ベークライト株式会社 | 放熱絶縁材料用熱硬化性樹脂組成物 |
CN109929220B (zh) * | 2019-03-02 | 2021-08-10 | 深圳市百柔新材料技术有限公司 | 绝缘导热浆料及其制备方法和应用 |
CN109929221A (zh) * | 2019-03-11 | 2019-06-25 | 北京工业大学 | 一种采用表面活化环氧树脂粉末制备脂塑复合材料的方法 |
CN110028652A (zh) * | 2019-04-29 | 2019-07-19 | 上海华谊树脂有限公司 | 一种含有联苯结构的高纯环氧树脂及其制备方法 |
TWI709607B (zh) * | 2019-05-07 | 2020-11-11 | 長春人造樹脂廠股份有限公司 | 樹脂組合物及其應用 |
CN110643314B (zh) * | 2019-10-22 | 2023-04-21 | 亿铖达(深圳)新材料有限公司 | 一种高效环氧导热结构胶及其制备方法 |
CN111393927A (zh) * | 2020-03-27 | 2020-07-10 | 广州番禺电缆集团有限公司 | 一种水性易散热抗菌绝缘涂料及其制备方法 |
CN111394031B (zh) * | 2020-04-10 | 2022-03-22 | 烟台德邦科技股份有限公司 | 一种高电绝缘性能底部填充胶的制备方法 |
KR102665491B1 (ko) * | 2020-11-06 | 2024-05-10 | 삼성에스디아이 주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 사용하여 밀봉된 반도체 소자 |
CN112876998A (zh) * | 2021-01-22 | 2021-06-01 | 海泰纳鑫科技(成都)有限公司 | 光学电子封装用环氧树脂胶黏剂及其制备方法和应用 |
CN113355038A (zh) * | 2021-06-21 | 2021-09-07 | 贵州兰鑫石墨机电设备制造有限公司 | 用于石墨列管换热器的高强高韧粘接剂及制备方法 |
CN115677980A (zh) * | 2021-07-28 | 2023-02-03 | 华为技术有限公司 | 一种环氧树脂及其制备方法、树脂组合物 |
CN114163776A (zh) * | 2022-01-24 | 2022-03-11 | 西南石油大学 | 一种具有承压堵漏功能的环氧树脂及其制备方法 |
DE102022111490A1 (de) | 2022-05-09 | 2023-11-09 | HELLA GmbH & Co. KGaA | Lichtmodul für eine Kraftfahrzeugbeleuchtungseinrichtung und Verfahren zur Herstellung eines Lichtmoduls |
KR102582101B1 (ko) | 2023-06-16 | 2023-09-22 | 주식회사 케이피 일렉트릭 | 고열전도성 절연 수지 조성물 및 이의 제조방법 |
KR102582104B1 (ko) | 2023-08-18 | 2023-09-22 | 주식회사 케이피 일렉트릭 | 고열전도성 절연 수지 조성물을 적용한 변압기 권선의구조 및 제조방법 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3271350A (en) * | 1963-05-28 | 1966-09-06 | Gen Mills Inc | Epoxy resin composition compristing (1) partial reaction product of epoxy resin and guanamine and (2) unreacted epoxy resin |
US3374203A (en) * | 1965-03-25 | 1968-03-19 | Gen Electric | Triglycidyl ethers and resins of trihydroxybiphenyls |
US3721644A (en) * | 1970-12-28 | 1973-03-20 | Lee Pharmaceuticals | Thermosetting acrylic resins and their use as binders in dental filling compositions |
JPS5416367B2 (ja) | 1973-10-09 | 1979-06-21 | ||
FR2445843A1 (fr) * | 1979-01-05 | 1980-08-01 | Rhone Poulenc Ind | Procede de preparation de polyethers glycidyliques de polyphenols |
JP2953661B2 (ja) | 1988-03-31 | 1999-09-27 | 株式会社東芝 | 半導体封止用エポキシ樹脂成形材料 |
JPH0794649B2 (ja) * | 1988-09-06 | 1995-10-11 | 東洋インキ製造株式会社 | 感圧性接着剤組成物 |
JPH11147936A (ja) * | 1997-11-19 | 1999-06-02 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
JPH11323162A (ja) | 1998-03-19 | 1999-11-26 | Hitachi Ltd | 絶縁組成物 |
JP4247658B2 (ja) | 2001-07-12 | 2009-04-02 | Dic株式会社 | 新規エポキシ樹脂、エポキシ樹脂組成物及びその硬化物 |
EP1275673B1 (en) * | 2001-07-12 | 2006-08-23 | Dainippon Ink And Chemicals, Inc. | Epoxy resin composition, cured article thereof, novel epoxy resin, novel phenol compound, and process for preparing the same |
JP5348740B2 (ja) | 2008-06-23 | 2013-11-20 | 日本化薬株式会社 | エポキシ樹脂、エポキシ樹脂組成物、およびその硬化物 |
JP2010106228A (ja) * | 2008-09-30 | 2010-05-13 | Tdk Corp | エポキシ樹脂組成物、並びに、これを用いた硬化物、半硬化物、プリプレグ及び複合基板 |
KR101527230B1 (ko) * | 2008-11-14 | 2015-06-08 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 열경화성 수지 조성물 |
JP5353629B2 (ja) * | 2008-11-14 | 2013-11-27 | 信越化学工業株式会社 | 熱硬化性樹脂組成物 |
US20120121224A1 (en) * | 2010-11-12 | 2012-05-17 | Dalrymple Larry V | Cable integrating fiber optics to power and control an electrical submersible pump assembly and related methods |
KR101867118B1 (ko) * | 2011-03-07 | 2018-06-12 | 미츠비시 가스 가가쿠 가부시키가이샤 | 수지 조성물 그리고 이것을 사용한 프리프레그 및 적층판 |
TWI641596B (zh) * | 2013-05-15 | 2018-11-21 | Dic股份有限公司 | 含有聯苯基骨架的環氧樹脂的製造方法 |
KR102248550B1 (ko) * | 2013-12-19 | 2021-05-06 | 디아이씨 가부시끼가이샤 | 에폭시 수지, 그 제조 방법, 에폭시 수지 조성물 및 그 경화물 |
-
2015
- 2015-07-01 CN CN201580036182.0A patent/CN106471035B/zh active Active
- 2015-07-01 EP EP15815767.7A patent/EP3165549B1/en active Active
- 2015-07-01 US US15/321,628 patent/US20170158807A1/en not_active Abandoned
- 2015-07-01 KR KR1020167034466A patent/KR102362604B1/ko active IP Right Grant
- 2015-07-01 WO PCT/JP2015/068957 patent/WO2016002833A1/ja active Application Filing
- 2015-07-01 JP JP2016531415A patent/JP6160775B2/ja active Active
- 2015-07-01 TW TW104121250A patent/TWI673319B/zh active
Also Published As
Publication number | Publication date |
---|---|
US20170158807A1 (en) | 2017-06-08 |
EP3165549A1 (en) | 2017-05-10 |
EP3165549A4 (en) | 2017-12-20 |
KR20170026356A (ko) | 2017-03-08 |
CN106471035A (zh) | 2017-03-01 |
JPWO2016002833A1 (ja) | 2017-04-27 |
KR102362604B1 (ko) | 2022-02-15 |
WO2016002833A1 (ja) | 2016-01-07 |
EP3165549B1 (en) | 2021-06-16 |
TWI673319B (zh) | 2019-10-01 |
TW201609943A (zh) | 2016-03-16 |
CN106471035B (zh) | 2019-04-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6160775B2 (ja) | 電子材料用エポキシ樹脂組成物、その硬化物および電子部材 | |
TWI628199B (zh) | 環氧樹脂組成物、硬化物、放熱材料及電子構件 | |
JP6176412B2 (ja) | 電子材料用エポキシ樹脂組成物、その硬化物および電子部材 | |
JP6540259B2 (ja) | 熱伝導材料用エポキシ樹脂組成物、その硬化物および電子部材 | |
JP5557033B2 (ja) | リン原子含有オリゴマー、その製造方法、硬化性樹脂組成物、その硬化物、及びプリント配線基板 | |
JP5776465B2 (ja) | ナフトール樹脂、硬化性樹脂組成物、その硬化物、及びプリント配線基板 | |
JP5135702B2 (ja) | エポキシ樹脂組成物、その硬化物、半導体封止材料、および半導体装置 | |
JP2012201798A (ja) | 硬化性樹脂組成物、その硬化物、プリント配線基板、及びナフトール樹脂 | |
JP5168547B2 (ja) | エポキシ樹脂組成物、半導体封止材料及び半導体装置 | |
JP5454009B2 (ja) | 硬化性樹脂組成物、その硬化物、及びプリント配線基板 | |
JP5402761B2 (ja) | 硬化性樹脂組成物、その硬化物、リン原子含有フェノール類の製造方法、プリント配線基板用樹脂組成物、プリント配線基板、フレキシブル配線基板用樹脂組成物、半導体封止材料用樹脂組成物、及びビルドアップ基板用層間絶縁材料用樹脂組成物 | |
JP5983662B2 (ja) | 電子材料用エポキシ樹脂組成物およびその硬化物 | |
JP5637368B2 (ja) | 硬化性樹脂組成物、その硬化物、リン原子含有フェノール化合物の製造方法、プリント配線基板用樹脂組成物、プリント配線基板、フレキシブル配線基板用樹脂組成物、半導体封止材料用樹脂組成物、及びビルドアップ基板用層間絶縁材料用樹脂組成物 | |
JP5516980B2 (ja) | 新規リン原子含有フェノール樹脂、その製造方法、硬化性樹脂組成物、その硬化物、プリント配線基板用樹脂組成物、プリント配線基板、フレキシブル配線基板用樹脂組成物、半導体封止材料用樹脂組成物、及びビルドアップ基板用層間絶縁材料用樹脂組成物 | |
JP5994404B2 (ja) | 硬化性樹脂組成物、その硬化物、及びプリント配線基板 | |
JP5598361B2 (ja) | 硬化性樹脂組成物、その硬化物、プリント配線基板用樹脂組成物、プリント配線基板、フレキシブル配線基板用樹脂組成物、半導体封止材料用樹脂組成物、及びビルドアップ基板用層間絶縁材料用樹脂組成物 | |
JP5598373B2 (ja) | 硬化性樹脂組成物、その硬化物、プリント配線基板用樹脂組成物、プリント配線基板、フレキシブル配線基板用樹脂組成物、半導体封止材料用樹脂組成物、及びビルドアップ基板用層間絶縁材料用樹脂組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20161102 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20161102 |
|
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20170117 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170124 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170322 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170516 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170529 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 6160775 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |