JP5800674B2 - 配線基板及びその製造方法 - Google Patents
配線基板及びその製造方法 Download PDFInfo
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- JP5800674B2 JP5800674B2 JP2011233720A JP2011233720A JP5800674B2 JP 5800674 B2 JP5800674 B2 JP 5800674B2 JP 2011233720 A JP2011233720 A JP 2011233720A JP 2011233720 A JP2011233720 A JP 2011233720A JP 5800674 B2 JP5800674 B2 JP 5800674B2
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- electrode
- wiring board
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- opening
- forming
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09545—Plated through-holes or blind vias without lands
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Wire Bonding (AREA)
Description
12…異形突起電極の上面
13…凹み部
14…異形突起電極の側面
15…アール部
41,42,43,44…層間絶縁層としての樹脂絶縁層
80…積層部
81…レジストとしてのめっきレジスト
82…開口部
101,201…配線基板としてのコアレス配線基板
102…基板主面としての第1基板主面
130…はんだバンプ
131…部品としてのICチップ
132…接続端子
133,202…電極形成領域
204…突起電極
A1…上端における外径
A2…下端における外径
C1…中心軸
Claims (7)
- 基板主面上の電極形成領域内に複数の突起電極が配置された配線基板であって、
前記複数の突起電極のうち少なくとも1つは、上面に凹み部を有し、上端における外径が下端における外径よりも大きく設定され、全体として断面逆台形状をなしている異形突起電極であり、
前記異形突起電極の前記上面と前記異形突起電極の側面との境界部分に、アール部が形成されている
ことを特徴とする配線基板。 - 前記凹み部の内面全体は曲面状をなし、前記凹み部の最深部が前記異形突起電極の中心軸上に位置していることを特徴とする請求項1に記載の配線基板。
- 前記電極形成領域内に存在する前記突起電極の全てが、前記異形突起電極であることを特徴とする請求項1または2に記載の配線基板。
- 前記複数の突起電極は、前記電極形成領域内において前記基板主面の面方向に沿って縦横に複数配列されており、
前記複数の突起電極のうち前記電極形成領域の外周部に位置する突起電極が、前記異形突起電極である
ことを特徴とする請求項1または2に記載の配線基板。 - 前記異形突起電極は、前記凹み部上に載置される複数のはんだバンプを加熱溶融させることによって、部品の底面側に配置された複数の接続端子に対してフリップチップ接続されることを特徴とする請求項1乃至4のいずれか1項に記載の配線基板。
- 請求項1乃至5のいずれか1項に記載の配線基板を製造する方法であって、
複数の層間絶縁層を積層してなる積層部を準備する積層部準備工程と、
前記複数の層間絶縁層のうち前記基板主面を有する最上層の層間絶縁層の上にレジストを形成するレジスト形成工程と、
前記レジストに、上端側開口の内径が下端側開口の内径よりも大きく設定された開口部を形成する開口部形成工程と、
前記開口部の内側に対してめっきを行うことにより、前記開口部に前記異形突起電極を形成する異形突起電極形成工程と
を含むことを特徴とする配線基板の製造方法。 - 前記異形突起電極形成工程後、前記異形突起電極に対してエッチングを行うことにより、前記異形突起電極の前記上面と前記異形突起電極の側面との境界部分にアール部を形成するアール部形成工程を行うことを特徴とする請求項6に記載の配線基板の製造方法。
Priority Applications (5)
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---|---|---|---|
JP2011233720A JP5800674B2 (ja) | 2011-10-25 | 2011-10-25 | 配線基板及びその製造方法 |
CN2012104043952A CN103117264A (zh) | 2011-10-25 | 2012-10-22 | 布线基板及其制造方法 |
KR1020120118301A KR20130045205A (ko) | 2011-10-25 | 2012-10-24 | 배선기판 및 그 제조방법 |
TW101139169A TWI499012B (zh) | 2011-10-25 | 2012-10-24 | 配線基板及其製造方法 |
US13/659,147 US9059152B2 (en) | 2011-10-25 | 2012-10-24 | Wiring substrate and manufacturing method of the same |
Applications Claiming Priority (1)
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JP2011233720A JP5800674B2 (ja) | 2011-10-25 | 2011-10-25 | 配線基板及びその製造方法 |
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JP2013093404A JP2013093404A (ja) | 2013-05-16 |
JP5800674B2 true JP5800674B2 (ja) | 2015-10-28 |
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JP2011233720A Expired - Fee Related JP5800674B2 (ja) | 2011-10-25 | 2011-10-25 | 配線基板及びその製造方法 |
Country Status (5)
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US (1) | US9059152B2 (ja) |
JP (1) | JP5800674B2 (ja) |
KR (1) | KR20130045205A (ja) |
CN (1) | CN103117264A (ja) |
TW (1) | TWI499012B (ja) |
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US9693445B2 (en) * | 2015-01-30 | 2017-06-27 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Printed circuit board with thermal via |
CN109075769B (zh) * | 2016-04-28 | 2022-05-27 | 株式会社村田制作所 | 弹性波装置 |
CN107424973B (zh) * | 2016-05-23 | 2020-01-21 | 凤凰先驱股份有限公司 | 封装基板及其制法 |
KR102003451B1 (ko) | 2016-06-30 | 2019-07-24 | 코오롱인더스트리 주식회사 | 경화 가능한 석유수지, 이의 제조방법 및 이의 용도 |
JP6836121B2 (ja) | 2016-08-19 | 2021-02-24 | セイコーエプソン株式会社 | 実装構造体、超音波デバイス、超音波探触子、超音波装置、電子機器、及び実装構造体の製造方法 |
JP6775391B2 (ja) * | 2016-11-18 | 2020-10-28 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
FR3069127B1 (fr) * | 2017-07-13 | 2019-07-26 | Safran Electronics & Defense | Carte electronique comprenant des cms brases sur des plages de brasage enterrees |
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CN108196738B (zh) * | 2018-01-16 | 2021-09-03 | 京东方科技集团股份有限公司 | 触控面板及其制造方法、触控显示装置 |
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- 2012-10-22 CN CN2012104043952A patent/CN103117264A/zh active Pending
- 2012-10-24 TW TW101139169A patent/TWI499012B/zh not_active IP Right Cessation
- 2012-10-24 US US13/659,147 patent/US9059152B2/en not_active Expired - Fee Related
- 2012-10-24 KR KR1020120118301A patent/KR20130045205A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
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TWI499012B (zh) | 2015-09-01 |
US9059152B2 (en) | 2015-06-16 |
TW201324698A (zh) | 2013-06-16 |
US20130100626A1 (en) | 2013-04-25 |
CN103117264A (zh) | 2013-05-22 |
KR20130045205A (ko) | 2013-05-03 |
JP2013093404A (ja) | 2013-05-16 |
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