JP5762081B2 - リードフレーム及び半導体装置 - Google Patents

リードフレーム及び半導体装置 Download PDF

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Publication number
JP5762081B2
JP5762081B2 JP2011073264A JP2011073264A JP5762081B2 JP 5762081 B2 JP5762081 B2 JP 5762081B2 JP 2011073264 A JP2011073264 A JP 2011073264A JP 2011073264 A JP2011073264 A JP 2011073264A JP 5762081 B2 JP5762081 B2 JP 5762081B2
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JP
Japan
Prior art keywords
plating layer
plating
lead
lead frame
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011073264A
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English (en)
Japanese (ja)
Other versions
JP2012209396A (ja
JP2012209396A5 (enExample
Inventor
宗昭 呉
宗昭 呉
崇 吉江
崇 吉江
正幸 大串
正幸 大串
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2011073264A priority Critical patent/JP5762081B2/ja
Priority to US13/421,120 priority patent/US8581379B2/en
Priority to TW101110141A priority patent/TWI533426B/zh
Priority to KR1020120030412A priority patent/KR101924407B1/ko
Priority to CN201210098663.2A priority patent/CN102738109B/zh
Publication of JP2012209396A publication Critical patent/JP2012209396A/ja
Publication of JP2012209396A5 publication Critical patent/JP2012209396A5/ja
Application granted granted Critical
Publication of JP5762081B2 publication Critical patent/JP5762081B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H10W70/457—
    • H10W70/40—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/07337—
    • H10W72/075—
    • H10W72/07554—
    • H10W72/325—
    • H10W72/352—
    • H10W72/547—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/5525—
    • H10W72/59—
    • H10W72/865—
    • H10W72/884—
    • H10W72/952—
    • H10W74/111—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP2011073264A 2011-03-29 2011-03-29 リードフレーム及び半導体装置 Active JP5762081B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011073264A JP5762081B2 (ja) 2011-03-29 2011-03-29 リードフレーム及び半導体装置
US13/421,120 US8581379B2 (en) 2011-03-29 2012-03-15 Lead frame and semiconductor device
TW101110141A TWI533426B (zh) 2011-03-29 2012-03-23 導線架及半導體裝置
KR1020120030412A KR101924407B1 (ko) 2011-03-29 2012-03-26 리드 프레임 및 반도체 장치
CN201210098663.2A CN102738109B (zh) 2011-03-29 2012-03-27 引线框架及半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011073264A JP5762081B2 (ja) 2011-03-29 2011-03-29 リードフレーム及び半導体装置

Publications (3)

Publication Number Publication Date
JP2012209396A JP2012209396A (ja) 2012-10-25
JP2012209396A5 JP2012209396A5 (enExample) 2014-01-09
JP5762081B2 true JP5762081B2 (ja) 2015-08-12

Family

ID=46926108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011073264A Active JP5762081B2 (ja) 2011-03-29 2011-03-29 リードフレーム及び半導体装置

Country Status (5)

Country Link
US (1) US8581379B2 (enExample)
JP (1) JP5762081B2 (enExample)
KR (1) KR101924407B1 (enExample)
CN (1) CN102738109B (enExample)
TW (1) TWI533426B (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008091818A (ja) * 2006-10-05 2008-04-17 Matsushita Electric Ind Co Ltd 光半導体装置用リードフレームおよびこれを用いた光半導体装置、並びにこれらの製造方法
US8703545B2 (en) * 2012-02-29 2014-04-22 Alpha & Omega Semiconductor, Inc. Aluminum alloy lead-frame and its use in fabrication of power semiconductor package
JP6057285B2 (ja) * 2012-10-26 2017-01-11 Ｓｈマテリアル株式会社 半導体素子搭載用基板
JP6095997B2 (ja) 2013-02-13 2017-03-15 エスアイアイ・セミコンダクタ株式会社 樹脂封止型半導体装置の製造方法
KR101802851B1 (ko) * 2013-03-11 2017-11-29 해성디에스 주식회사 리드 프레임, 이를 포함하는 반도체 패키지, 및 리드 프레임의 제조 방법
US9728493B2 (en) * 2015-08-28 2017-08-08 Infineon Technologies Ag Mold PackageD semiconductor chip mounted on a leadframe and method of manufacturing the same
JP6752639B2 (ja) 2016-05-02 2020-09-09 ローム株式会社 半導体装置の製造方法
US10388616B2 (en) 2016-05-02 2019-08-20 Rohm Co., Ltd. Semiconductor device and method for manufacturing the same
JP2018024832A (ja) * 2016-07-29 2018-02-15 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物および半導体装置
JP6750416B2 (ja) * 2016-09-14 2020-09-02 富士電機株式会社 半導体モジュールおよび半導体モジュールの製造方法
JP2018056451A (ja) * 2016-09-30 2018-04-05 ルネサスエレクトロニクス株式会社 半導体装置
JP6772087B2 (ja) * 2017-02-17 2020-10-21 新光電気工業株式会社 リードフレーム及びその製造方法
JP7037368B2 (ja) * 2018-01-09 2022-03-16 ローム株式会社 半導体装置および半導体装置の製造方法
CN110265376A (zh) * 2018-03-12 2019-09-20 意法半导体股份有限公司 引线框架表面精整
US11545418B2 (en) * 2018-10-24 2023-01-03 Texas Instruments Incorporated Thermal capacity control for relative temperature-based thermal shutdown
US11735512B2 (en) 2018-12-31 2023-08-22 Stmicroelectronics International N.V. Leadframe with a metal oxide coating and method of forming the same
KR102586964B1 (ko) * 2022-04-05 2023-10-11 해성디에스 주식회사 반도체 패키지 기판, 이를 포함하는 반도체 패키지, 및 반도체 패키지 기판의 제조방법
KR102695962B1 (ko) * 2022-11-21 2024-08-20 해성디에스 주식회사 리드 프레임 및 그 리드 프레임을 포함하는 반도체 패키지

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2543619B2 (ja) * 1990-09-05 1996-10-16 新光電気工業株式会社 半導体装置用リ―ドフレ―ム
JPH1074879A (ja) * 1996-08-30 1998-03-17 Mitsui High Tec Inc 半導体装置用リードフレーム
KR100231828B1 (ko) * 1997-02-20 1999-12-01 유무성 다층 도금 리드프레임
TW448204B (en) * 1997-04-09 2001-08-01 Jeng Wu Shuen A method for catalytic depolymerization of polyethylene terephthalate
JP4115558B2 (ja) 1997-09-02 2008-07-09 三星電子株式会社 間欠記録装置
US7408248B2 (en) 2004-05-27 2008-08-05 Shinko Electric Industries Co., Ltd. Lead frame for semiconductor device
KR100673951B1 (ko) * 2004-06-23 2007-01-24 삼성테크윈 주식회사 반도체 팩키지용 리드 프레임
US7268415B2 (en) * 2004-11-09 2007-09-11 Texas Instruments Incorporated Semiconductor device having post-mold nickel/palladium/gold plated leads
US20060125062A1 (en) * 2004-12-15 2006-06-15 Zuniga-Ortiz Edgar R Semiconductor package having improved adhesion and solderability
JP4820616B2 (ja) * 2005-10-20 2011-11-24 パナソニック株式会社 リードフレーム
JP4888064B2 (ja) * 2006-11-09 2012-02-29 株式会社デンソー 樹脂封止型半導体装置
JP4715772B2 (ja) * 2007-02-28 2011-07-06 株式会社デンソー 半導体装置

Also Published As

Publication number Publication date
TWI533426B (zh) 2016-05-11
KR101924407B1 (ko) 2018-12-03
US8581379B2 (en) 2013-11-12
CN102738109B (zh) 2016-08-24
US20120248591A1 (en) 2012-10-04
KR20120112080A (ko) 2012-10-11
TW201246492A (en) 2012-11-16
JP2012209396A (ja) 2012-10-25
CN102738109A (zh) 2012-10-17

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