TWI533426B - 導線架及半導體裝置 - Google Patents

導線架及半導體裝置 Download PDF

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Publication number
TWI533426B
TWI533426B TW101110141A TW101110141A TWI533426B TW I533426 B TWI533426 B TW I533426B TW 101110141 A TW101110141 A TW 101110141A TW 101110141 A TW101110141 A TW 101110141A TW I533426 B TWI533426 B TW I533426B
Authority
TW
Taiwan
Prior art keywords
plating layer
layer
lead frame
plating
wire
Prior art date
Application number
TW101110141A
Other languages
English (en)
Chinese (zh)
Other versions
TW201246492A (en
Inventor
吳宗昭
吉江崇
大串正幸
Original Assignee
新光電氣工業股份有限公司
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Filing date
Publication date
Application filed by 新光電氣工業股份有限公司 filed Critical 新光電氣工業股份有限公司
Publication of TW201246492A publication Critical patent/TW201246492A/zh
Application granted granted Critical
Publication of TWI533426B publication Critical patent/TWI533426B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/865—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
TW101110141A 2011-03-29 2012-03-23 導線架及半導體裝置 TWI533426B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011073264A JP5762081B2 (ja) 2011-03-29 2011-03-29 リードフレーム及び半導体装置

Publications (2)

Publication Number Publication Date
TW201246492A TW201246492A (en) 2012-11-16
TWI533426B true TWI533426B (zh) 2016-05-11

Family

ID=46926108

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101110141A TWI533426B (zh) 2011-03-29 2012-03-23 導線架及半導體裝置

Country Status (5)

Country Link
US (1) US8581379B2 (enExample)
JP (1) JP5762081B2 (enExample)
KR (1) KR101924407B1 (enExample)
CN (1) CN102738109B (enExample)
TW (1) TWI533426B (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008091818A (ja) * 2006-10-05 2008-04-17 Matsushita Electric Ind Co Ltd 光半導体装置用リードフレームおよびこれを用いた光半導体装置、並びにこれらの製造方法
US8703545B2 (en) * 2012-02-29 2014-04-22 Alpha & Omega Semiconductor, Inc. Aluminum alloy lead-frame and its use in fabrication of power semiconductor package
JP6057285B2 (ja) * 2012-10-26 2017-01-11 Ｓｈマテリアル株式会社 半導体素子搭載用基板
JP6095997B2 (ja) * 2013-02-13 2017-03-15 エスアイアイ・セミコンダクタ株式会社 樹脂封止型半導体装置の製造方法
KR101802851B1 (ko) * 2013-03-11 2017-11-29 해성디에스 주식회사 리드 프레임, 이를 포함하는 반도체 패키지, 및 리드 프레임의 제조 방법
US9728493B2 (en) * 2015-08-28 2017-08-08 Infineon Technologies Ag Mold PackageD semiconductor chip mounted on a leadframe and method of manufacturing the same
US10388616B2 (en) * 2016-05-02 2019-08-20 Rohm Co., Ltd. Semiconductor device and method for manufacturing the same
JP6752639B2 (ja) 2016-05-02 2020-09-09 ローム株式会社 半導体装置の製造方法
JP2018024832A (ja) * 2016-07-29 2018-02-15 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物および半導体装置
JP6750416B2 (ja) * 2016-09-14 2020-09-02 富士電機株式会社 半導体モジュールおよび半導体モジュールの製造方法
JP2018056451A (ja) * 2016-09-30 2018-04-05 ルネサスエレクトロニクス株式会社 半導体装置
JP6772087B2 (ja) * 2017-02-17 2020-10-21 新光電気工業株式会社 リードフレーム及びその製造方法
JP7037368B2 (ja) * 2018-01-09 2022-03-16 ローム株式会社 半導体装置および半導体装置の製造方法
CN110265376A (zh) 2018-03-12 2019-09-20 意法半导体股份有限公司 引线框架表面精整
US11545418B2 (en) * 2018-10-24 2023-01-03 Texas Instruments Incorporated Thermal capacity control for relative temperature-based thermal shutdown
US11735512B2 (en) 2018-12-31 2023-08-22 Stmicroelectronics International N.V. Leadframe with a metal oxide coating and method of forming the same
KR102586964B1 (ko) * 2022-04-05 2023-10-11 해성디에스 주식회사 반도체 패키지 기판, 이를 포함하는 반도체 패키지, 및 반도체 패키지 기판의 제조방법
KR102695962B1 (ko) * 2022-11-21 2024-08-20 해성디에스 주식회사 리드 프레임 및 그 리드 프레임을 포함하는 반도체 패키지

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2543619B2 (ja) * 1990-09-05 1996-10-16 新光電気工業株式会社 半導体装置用リ―ドフレ―ム
JPH1074879A (ja) * 1996-08-30 1998-03-17 Mitsui High Tec Inc 半導体装置用リードフレーム
KR100231828B1 (ko) * 1997-02-20 1999-12-01 유무성 다층 도금 리드프레임
TW448204B (en) * 1997-04-09 2001-08-01 Jeng Wu Shuen A method for catalytic depolymerization of polyethylene terephthalate
JP4115558B2 (ja) 1997-09-02 2008-07-09 三星電子株式会社 間欠記録装置
US7408248B2 (en) 2004-05-27 2008-08-05 Shinko Electric Industries Co., Ltd. Lead frame for semiconductor device
KR100673951B1 (ko) * 2004-06-23 2007-01-24 삼성테크윈 주식회사 반도체 팩키지용 리드 프레임
US7268415B2 (en) * 2004-11-09 2007-09-11 Texas Instruments Incorporated Semiconductor device having post-mold nickel/palladium/gold plated leads
US20060125062A1 (en) * 2004-12-15 2006-06-15 Zuniga-Ortiz Edgar R Semiconductor package having improved adhesion and solderability
JP4820616B2 (ja) * 2005-10-20 2011-11-24 パナソニック株式会社 リードフレーム
JP4888064B2 (ja) * 2006-11-09 2012-02-29 株式会社デンソー 樹脂封止型半導体装置
JP4715772B2 (ja) * 2007-02-28 2011-07-06 株式会社デンソー 半導体装置

Also Published As

Publication number Publication date
KR20120112080A (ko) 2012-10-11
JP2012209396A (ja) 2012-10-25
TW201246492A (en) 2012-11-16
JP5762081B2 (ja) 2015-08-12
KR101924407B1 (ko) 2018-12-03
US20120248591A1 (en) 2012-10-04
CN102738109A (zh) 2012-10-17
US8581379B2 (en) 2013-11-12
CN102738109B (zh) 2016-08-24

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