JP5762081B2 - リードフレーム及び半導体装置 - Google Patents
リードフレーム及び半導体装置 Download PDFInfo
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- JP5762081B2 JP5762081B2 JP2011073264A JP2011073264A JP5762081B2 JP 5762081 B2 JP5762081 B2 JP 5762081B2 JP 2011073264 A JP2011073264 A JP 2011073264A JP 2011073264 A JP2011073264 A JP 2011073264A JP 5762081 B2 JP5762081 B2 JP 5762081B2
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- plating layer
- plating
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- layer
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- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
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Description
(リードフレーム)
まず、リードフレーム1の構造を説明する。
図2に示すように、封止樹脂23によって覆われるダイパッド3及びインナーリード7の表裏面及び側面には、下地用の第1めっき層11と、第2めっき層12と、第3めっき層13と、第4めっき層14とが順に積層された4層構造のめっき15Aがそれぞれ施されている。ここで、本実施形態では、第1めっき層11がニッケル(Ni)めっき層、第2めっき層12がパラジウム(Pd)めっき層、第3めっき層13が銀(Ag)めっき層、第4めっき層14が金(Au)めっき層である。一方、封止樹脂23から露出されているアウターリード8の表裏面及び側面には、下地用の第1めっき層11と、第2めっき層12と、第4めっき層14とが順に積層された3層構造のめっき15Bが施されている。
次に、半導体装置20の構造について説明する。
図2に示すように、樹脂封止型の半導体装置20は、上記リードフレーム1を用いて作成されたQFPのパッケージ構造を有している。この半導体装置20では、リードフレーム1のダイパッド3上、具体的にはダイパッド3の表面上に形成されためっき15A上に、半導体素子21が接着剤21A(例えば、Agペースト)により接着されている。この半導体素子21の電極21Bは、ボンディングワイヤ22を介してインナーリード7に接続されている。具体的には、半導体素子21の電極21Bは、ボンディングワイヤ22及び第1〜第4めっき層11〜14(めっき15A)を介して、インナーリード7と電気的に接続されている。これら半導体素子21、ボンディングワイヤ22、ダイパッド3及びインナーリード7は、封止樹脂23によって封止されている(覆われている)。そして、この半導体装置20では、アウターリード8が外部接続端子として封止樹脂23から露出されている。
次に、上記4層構造のめっき15Aが施されたインナーリード7について、Cuワイヤの接続信頼性(ワイヤボンディング性)を評価した結果を説明する。
(信頼性評価)
封止樹脂内の基板フレームにAgめっき層を含む4層構造のめっきが施された構造(図2参照)の半導体装置に対して信頼性試験(吸湿リフロー試験)を行って、その半導体装置の信頼性を評価した。また、その比較例として、封止樹脂内の基板フレームにAgめっき層を含まない3層構造のめっきが施された構造(図15参照)の半導体装置に対しても同様の評価を行った。すなわち、これら両半導体装置に対する信頼性試験は、Agめっき層の有無が異なるだけで、その他の構造及び評価条件は同一である。図7及び図8は、このような信頼性試験前後の半導体装置において、封止樹脂とリードフレームとの間に剥離が生じているか否かを超音波探傷装置(SAT)で観察した結果を示している。
吸湿条件:JEDEC MSL 2a(60℃/60%RH×120hrs)、リフロー条件:260℃×3回
図7(a)及び図8(a)に示すように、信頼性試験の実施される両半導体装置において、その信頼性試験前には封止樹脂とリードフレームとの間に剥離が生じていないことが確認された。しかし、図8(b)に示すように、封止樹脂内でAgめっき層を含まない3層構造のめっきが施された半導体装置では、信頼性試験が行われた後、検査した全てのダイパッドで封止樹脂とリードフレームとの間の剥離が検出された(白枠参照)。これに対し、図7(b)に示すように、封止樹脂内でAgめっき層を含む4層構造のめっきが施された半導体装置では、信頼性試験を行った後でも、検査した全てのダイパッドで封止樹脂とリードフレームとの間の剥離は検出されなかった。これらの結果から、図2に示す半導体装置20において、封止樹脂23で封止される領域の基板フレーム2に第3めっき層13(Agめっき層)を含む4層構造のめっき15Aを施すことにより、半導体装置20の信頼性を向上させることができるのが分かる。
ところで、基板フレーム2上に4層構造のめっき15Aを施す構造としては、図16に示すように、インナーリード7と同様に、アウターリード8上にも4層構造のめっき15Aを施す構造が考えられる。しかし、本実施形態では、封止樹脂23から露出されるアウターリード8上には、意図的に、第3めっき層13(Agめっき層)を含まない3層構造のめっき15Bを施すようにした。以下に、その理由を説明する。すなわち、封止樹脂23から露出されるアウターリード8上に、第3めっき層13を形成した場合に発生する問題点を以下に説明する。
リードフレームがパッケージとなって、基板上にはんだ実装される際に、基板側のはんだとしてSn−Ag−Cu等の鉛フリーはんだが使用される場合に、以下の問題が発生するおそれがある。詳述すると、Ag3Sn金属化合物は比較的安定な合金であることから、上述のような鉛フリーはんだは機械的強度に優れた鉛フリーはんだとして知られているが、Sn中のAg濃度が4%を超えると、クリープ強度が過剰となり、基板のランド剥離などの現象を起しやすくなる。さらに、Sn中のAg濃度が5%を超えると、引け巣が発生し、クラックの原因ともなる。ここで、図16に示すように、リードフレーム1Dのアウターリード8(実装面)上に第3めっき層13(Agめっき層)を含むめっき15Aが形成されていると、はんだと接合する部分にAgが大量に存在することになり、Ag濃度が高くなって上述したランド剥離やクラックなどが発生しやすくなる。
Agは、一般に、硫化しやすい金属として知られている。ここで、アウターリード8上にAgめっき層を含むめっき15Aが形成されていると、例えばアセンブリ時にAgがリードフレーム1Dの表層に熱拡散され、その表層においてAgとAuが共存又は合金として存在することになる。すると、リードフレーム1D(特に、アウターリード8)が硫化しやすくなる。さらに、アウターリード8に硫化が発生すると、アウターリード8とはんだとの濡れ性が悪化するという問題が発生する。これらのことを裏付ける実験結果を図9及び図10に示している。以下に、その実験条件及び実験結果を説明する。
ガス試験:デシケータ内に6%亜硫酸水を100ml入れ、その溶液から発生するSO2ガス雰囲気下にリードフレームを60分間放置した。さらに、デシケータ内に2%硫化水素アンモニウム水を100ml入れ、その溶液から発生するH2Sガス雰囲気下にリードフレームを15分放置した。
(1)ワイヤボンディング部分の基板フレーム2(インナーリード7)上に、第1〜第4めっき層11〜14からなる4層構造のめっき15Aを形成するようにした。Agからなる第3めっき層13及びAuからなる第4めっき層14により、インナーリード7の表層の硬度が低下するため、接合時のボンディングワイヤ22(Cuワイヤ)の滑りを抑制することができる。これにより、ボンディングワイヤとの接続信頼性を向上させることができる。したがって、Cuワイヤを使用してワイヤボンディングする場合であっても、そのCuワイヤの良好なワイヤボンディング性を得ることができる。
なお、上記実施形態は、これを適宜変更した以下の態様にて実施することもできる。
・図11に示されるリードフレーム1A及び半導体装置20Aのように、ダイパッド3と半導体素子21の電極21Bとを、ボンディングワイヤ22(例えば、Cuワイヤ)で電気的に接続するようにしてもよい。具体的には、半導体素子21の電極21Bに接続されるボンディングワイヤ22を、ダイパッド3上に形成された4層構造のめっき15Aに接続するようにしてもよい。
2,2A,31 基板フレーム
3,32 ダイパッド
7 インナーリード(リード)
8 アウターリード(リード)
11 第1めっき層
12 第2めっき層
13 第3めっき層
14 第4めっき層
15A めっき(4層のめっき)
15B めっき(3層のめっき)
20,20A,20B,20C,40 半導体装置
21,25,41 半導体素子
21B,25B,41B 電極
22,42 ボンディングワイヤ
23,43 封止樹脂
33 リード
Claims (6)
- 半導体素子及び該半導体素子の電極に接続されるボンディングワイヤが封止樹脂によって封止される樹脂封止型の半導体装置に用いられるリードフレームであって、
複数のリードを有する基板フレームを有し、
前記封止樹脂によって封止される領域であって、少なくとも前記ボンディングワイヤが接続される部分の前記基板フレーム上には、Ni又はNi合金からなる第1めっき層と、Pd又はPd合金からなる第2めっき層と、Ag又はAg合金からなる第3めっき層と、Au又はAu合金からなる第4めっき層とが順に積層された4層のめっきが施され、
前記封止樹脂から露出される基板フレーム上には、前記第1めっき層と、前記第2めっき層と、前記第4めっき層とが順に積層された3層のめっきが施されていることを特徴とするリードフレーム。 - 前記基板フレームは、前記半導体素子が搭載されるダイパッドを有することを特徴とする請求項1に記載のリードフレーム。
- 前記4層のめっきは、前記封止樹脂によって封止される前記基板フレームの全領域に形成されていることを特徴とする請求項1又は2に記載のリードフレーム。
- 前記第3めっき層の厚みは、0.05μm以上3.5μm以下であることを特徴とする請求項1〜3のいずれか1つに記載のリードフレーム。
- 請求項1〜4のいずれか1項に記載のリードフレームと、
前記半導体素子と、
前記半導体素子の電極と前記4層のめっきとを電気的に接続する前記ボンディングワイヤと、
前記半導体素子、前記ボンディングワイヤ、及び前記リードの一部を一体的に封止する前記封止樹脂と、
を有することを特徴とする半導体装置。 - 前記ボンディングワイヤは、銅ワイヤであることを特徴とする請求項5に記載の半導体装置。
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US13/421,120 US8581379B2 (en) | 2011-03-29 | 2012-03-15 | Lead frame and semiconductor device |
TW101110141A TWI533426B (zh) | 2011-03-29 | 2012-03-23 | 導線架及半導體裝置 |
KR1020120030412A KR101924407B1 (ko) | 2011-03-29 | 2012-03-26 | 리드 프레임 및 반도체 장치 |
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JP2008091818A (ja) * | 2006-10-05 | 2008-04-17 | Matsushita Electric Ind Co Ltd | 光半導体装置用リードフレームおよびこれを用いた光半導体装置、並びにこれらの製造方法 |
US8703545B2 (en) * | 2012-02-29 | 2014-04-22 | Alpha & Omega Semiconductor, Inc. | Aluminum alloy lead-frame and its use in fabrication of power semiconductor package |
JP6057285B2 (ja) * | 2012-10-26 | 2017-01-11 | Shマテリアル株式会社 | 半導体素子搭載用基板 |
JP6095997B2 (ja) * | 2013-02-13 | 2017-03-15 | エスアイアイ・セミコンダクタ株式会社 | 樹脂封止型半導体装置の製造方法 |
KR101802851B1 (ko) * | 2013-03-11 | 2017-11-29 | 해성디에스 주식회사 | 리드 프레임, 이를 포함하는 반도체 패키지, 및 리드 프레임의 제조 방법 |
US9728493B2 (en) * | 2015-08-28 | 2017-08-08 | Infineon Technologies Ag | Mold PackageD semiconductor chip mounted on a leadframe and method of manufacturing the same |
US10388616B2 (en) | 2016-05-02 | 2019-08-20 | Rohm Co., Ltd. | Semiconductor device and method for manufacturing the same |
JP6752639B2 (ja) | 2016-05-02 | 2020-09-09 | ローム株式会社 | 半導体装置の製造方法 |
JP2018024832A (ja) * | 2016-07-29 | 2018-02-15 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物および半導体装置 |
JP6750416B2 (ja) * | 2016-09-14 | 2020-09-02 | 富士電機株式会社 | 半導体モジュールおよび半導体モジュールの製造方法 |
JP2018056451A (ja) * | 2016-09-30 | 2018-04-05 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP6772087B2 (ja) * | 2017-02-17 | 2020-10-21 | 新光電気工業株式会社 | リードフレーム及びその製造方法 |
JP7037368B2 (ja) * | 2018-01-09 | 2022-03-16 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
CN110265376A (zh) | 2018-03-12 | 2019-09-20 | 意法半导体股份有限公司 | 引线框架表面精整 |
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JP4715772B2 (ja) * | 2007-02-28 | 2011-07-06 | 株式会社デンソー | 半導体装置 |
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US20120248591A1 (en) | 2012-10-04 |
CN102738109A (zh) | 2012-10-17 |
US8581379B2 (en) | 2013-11-12 |
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TW201246492A (en) | 2012-11-16 |
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