JP5694157B2 - 樹脂組成物、硬化物及びそれを用いた回路基板 - Google Patents
樹脂組成物、硬化物及びそれを用いた回路基板 Download PDFInfo
- Publication number
- JP5694157B2 JP5694157B2 JP2011518563A JP2011518563A JP5694157B2 JP 5694157 B2 JP5694157 B2 JP 5694157B2 JP 2011518563 A JP2011518563 A JP 2011518563A JP 2011518563 A JP2011518563 A JP 2011518563A JP 5694157 B2 JP5694157 B2 JP 5694157B2
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- polyimide precursor
- composition according
- general formula
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 0 C*C1(C)C=CC([N+]([O-])O*(C)*)=CC=C1 Chemical compound C*C1(C)C=CC([N+]([O-])O*(C)*)=CC=C1 0.000 description 5
- RDOXTESZEPMUJZ-UHFFFAOYSA-N COc1ccccc1 Chemical compound COc1ccccc1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 3
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011518563A JP5694157B2 (ja) | 2009-06-09 | 2010-06-09 | 樹脂組成物、硬化物及びそれを用いた回路基板 |
Applications Claiming Priority (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009138076 | 2009-06-09 | ||
JP2009138076 | 2009-06-09 | ||
JP2009142935 | 2009-06-16 | ||
JP2009142935 | 2009-06-16 | ||
JP2009223843 | 2009-09-29 | ||
JP2009223843 | 2009-09-29 | ||
JP2009296969 | 2009-12-28 | ||
JP2009296969 | 2009-12-28 | ||
PCT/JP2010/059792 WO2010143667A1 (ja) | 2009-06-09 | 2010-06-09 | 樹脂組成物、硬化物及びそれを用いた回路基板 |
JP2011518563A JP5694157B2 (ja) | 2009-06-09 | 2010-06-09 | 樹脂組成物、硬化物及びそれを用いた回路基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2010143667A1 JPWO2010143667A1 (ja) | 2012-11-29 |
JP5694157B2 true JP5694157B2 (ja) | 2015-04-01 |
Family
ID=43308922
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011518563A Expired - Fee Related JP5694157B2 (ja) | 2009-06-09 | 2010-06-09 | 樹脂組成物、硬化物及びそれを用いた回路基板 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5694157B2 (zh) |
KR (1) | KR101344573B1 (zh) |
CN (1) | CN102449070B (zh) |
TW (1) | TWI445765B (zh) |
WO (1) | WO2010143667A1 (zh) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5468403B2 (ja) * | 2010-02-02 | 2014-04-09 | 旭化成イーマテリアルズ株式会社 | 樹脂組成物 |
KR101516103B1 (ko) * | 2011-01-18 | 2015-04-29 | 아사히 가세이 이-매터리얼즈 가부시키가이샤 | 수지 조성물, 경화물, 수지 필름 및 배선판 |
CN102093556B (zh) * | 2011-01-19 | 2014-09-24 | 华东理工大学 | 一种低粘度苯并噁嗪的制备 |
JP2012169346A (ja) * | 2011-02-10 | 2012-09-06 | Asahi Kasei E-Materials Corp | フレキシブル配線板の製造方法及びフレキシブル配線板 |
JP2012184281A (ja) * | 2011-03-03 | 2012-09-27 | Hitachi Chemical Dupont Microsystems Ltd | 樹脂組成物 |
JP5878621B2 (ja) * | 2011-03-18 | 2016-03-08 | エルジー・ケム・リミテッド | 新規なポリアミック酸、感光性樹脂組成物、ドライフィルムおよび回路基板 |
JP5777944B2 (ja) * | 2011-06-13 | 2015-09-09 | 新日鉄住金化学株式会社 | 架橋ポリイミド樹脂、接着剤樹脂組成物及びその硬化物、カバーレイフィルム並びに回路基板 |
JP5735989B2 (ja) * | 2011-07-08 | 2015-06-17 | 三井化学株式会社 | ポリイミド樹脂組成物およびそれを含む積層体 |
JP5899497B2 (ja) * | 2011-08-31 | 2016-04-06 | パナソニックIpマネジメント株式会社 | 熱硬化性組成物、ワニス、プリプレグ、プリプレグの製造方法、金属張積層板、金属張積層板の製造方法、プリント配線板、及びプリント配線板の製造方法 |
JP5798010B2 (ja) * | 2011-11-17 | 2015-10-21 | 旭化成イーマテリアルズ株式会社 | 樹脂組成物 |
US9454078B2 (en) * | 2012-09-25 | 2016-09-27 | Toray Industries, Inc. | Positive-type photosensitive resin composition, method for producing semiconductor device including cured film using the same |
JP6065495B2 (ja) * | 2012-09-25 | 2017-01-25 | 東レ株式会社 | 電子部品およびパワー半導体装置 |
KR102041642B1 (ko) * | 2013-12-27 | 2019-11-06 | 코오롱인더스트리 주식회사 | 폴리아믹산 및 이를 이용한 폴리이민-이미드 필름 |
JP6403396B2 (ja) * | 2014-02-26 | 2018-10-10 | 新日鉄住金化学株式会社 | ポリアミド酸組成物、ポリイミド、樹脂フィルム及び金属張積層体 |
JP2016027085A (ja) * | 2014-06-26 | 2016-02-18 | デクセリアルズ株式会社 | ポリイミド、ポリアミド酸、及びそれらの製造方法、並びに感光性樹脂組成物 |
KR102580455B1 (ko) * | 2015-12-31 | 2023-09-20 | 주식회사 동진쎄미켐 | 폴리이미드고분자 조성물, 이의 제조 방법 및 이를 이용한 폴리이미드 필름의 제조 방법 |
KR102531268B1 (ko) * | 2015-12-31 | 2023-05-12 | 주식회사 동진쎄미켐 | 폴리이미드 필름 제조용 조성물, 이의 제조 방법 및 이를 이용한 폴리이미드 필름의 제조 방법 |
CN109705387B (zh) * | 2018-12-27 | 2021-07-06 | 广东生益科技股份有限公司 | 一种无卤树脂组合物、包含其的挠性印制电路板用覆盖膜以及挠性印制电路板 |
WO2020196148A1 (ja) * | 2019-03-22 | 2020-10-01 | 株式会社クレハ | 電極合剤用組成物、電極合剤、電極、非水電解質二次電池、および電極の製造方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05262875A (ja) * | 1992-03-18 | 1993-10-12 | Tosoh Corp | ブロック共重合体及びその製造方法 |
JPH10330479A (ja) * | 1997-05-27 | 1998-12-15 | Hitachi Chem Co Ltd | 親水性ポリアミド酸樹脂及びその製造法 |
JP2005120176A (ja) * | 2003-10-15 | 2005-05-12 | New Japan Chem Co Ltd | 溶剤可溶性ポリイミド共重合体 |
JP2006022302A (ja) * | 2004-06-11 | 2006-01-26 | New Japan Chem Co Ltd | 溶剤可溶性ポリイミド共重合体及びポリイミドワニス |
WO2006118105A1 (ja) * | 2005-04-28 | 2006-11-09 | Ni Material Co., Ltd. | 熱硬化性樹脂組成物 |
JP2007119507A (ja) * | 2005-10-24 | 2007-05-17 | Sekisui Chem Co Ltd | 熱硬化性ポリイミド樹脂組成物、これを用いた成形体及び電子部品 |
JP2008231420A (ja) * | 2007-02-22 | 2008-10-02 | New Japan Chem Co Ltd | 溶剤可溶性ポリイミド共重合体及びそれを含有するポリイミドワニス |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3765970B2 (ja) * | 2000-07-12 | 2006-04-12 | ソニーケミカル株式会社 | エッチング液及びフレキシブル配線板の製造方法 |
JP2008149549A (ja) * | 2006-12-18 | 2008-07-03 | Mitsui Chemicals Inc | 金属積層体の製造方法 |
KR101110938B1 (ko) * | 2007-10-26 | 2012-03-14 | 아사히 가세이 가부시키가이샤 | 폴리이미드 전구체 및 폴리이미드 전구체를 포함하는 감광성 수지 조성물 |
-
2010
- 2010-06-08 TW TW099118762A patent/TWI445765B/zh not_active IP Right Cessation
- 2010-06-09 JP JP2011518563A patent/JP5694157B2/ja not_active Expired - Fee Related
- 2010-06-09 WO PCT/JP2010/059792 patent/WO2010143667A1/ja active Application Filing
- 2010-06-09 CN CN201080024194.9A patent/CN102449070B/zh not_active Expired - Fee Related
- 2010-06-09 KR KR1020117028649A patent/KR101344573B1/ko active IP Right Grant
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05262875A (ja) * | 1992-03-18 | 1993-10-12 | Tosoh Corp | ブロック共重合体及びその製造方法 |
JPH10330479A (ja) * | 1997-05-27 | 1998-12-15 | Hitachi Chem Co Ltd | 親水性ポリアミド酸樹脂及びその製造法 |
JP2005120176A (ja) * | 2003-10-15 | 2005-05-12 | New Japan Chem Co Ltd | 溶剤可溶性ポリイミド共重合体 |
JP2006022302A (ja) * | 2004-06-11 | 2006-01-26 | New Japan Chem Co Ltd | 溶剤可溶性ポリイミド共重合体及びポリイミドワニス |
WO2006118105A1 (ja) * | 2005-04-28 | 2006-11-09 | Ni Material Co., Ltd. | 熱硬化性樹脂組成物 |
JP2007119507A (ja) * | 2005-10-24 | 2007-05-17 | Sekisui Chem Co Ltd | 熱硬化性ポリイミド樹脂組成物、これを用いた成形体及び電子部品 |
JP2008231420A (ja) * | 2007-02-22 | 2008-10-02 | New Japan Chem Co Ltd | 溶剤可溶性ポリイミド共重合体及びそれを含有するポリイミドワニス |
Also Published As
Publication number | Publication date |
---|---|
KR20120018782A (ko) | 2012-03-05 |
WO2010143667A1 (ja) | 2010-12-16 |
TWI445765B (zh) | 2014-07-21 |
JPWO2010143667A1 (ja) | 2012-11-29 |
CN102449070A (zh) | 2012-05-09 |
TW201107418A (en) | 2011-03-01 |
KR101344573B1 (ko) | 2013-12-26 |
CN102449070B (zh) | 2014-01-22 |
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