JP5694157B2 - 樹脂組成物、硬化物及びそれを用いた回路基板 - Google Patents

樹脂組成物、硬化物及びそれを用いた回路基板 Download PDF

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Publication number
JP5694157B2
JP5694157B2 JP2011518563A JP2011518563A JP5694157B2 JP 5694157 B2 JP5694157 B2 JP 5694157B2 JP 2011518563 A JP2011518563 A JP 2011518563A JP 2011518563 A JP2011518563 A JP 2011518563A JP 5694157 B2 JP5694157 B2 JP 5694157B2
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Prior art keywords
resin composition
polyimide precursor
composition according
general formula
compound
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Expired - Fee Related
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JP2011518563A
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English (en)
Japanese (ja)
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JPWO2010143667A1 (ja
Inventor
恩海 孫
恩海 孫
足立　弘明
弘明 足立
洋朗 佐々木
洋朗 佐々木
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Asahi Kasei E Materials Corp
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Asahi Kasei E Materials Corp
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2011518563A 2009-06-09 2010-06-09 樹脂組成物、硬化物及びそれを用いた回路基板 Expired - Fee Related JP5694157B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011518563A JP5694157B2 (ja) 2009-06-09 2010-06-09 樹脂組成物、硬化物及びそれを用いた回路基板

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP2009138076 2009-06-09
JP2009138076 2009-06-09
JP2009142935 2009-06-16
JP2009142935 2009-06-16
JP2009223843 2009-09-29
JP2009223843 2009-09-29
JP2009296969 2009-12-28
JP2009296969 2009-12-28
JP2011518563A JP5694157B2 (ja) 2009-06-09 2010-06-09 樹脂組成物、硬化物及びそれを用いた回路基板
PCT/JP2010/059792 WO2010143667A1 (ja) 2009-06-09 2010-06-09 樹脂組成物、硬化物及びそれを用いた回路基板

Publications (2)

Publication Number Publication Date
JPWO2010143667A1 JPWO2010143667A1 (ja) 2012-11-29
JP5694157B2 true JP5694157B2 (ja) 2015-04-01

Family

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Family Applications (1)

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JP2011518563A Expired - Fee Related JP5694157B2 (ja) 2009-06-09 2010-06-09 樹脂組成物、硬化物及びそれを用いた回路基板

Country Status (5)

Country Link
JP (1) JP5694157B2 (ko)
KR (1) KR101344573B1 (ko)
CN (1) CN102449070B (ko)
TW (1) TWI445765B (ko)
WO (1) WO2010143667A1 (ko)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5468403B2 (ja) * 2010-02-02 2014-04-09 旭化成イーマテリアルズ株式会社 樹脂組成物
WO2012098734A1 (ja) * 2011-01-18 2012-07-26 旭化成イーマテリアルズ株式会社 樹脂組成物、硬化物、樹脂フィルム及び配線板
CN102093556B (zh) * 2011-01-19 2014-09-24 华东理工大学 一种低粘度苯并噁嗪的制备
JP2012169346A (ja) * 2011-02-10 2012-09-06 Asahi Kasei E-Materials Corp フレキシブル配線板の製造方法及びフレキシブル配線板
JP2012184281A (ja) * 2011-03-03 2012-09-27 Hitachi Chemical Dupont Microsystems Ltd 樹脂組成物
KR101238408B1 (ko) 2011-03-18 2013-02-28 주식회사 엘지화학 신규한 폴리아믹산, 감광성 수지 조성물, 드라이 필름 및 회로 기판
JP5777944B2 (ja) * 2011-06-13 2015-09-09 新日鉄住金化学株式会社 架橋ポリイミド樹脂、接着剤樹脂組成物及びその硬化物、カバーレイフィルム並びに回路基板
WO2013008437A1 (ja) * 2011-07-08 2013-01-17 三井化学株式会社 ポリイミド樹脂組成物およびそれを含む積層体
JP5899497B2 (ja) * 2011-08-31 2016-04-06 パナソニックＩｐマネジメント株式会社 熱硬化性組成物、ワニス、プリプレグ、プリプレグの製造方法、金属張積層板、金属張積層板の製造方法、プリント配線板、及びプリント配線板の製造方法
JP5798010B2 (ja) * 2011-11-17 2015-10-21 旭化成イーマテリアルズ株式会社 樹脂組成物
JP6065495B2 (ja) * 2012-09-25 2017-01-25 東レ株式会社 電子部品およびパワー半導体装置
SG11201501594UA (en) * 2012-09-25 2015-05-28 Toray Industries Positive photosensitive resin composition, and method for producing semiconductor device containing a cured film using said composition
JP6403396B2 (ja) * 2014-02-26 2018-10-10 新日鉄住金化学株式会社 ポリアミド酸組成物、ポリイミド、樹脂フィルム及び金属張積層体
KR102041642B1 (ko) * 2013-12-27 2019-11-06 코오롱인더스트리 주식회사 폴리아믹산 및 이를 이용한 폴리이민-이미드 필름
JP2016027085A (ja) * 2014-06-26 2016-02-18 デクセリアルズ株式会社 ポリイミド、ポリアミド酸、及びそれらの製造方法、並びに感光性樹脂組成物
KR102580455B1 (ko) * 2015-12-31 2023-09-20 주식회사 동진쎄미켐 폴리이미드고분자 조성물, 이의 제조 방법 및 이를 이용한 폴리이미드 필름의 제조 방법
KR102531268B1 (ko) * 2015-12-31 2023-05-12 주식회사 동진쎄미켐 폴리이미드 필름 제조용 조성물, 이의 제조 방법 및 이를 이용한 폴리이미드 필름의 제조 방법
CN109705387B (zh) * 2018-12-27 2021-07-06 广东生益科技股份有限公司 一种无卤树脂组合物、包含其的挠性印制电路板用覆盖膜以及挠性印制电路板
JPWO2020196148A1 (ja) * 2019-03-22 2021-10-28 株式会社クレハ 電極合剤用組成物、電極合剤、電極、非水電解質二次電池、および電極の製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05262875A (ja) * 1992-03-18 1993-10-12 Tosoh Corp ブロック共重合体及びその製造方法
JPH10330479A (ja) * 1997-05-27 1998-12-15 Hitachi Chem Co Ltd 親水性ポリアミド酸樹脂及びその製造法
JP2005120176A (ja) * 2003-10-15 2005-05-12 New Japan Chem Co Ltd 溶剤可溶性ポリイミド共重合体
JP2006022302A (ja) * 2004-06-11 2006-01-26 New Japan Chem Co Ltd 溶剤可溶性ポリイミド共重合体及びポリイミドワニス
WO2006118105A1 (ja) * 2005-04-28 2006-11-09 Ni Material Co., Ltd. 熱硬化性樹脂組成物
JP2007119507A (ja) * 2005-10-24 2007-05-17 Sekisui Chem Co Ltd 熱硬化性ポリイミド樹脂組成物、これを用いた成形体及び電子部品
JP2008231420A (ja) * 2007-02-22 2008-10-02 New Japan Chem Co Ltd 溶剤可溶性ポリイミド共重合体及びそれを含有するポリイミドワニス

Family Cites Families (3)

* Cited by examiner, † Cited by third party
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JP3765970B2 (ja) * 2000-07-12 2006-04-12 ソニーケミカル株式会社 エッチング液及びフレキシブル配線板の製造方法
JP2008149549A (ja) * 2006-12-18 2008-07-03 Mitsui Chemicals Inc 金属積層体の製造方法
KR101110938B1 (ko) * 2007-10-26 2012-03-14 아사히 가세이 가부시키가이샤 폴리이미드 전구체 및 폴리이미드 전구체를 포함하는 감광성 수지 조성물

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05262875A (ja) * 1992-03-18 1993-10-12 Tosoh Corp ブロック共重合体及びその製造方法
JPH10330479A (ja) * 1997-05-27 1998-12-15 Hitachi Chem Co Ltd 親水性ポリアミド酸樹脂及びその製造法
JP2005120176A (ja) * 2003-10-15 2005-05-12 New Japan Chem Co Ltd 溶剤可溶性ポリイミド共重合体
JP2006022302A (ja) * 2004-06-11 2006-01-26 New Japan Chem Co Ltd 溶剤可溶性ポリイミド共重合体及びポリイミドワニス
WO2006118105A1 (ja) * 2005-04-28 2006-11-09 Ni Material Co., Ltd. 熱硬化性樹脂組成物
JP2007119507A (ja) * 2005-10-24 2007-05-17 Sekisui Chem Co Ltd 熱硬化性ポリイミド樹脂組成物、これを用いた成形体及び電子部品
JP2008231420A (ja) * 2007-02-22 2008-10-02 New Japan Chem Co Ltd 溶剤可溶性ポリイミド共重合体及びそれを含有するポリイミドワニス

Also Published As

Publication number Publication date
TW201107418A (en) 2011-03-01
JPWO2010143667A1 (ja) 2012-11-29
KR101344573B1 (ko) 2013-12-26
TWI445765B (zh) 2014-07-21
CN102449070B (zh) 2014-01-22
WO2010143667A1 (ja) 2010-12-16
KR20120018782A (ko) 2012-03-05
CN102449070A (zh) 2012-05-09

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