JP5600732B2 - 保護層でコーティングされている熱電材料 - Google Patents

保護層でコーティングされている熱電材料 Download PDF

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Publication number
JP5600732B2
JP5600732B2 JP2012502636A JP2012502636A JP5600732B2 JP 5600732 B2 JP5600732 B2 JP 5600732B2 JP 2012502636 A JP2012502636 A JP 2012502636A JP 2012502636 A JP2012502636 A JP 2012502636A JP 5600732 B2 JP5600732 B2 JP 5600732B2
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Japan
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thermoelectric
thermoelectric material
metal
layer
glass
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Expired - Fee Related
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JP2012502636A
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Japanese (ja)
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JP2012523110A5 (enExample
JP2012523110A (ja
Inventor
アンドレーア シュテファン，マダリナ
シールレ−アルント，ケルスティン
フーバー，ギュンター
スチュアート ブラックバーン，ジョン
ワイン ジョーンズ，アイバー
スタックプール，フランシス
ヘブンズ，スティーブン
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BASF SE
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BASF SE
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Publication of JP5600732B2 publication Critical patent/JP5600732B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Resistance Heating (AREA)
  • Glass Compositions (AREA)
  • Surface Treatment Of Glass (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2012502636A 2009-04-02 2010-03-30 保護層でコーティングされている熱電材料 Expired - Fee Related JP5600732B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
EP09157158.8 2009-04-02
EP09157158 2009-04-02
EP09161747 2009-06-03
EP09161747.2 2009-06-03
PCT/EP2010/054199 WO2010115776A1 (en) 2009-04-02 2010-03-30 Thermoelectric material coated with a protective layer

Publications (3)

Publication Number Publication Date
JP2012523110A JP2012523110A (ja) 2012-09-27
JP2012523110A5 JP2012523110A5 (enExample) 2013-05-09
JP5600732B2 true JP5600732B2 (ja) 2014-10-01

Family

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Family Applications (1)

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JP2012502636A Expired - Fee Related JP5600732B2 (ja) 2009-04-02 2010-03-30 保護層でコーティングされている熱電材料

Country Status (10)

Country Link
US (1) US20120024332A1 (enExample)
EP (1) EP2415089B1 (enExample)
JP (1) JP5600732B2 (enExample)
KR (1) KR20120027187A (enExample)
CN (1) CN102449790B (enExample)
CA (1) CA2757528A1 (enExample)
RU (1) RU2011144116A (enExample)
SG (1) SG174961A1 (enExample)
TW (1) TW201042789A (enExample)
WO (1) WO2010115776A1 (enExample)

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JP5638329B2 (ja) * 2010-09-27 2014-12-10 京セラ株式会社 熱電素子及びこれを備えた熱電モジュール
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KR101948888B1 (ko) * 2011-12-02 2019-04-25 한국전자통신연구원 열전 소자
KR101956278B1 (ko) * 2011-12-30 2019-03-11 삼성전자주식회사 그래핀 함유 복합 적층체, 이를 포함하는 열전재료, 열전모듈과 열전 장치
KR102065111B1 (ko) * 2012-09-05 2020-01-10 삼성전자주식회사 방열-열전 핀, 이를 포함하는 열전모듈 및 열전장치
RU2515128C1 (ru) * 2012-09-11 2014-05-10 Общество с ограниченной ответственностью "ВИННЕР" Способ изготовления полупроводниковых ветвей для термоэлектрического модуля и термоэлектрический модуль
JP6150493B2 (ja) * 2012-10-30 2017-06-21 重行 鶴見 熱電変換素子
KR102046099B1 (ko) * 2012-12-31 2019-11-19 삼성전자주식회사 열전재료 및 이를 포함하는 열전소자
DE102013004173B3 (de) * 2013-03-11 2014-03-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Thermogenerator zur Erzeugung elektrischer Energie aus thermischer Energie sowie Verfahren zu dessen Herstellung
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CN105474417B (zh) * 2013-09-04 2018-11-23 富士胶片株式会社 热电转换装置
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CN104717854B (zh) * 2013-12-13 2018-05-11 宏达国际电子股份有限公司 电子装置及移动装置的保护壳
KR101636908B1 (ko) * 2014-05-30 2016-07-06 삼성전자주식회사 신축성 열전 복합체 및 이를 포함하는 열전소자
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CN105202612A (zh) * 2015-10-24 2015-12-30 唐玉敏 一种半导体取暖装置
CN105202744A (zh) * 2015-10-24 2015-12-30 唐玉敏 一种半导体热水器
CN105207576A (zh) * 2015-10-28 2015-12-30 蒋安为 一种红外线发电器
CN105226999A (zh) * 2015-10-28 2016-01-06 蒋安为 一种利用红外光发电的设备
CN105406814A (zh) * 2015-10-28 2016-03-16 蒋安为 一种基于红外光与长波紫外光线的发电装置
KR101814998B1 (ko) * 2016-06-01 2018-01-04 주식회사 애니원 점착 테이프 및 표시 장치
CN106088392A (zh) * 2016-08-04 2016-11-09 唐玉敏 一种能量传递构件
JP7021872B2 (ja) * 2016-10-20 2022-02-17 株式会社豊田中央研究所 複合熱電材料及びその製造方法
JP6467740B2 (ja) * 2016-11-22 2019-02-13 パナソニックＩｐマネジメント株式会社 熱電変換素子およびその製造方法
KR102088009B1 (ko) * 2016-12-27 2020-03-11 주식회사 엘지화학 열전 변환 복합재 및 이의 제조 방법
CN109427692B (zh) * 2017-08-23 2020-11-20 Tcl科技集团股份有限公司 封装薄膜及其应用
US11167375B2 (en) 2018-08-10 2021-11-09 The Research Foundation For The State University Of New York Additive manufacturing processes and additively manufactured products
CN109781776A (zh) * 2018-11-27 2019-05-21 武汉嘉仪通科技有限公司 一种可同时测量材料多个热电参数的装置及方法
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KR102221820B1 (ko) * 2020-12-15 2021-02-26 배상진 연도 조립체
CN114335312B (zh) * 2021-11-29 2025-07-18 中国科学院上海硅酸盐研究所 一种用于抑制半赫斯勒热电材料表面氧化和挥发的涂层及其制备方法和应用
CN118124205B (zh) * 2023-11-17 2025-12-02 新奥科技发展有限公司 复合改性气凝胶材料、其制备方法、热电器件和热电模块

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KR101691594B1 (ko) * 2016-03-30 2016-12-30 짱신 금속-그래핀 카본 열전도막 및 이의 제조방법

Also Published As

Publication number Publication date
KR20120027187A (ko) 2012-03-21
EP2415089B1 (en) 2013-07-10
RU2011144116A (ru) 2013-05-10
SG174961A1 (en) 2011-11-28
EP2415089A1 (en) 2012-02-08
WO2010115776A1 (en) 2010-10-14
CN102449790B (zh) 2015-01-07
TW201042789A (en) 2010-12-01
CN102449790A (zh) 2012-05-09
US20120024332A1 (en) 2012-02-02
CA2757528A1 (en) 2010-10-14
JP2012523110A (ja) 2012-09-27

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