CN102449790B - 涂覆有保护层的热电材料 - Google Patents

涂覆有保护层的热电材料 Download PDF

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Publication number
CN102449790B
CN102449790B CN201080023761.9A CN201080023761A CN102449790B CN 102449790 B CN102449790 B CN 102449790B CN 201080023761 A CN201080023761 A CN 201080023761A CN 102449790 B CN102449790 B CN 102449790B
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China
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thermoelectric
ceramic
thermoelectric material
metal
protective layer
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Expired - Fee Related
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CN201080023761.9A
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English (en)
Chinese (zh)
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CN102449790A (zh
Inventor
M·A·斯忒芬
K·希尔勒-阿恩特
G·胡贝尔
J·S·布莱克本
I·W·琼斯
F·斯塔克浦
S·希文斯
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BASF SE
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BASF SE
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Resistance Heating (AREA)
  • Glass Compositions (AREA)
  • Surface Treatment Of Glass (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN201080023761.9A 2009-04-02 2010-03-30 涂覆有保护层的热电材料 Expired - Fee Related CN102449790B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
EP09157158.8 2009-04-02
EP09157158 2009-04-02
EP09161747 2009-06-03
EP09161747.2 2009-06-03
PCT/EP2010/054199 WO2010115776A1 (en) 2009-04-02 2010-03-30 Thermoelectric material coated with a protective layer

Publications (2)

Publication Number Publication Date
CN102449790A CN102449790A (zh) 2012-05-09
CN102449790B true CN102449790B (zh) 2015-01-07

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Family Applications (1)

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CN201080023761.9A Expired - Fee Related CN102449790B (zh) 2009-04-02 2010-03-30 涂覆有保护层的热电材料

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US (1) US20120024332A1 (enExample)
EP (1) EP2415089B1 (enExample)
JP (1) JP5600732B2 (enExample)
KR (1) KR20120027187A (enExample)
CN (1) CN102449790B (enExample)
CA (1) CA2757528A1 (enExample)
RU (1) RU2011144116A (enExample)
SG (1) SG174961A1 (enExample)
TW (1) TW201042789A (enExample)
WO (1) WO2010115776A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2779528C1 (ru) * 2021-12-07 2022-09-08 Федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский университет "Московский институт электронной техники" Способ изготовления тонкопленочного защитного покрытия на поверхности термоэлектрических материалов

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101969094B (zh) * 2009-07-27 2012-08-29 中国科学院上海硅酸盐研究所 一种用于热电材料的涂层及其含有该涂层的器件
JP5638329B2 (ja) * 2010-09-27 2014-12-10 京セラ株式会社 熱電素子及びこれを備えた熱電モジュール
EP2633562B1 (en) * 2010-10-27 2015-01-14 Basf Se Thermoelectric module and process for production thereof
TWI422503B (zh) * 2011-01-28 2014-01-11 Univ Nat Kaohsiung 1St Univ Sc A thermostat with a chair
WO2013050961A1 (en) * 2011-10-04 2013-04-11 Basf Se Integrated assembly of micro heat exchanger and thermoelectric module
KR101948888B1 (ko) * 2011-12-02 2019-04-25 한국전자통신연구원 열전 소자
KR101956278B1 (ko) * 2011-12-30 2019-03-11 삼성전자주식회사 그래핀 함유 복합 적층체, 이를 포함하는 열전재료, 열전모듈과 열전 장치
KR102065111B1 (ko) * 2012-09-05 2020-01-10 삼성전자주식회사 방열-열전 핀, 이를 포함하는 열전모듈 및 열전장치
RU2515128C1 (ru) * 2012-09-11 2014-05-10 Общество с ограниченной ответственностью "ВИННЕР" Способ изготовления полупроводниковых ветвей для термоэлектрического модуля и термоэлектрический модуль
JP6150493B2 (ja) * 2012-10-30 2017-06-21 重行 鶴見 熱電変換素子
KR102046099B1 (ko) * 2012-12-31 2019-11-19 삼성전자주식회사 열전재료 및 이를 포함하는 열전소자
DE102013004173B3 (de) * 2013-03-11 2014-03-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Thermogenerator zur Erzeugung elektrischer Energie aus thermischer Energie sowie Verfahren zu dessen Herstellung
KR101446906B1 (ko) 2013-03-28 2014-10-07 전자부품연구원 그래핀 기반의 배리어 필름 복합체 및 제조방법
CN105474417B (zh) * 2013-09-04 2018-11-23 富士胶片株式会社 热电转换装置
US9040339B2 (en) 2013-10-01 2015-05-26 The Pen Practical method of producing an aerogel composite continuous thin film thermoelectric semiconductor material
US9276190B2 (en) 2013-10-01 2016-03-01 The Pen Practical method of producing an aerogel composite continuous thin film thermoelectric semiconductor material by modified MOCVD
US9425374B2 (en) 2013-12-11 2016-08-23 Htc Corporation Electronic apparatus and protective cover of mobile device
TWI513396B (zh) * 2013-12-13 2015-12-11 Htc Corp 電子裝置及行動裝置之保護殼
CN104717854B (zh) * 2013-12-13 2018-05-11 宏达国际电子股份有限公司 电子装置及移动装置的保护壳
KR101636908B1 (ko) * 2014-05-30 2016-07-06 삼성전자주식회사 신축성 열전 복합체 및 이를 포함하는 열전소자
EP3226315B1 (en) 2014-12-16 2020-02-26 LG Chem, Ltd. Thermoelectric powder and thermoelectric material prepared using the same
WO2017066261A2 (en) * 2015-10-13 2017-04-20 Alphabet Energy, Inc. Oxidation and sublimation prevention for thermoelectric devices
CN105202612A (zh) * 2015-10-24 2015-12-30 唐玉敏 一种半导体取暖装置
CN105202744A (zh) * 2015-10-24 2015-12-30 唐玉敏 一种半导体热水器
CN105207576A (zh) * 2015-10-28 2015-12-30 蒋安为 一种红外线发电器
CN105226999A (zh) * 2015-10-28 2016-01-06 蒋安为 一种利用红外光发电的设备
CN105406814A (zh) * 2015-10-28 2016-03-16 蒋安为 一种基于红外光与长波紫外光线的发电装置
KR101691594B1 (ko) * 2016-03-30 2016-12-30 짱신 금속-그래핀 카본 열전도막 및 이의 제조방법
KR101814998B1 (ko) * 2016-06-01 2018-01-04 주식회사 애니원 점착 테이프 및 표시 장치
CN106088392A (zh) * 2016-08-04 2016-11-09 唐玉敏 一种能量传递构件
JP7021872B2 (ja) * 2016-10-20 2022-02-17 株式会社豊田中央研究所 複合熱電材料及びその製造方法
JP6467740B2 (ja) * 2016-11-22 2019-02-13 パナソニックＩｐマネジメント株式会社 熱電変換素子およびその製造方法
KR102088009B1 (ko) * 2016-12-27 2020-03-11 주식회사 엘지화학 열전 변환 복합재 및 이의 제조 방법
CN109427692B (zh) * 2017-08-23 2020-11-20 Tcl科技集团股份有限公司 封装薄膜及其应用
US11167375B2 (en) 2018-08-10 2021-11-09 The Research Foundation For The State University Of New York Additive manufacturing processes and additively manufactured products
CN109781776A (zh) * 2018-11-27 2019-05-21 武汉嘉仪通科技有限公司 一种可同时测量材料多个热电参数的装置及方法
US10968529B2 (en) 2019-05-03 2021-04-06 General Electric Company Insulation systems and methods of depositing insulation systems
KR102221820B1 (ko) * 2020-12-15 2021-02-26 배상진 연도 조립체
CN114335312B (zh) * 2021-11-29 2025-07-18 中国科学院上海硅酸盐研究所 一种用于抑制半赫斯勒热电材料表面氧化和挥发的涂层及其制备方法和应用
CN118124205B (zh) * 2023-11-17 2025-12-02 新奥科技发展有限公司 复合改性气凝胶材料、其制备方法、热电器件和热电模块

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3737345A (en) * 1969-10-24 1973-06-05 Rca Corp Protected thermoelectric elements and method of protecting same
CN1160178A (zh) * 1995-12-29 1997-09-24 Lg电子株式会社 具有加热室的电冰箱
CN1799286A (zh) * 2003-01-27 2006-07-05 罗伯特·C·多尔顿 用于人工介电系统和设备的具有涂层的电磁感受器
US7309830B2 (en) * 2005-05-03 2007-12-18 Toyota Motor Engineering & Manufacturing North America, Inc. Nanostructured bulk thermoelectric material

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833387A (en) * 1966-06-30 1974-09-03 North American Rockwell Ceramic coating of high thermal expansion coefficient for thermoelectric materials
US5439528A (en) 1992-12-11 1995-08-08 Miller; Joel Laminated thermo element
JP3400479B2 (ja) * 1993-02-10 2003-04-28 松下電工株式会社 電子加熱冷却装置
JPH06275871A (ja) * 1993-03-19 1994-09-30 Mitsubishi Heavy Ind Ltd 熱電発電モジュール
US5448109B1 (en) 1994-03-08 1997-10-07 Tellurex Corp Thermoelectric module
JPH07307495A (ja) * 1994-05-12 1995-11-21 Matsushita Electric Ind Co Ltd ペルチェ素子
AU6783598A (en) 1997-03-31 1998-10-22 Research Triangle Institute Thin-film thermoelectric device and fabrication method of same
JP2000022224A (ja) * 1998-07-01 2000-01-21 Seiko Instruments Inc 熱電素子及びその製造方法
DE19955788A1 (de) 1999-11-19 2001-05-23 Basf Ag Thermoelektrisch aktive Materialien und diese enthaltende Generatoren
US6800933B1 (en) * 2001-04-23 2004-10-05 Advanced Micro Devices, Inc. Integrated circuit cooling device
JP2002359406A (ja) * 2001-05-31 2002-12-13 Komatsu Ltd 熱電素子とその製造方法
JP4434575B2 (ja) * 2002-12-13 2010-03-17 キヤノン株式会社 熱電変換素子及びその製造方法
JP4325199B2 (ja) * 2003-01-22 2009-09-02 トヨタ自動車株式会社 熱電モジュール
US7461512B2 (en) 2003-10-29 2008-12-09 California Institute Of Technology System and method for suppressing sublimation using opacified aerogel
US20060157101A1 (en) 2004-10-29 2006-07-20 Sakamoto Jeff S System and method for fabrication of high-efficiency durable thermoelectric devices
US8686277B2 (en) * 2004-12-27 2014-04-01 Intel Corporation Microelectronic assembly including built-in thermoelectric cooler and method of fabricating same
JP4904452B2 (ja) * 2005-12-07 2012-03-28 独立行政法人物質・材料研究機構 半導体系熱電材料における耐環境性被覆膜の自己形成法
WO2007104603A2 (de) 2006-03-16 2007-09-20 Basf Se Blei-germanium-telluride fuer thermoelektrische anwendungen
US8716589B2 (en) 2006-03-16 2014-05-06 Basf Aktiengesellschaft Doped lead tellurides for thermoelectric applications

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3737345A (en) * 1969-10-24 1973-06-05 Rca Corp Protected thermoelectric elements and method of protecting same
CN1160178A (zh) * 1995-12-29 1997-09-24 Lg电子株式会社 具有加热室的电冰箱
CN1799286A (zh) * 2003-01-27 2006-07-05 罗伯特·C·多尔顿 用于人工介电系统和设备的具有涂层的电磁感受器
CN101156255A (zh) * 2004-12-07 2008-04-02 丰田技术中心美国公司 纳米结构的块状热电材料
US7309830B2 (en) * 2005-05-03 2007-12-18 Toyota Motor Engineering & Manufacturing North America, Inc. Nanostructured bulk thermoelectric material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2779528C1 (ru) * 2021-12-07 2022-09-08 Федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский университет "Московский институт электронной техники" Способ изготовления тонкопленочного защитного покрытия на поверхности термоэлектрических материалов

Also Published As

Publication number Publication date
KR20120027187A (ko) 2012-03-21
EP2415089B1 (en) 2013-07-10
RU2011144116A (ru) 2013-05-10
SG174961A1 (en) 2011-11-28
EP2415089A1 (en) 2012-02-08
WO2010115776A1 (en) 2010-10-14
TW201042789A (en) 2010-12-01
CN102449790A (zh) 2012-05-09
JP5600732B2 (ja) 2014-10-01
US20120024332A1 (en) 2012-02-02
CA2757528A1 (en) 2010-10-14
JP2012523110A (ja) 2012-09-27

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