RU2011144116A - Термоэлектрический материал, покрытый защитным слоем - Google Patents
Термоэлектрический материал, покрытый защитным слоем Download PDFInfo
- Publication number
- RU2011144116A RU2011144116A RU2011144116/28A RU2011144116A RU2011144116A RU 2011144116 A RU2011144116 A RU 2011144116A RU 2011144116/28 A RU2011144116/28 A RU 2011144116/28A RU 2011144116 A RU2011144116 A RU 2011144116A RU 2011144116 A RU2011144116 A RU 2011144116A
- Authority
- RU
- Russia
- Prior art keywords
- thermoelectric
- thermoelectric material
- metal
- protective layer
- ceramic
- Prior art date
Links
- 239000000463 material Substances 0.000 title claims abstract 19
- 239000011241 protective layer Substances 0.000 title claims abstract 7
- 229910052751 metal Inorganic materials 0.000 claims abstract 10
- 239000002184 metal Substances 0.000 claims abstract 10
- 239000004065 semiconductor Substances 0.000 claims abstract 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract 6
- 229910010293 ceramic material Inorganic materials 0.000 claims abstract 6
- 239000000919 ceramic Substances 0.000 claims abstract 5
- 239000010410 layer Substances 0.000 claims abstract 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract 4
- 239000010439 graphite Substances 0.000 claims abstract 4
- 229910002804 graphite Inorganic materials 0.000 claims abstract 4
- 229910001092 metal group alloy Inorganic materials 0.000 claims abstract 4
- 239000000203 mixture Substances 0.000 claims abstract 4
- 239000000758 substrate Substances 0.000 claims abstract 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims abstract 3
- 239000011521 glass Substances 0.000 claims abstract 3
- 239000000126 substance Substances 0.000 claims abstract 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims abstract 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims abstract 2
- 229920000997 Graphane Polymers 0.000 claims abstract 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims abstract 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract 2
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims abstract 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910045601 alloy Inorganic materials 0.000 claims abstract 2
- 239000000956 alloy Substances 0.000 claims abstract 2
- 229910052782 aluminium Inorganic materials 0.000 claims abstract 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052787 antimony Inorganic materials 0.000 claims abstract 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims abstract 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052788 barium Inorganic materials 0.000 claims abstract 2
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims abstract 2
- 230000015572 biosynthetic process Effects 0.000 claims abstract 2
- 229910052796 boron Inorganic materials 0.000 claims abstract 2
- 239000011575 calcium Substances 0.000 claims abstract 2
- 229910052791 calcium Inorganic materials 0.000 claims abstract 2
- 230000006378 damage Effects 0.000 claims abstract 2
- 229910052732 germanium Inorganic materials 0.000 claims abstract 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910021389 graphene Inorganic materials 0.000 claims abstract 2
- 229910052735 hafnium Inorganic materials 0.000 claims abstract 2
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052742 iron Inorganic materials 0.000 claims abstract 2
- 229910052746 lanthanum Inorganic materials 0.000 claims abstract 2
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052749 magnesium Inorganic materials 0.000 claims abstract 2
- 239000011777 magnesium Substances 0.000 claims abstract 2
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract 2
- 229910052759 nickel Inorganic materials 0.000 claims abstract 2
- 229910052760 oxygen Inorganic materials 0.000 claims abstract 2
- 239000001301 oxygen Substances 0.000 claims abstract 2
- 229910052763 palladium Inorganic materials 0.000 claims abstract 2
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract 2
- 239000011574 phosphorus Substances 0.000 claims abstract 2
- 229910052711 selenium Inorganic materials 0.000 claims abstract 2
- 239000011669 selenium Substances 0.000 claims abstract 2
- 229910052710 silicon Inorganic materials 0.000 claims abstract 2
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract 2
- 239000000377 silicon dioxide Substances 0.000 claims abstract 2
- 229910052709 silver Inorganic materials 0.000 claims abstract 2
- 229910052712 strontium Inorganic materials 0.000 claims abstract 2
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 claims abstract 2
- 239000002344 surface layer Substances 0.000 claims abstract 2
- 229910052715 tantalum Inorganic materials 0.000 claims abstract 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052714 tellurium Inorganic materials 0.000 claims abstract 2
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052719 titanium Inorganic materials 0.000 claims abstract 2
- 239000010936 titanium Substances 0.000 claims abstract 2
- 239000004408 titanium dioxide Substances 0.000 claims abstract 2
- 229910052721 tungsten Inorganic materials 0.000 claims abstract 2
- 229910052720 vanadium Inorganic materials 0.000 claims abstract 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052727 yttrium Inorganic materials 0.000 claims abstract 2
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052725 zinc Inorganic materials 0.000 claims abstract 2
- 239000011701 zinc Substances 0.000 claims abstract 2
- 238000001816 cooling Methods 0.000 claims 2
- 239000011159 matrix material Substances 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000010445 mica Substances 0.000 claims 1
- 229910052618 mica group Inorganic materials 0.000 claims 1
- 239000011253 protective coating Substances 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Resistance Heating (AREA)
- Glass Compositions (AREA)
- Surface Treatment Of Glass (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP09157158.8 | 2009-04-02 | ||
| EP09157158 | 2009-04-02 | ||
| EP09161747 | 2009-06-03 | ||
| EP09161747.2 | 2009-06-03 | ||
| PCT/EP2010/054199 WO2010115776A1 (en) | 2009-04-02 | 2010-03-30 | Thermoelectric material coated with a protective layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| RU2011144116A true RU2011144116A (ru) | 2013-05-10 |
Family
ID=42352730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2011144116/28A RU2011144116A (ru) | 2009-04-02 | 2010-03-30 | Термоэлектрический материал, покрытый защитным слоем |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US20120024332A1 (enExample) |
| EP (1) | EP2415089B1 (enExample) |
| JP (1) | JP5600732B2 (enExample) |
| KR (1) | KR20120027187A (enExample) |
| CN (1) | CN102449790B (enExample) |
| CA (1) | CA2757528A1 (enExample) |
| RU (1) | RU2011144116A (enExample) |
| SG (1) | SG174961A1 (enExample) |
| TW (1) | TW201042789A (enExample) |
| WO (1) | WO2010115776A1 (enExample) |
Families Citing this family (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101969094B (zh) * | 2009-07-27 | 2012-08-29 | 中国科学院上海硅酸盐研究所 | 一种用于热电材料的涂层及其含有该涂层的器件 |
| JP5638329B2 (ja) * | 2010-09-27 | 2014-12-10 | 京セラ株式会社 | 熱電素子及びこれを備えた熱電モジュール |
| EP2633562B1 (en) * | 2010-10-27 | 2015-01-14 | Basf Se | Thermoelectric module and process for production thereof |
| TWI422503B (zh) * | 2011-01-28 | 2014-01-11 | Univ Nat Kaohsiung 1St Univ Sc | A thermostat with a chair |
| WO2013050961A1 (en) * | 2011-10-04 | 2013-04-11 | Basf Se | Integrated assembly of micro heat exchanger and thermoelectric module |
| KR101948888B1 (ko) * | 2011-12-02 | 2019-04-25 | 한국전자통신연구원 | 열전 소자 |
| KR101956278B1 (ko) * | 2011-12-30 | 2019-03-11 | 삼성전자주식회사 | 그래핀 함유 복합 적층체, 이를 포함하는 열전재료, 열전모듈과 열전 장치 |
| KR102065111B1 (ko) * | 2012-09-05 | 2020-01-10 | 삼성전자주식회사 | 방열-열전 핀, 이를 포함하는 열전모듈 및 열전장치 |
| RU2515128C1 (ru) * | 2012-09-11 | 2014-05-10 | Общество с ограниченной ответственностью "ВИННЕР" | Способ изготовления полупроводниковых ветвей для термоэлектрического модуля и термоэлектрический модуль |
| JP6150493B2 (ja) * | 2012-10-30 | 2017-06-21 | 重行 鶴見 | 熱電変換素子 |
| KR102046099B1 (ko) * | 2012-12-31 | 2019-11-19 | 삼성전자주식회사 | 열전재료 및 이를 포함하는 열전소자 |
| DE102013004173B3 (de) * | 2013-03-11 | 2014-03-06 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Thermogenerator zur Erzeugung elektrischer Energie aus thermischer Energie sowie Verfahren zu dessen Herstellung |
| KR101446906B1 (ko) | 2013-03-28 | 2014-10-07 | 전자부품연구원 | 그래핀 기반의 배리어 필름 복합체 및 제조방법 |
| CN105474417B (zh) * | 2013-09-04 | 2018-11-23 | 富士胶片株式会社 | 热电转换装置 |
| US9040339B2 (en) | 2013-10-01 | 2015-05-26 | The Pen | Practical method of producing an aerogel composite continuous thin film thermoelectric semiconductor material |
| US9276190B2 (en) | 2013-10-01 | 2016-03-01 | The Pen | Practical method of producing an aerogel composite continuous thin film thermoelectric semiconductor material by modified MOCVD |
| US9425374B2 (en) | 2013-12-11 | 2016-08-23 | Htc Corporation | Electronic apparatus and protective cover of mobile device |
| TWI513396B (zh) * | 2013-12-13 | 2015-12-11 | Htc Corp | 電子裝置及行動裝置之保護殼 |
| CN104717854B (zh) * | 2013-12-13 | 2018-05-11 | 宏达国际电子股份有限公司 | 电子装置及移动装置的保护壳 |
| KR101636908B1 (ko) * | 2014-05-30 | 2016-07-06 | 삼성전자주식회사 | 신축성 열전 복합체 및 이를 포함하는 열전소자 |
| EP3226315B1 (en) | 2014-12-16 | 2020-02-26 | LG Chem, Ltd. | Thermoelectric powder and thermoelectric material prepared using the same |
| WO2017066261A2 (en) * | 2015-10-13 | 2017-04-20 | Alphabet Energy, Inc. | Oxidation and sublimation prevention for thermoelectric devices |
| CN105202612A (zh) * | 2015-10-24 | 2015-12-30 | 唐玉敏 | 一种半导体取暖装置 |
| CN105202744A (zh) * | 2015-10-24 | 2015-12-30 | 唐玉敏 | 一种半导体热水器 |
| CN105207576A (zh) * | 2015-10-28 | 2015-12-30 | 蒋安为 | 一种红外线发电器 |
| CN105226999A (zh) * | 2015-10-28 | 2016-01-06 | 蒋安为 | 一种利用红外光发电的设备 |
| CN105406814A (zh) * | 2015-10-28 | 2016-03-16 | 蒋安为 | 一种基于红外光与长波紫外光线的发电装置 |
| KR101691594B1 (ko) * | 2016-03-30 | 2016-12-30 | 짱신 | 금속-그래핀 카본 열전도막 및 이의 제조방법 |
| KR101814998B1 (ko) * | 2016-06-01 | 2018-01-04 | 주식회사 애니원 | 점착 테이프 및 표시 장치 |
| CN106088392A (zh) * | 2016-08-04 | 2016-11-09 | 唐玉敏 | 一种能量传递构件 |
| JP7021872B2 (ja) * | 2016-10-20 | 2022-02-17 | 株式会社豊田中央研究所 | 複合熱電材料及びその製造方法 |
| JP6467740B2 (ja) * | 2016-11-22 | 2019-02-13 | パナソニックＩｐマネジメント株式会社 | 熱電変換素子およびその製造方法 |
| KR102088009B1 (ko) * | 2016-12-27 | 2020-03-11 | 주식회사 엘지화학 | 열전 변환 복합재 및 이의 제조 방법 |
| CN109427692B (zh) * | 2017-08-23 | 2020-11-20 | Tcl科技集团股份有限公司 | 封装薄膜及其应用 |
| US11167375B2 (en) | 2018-08-10 | 2021-11-09 | The Research Foundation For The State University Of New York | Additive manufacturing processes and additively manufactured products |
| CN109781776A (zh) * | 2018-11-27 | 2019-05-21 | 武汉嘉仪通科技有限公司 | 一种可同时测量材料多个热电参数的装置及方法 |
| US10968529B2 (en) | 2019-05-03 | 2021-04-06 | General Electric Company | Insulation systems and methods of depositing insulation systems |
| KR102221820B1 (ko) * | 2020-12-15 | 2021-02-26 | 배상진 | 연도 조립체 |
| CN114335312B (zh) * | 2021-11-29 | 2025-07-18 | 中国科学院上海硅酸盐研究所 | 一种用于抑制半赫斯勒热电材料表面氧化和挥发的涂层及其制备方法和应用 |
| CN118124205B (zh) * | 2023-11-17 | 2025-12-02 | 新奥科技发展有限公司 | 复合改性气凝胶材料、其制备方法、热电器件和热电模块 |
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| US3833387A (en) * | 1966-06-30 | 1974-09-03 | North American Rockwell | Ceramic coating of high thermal expansion coefficient for thermoelectric materials |
| US3737345A (en) * | 1969-10-24 | 1973-06-05 | Rca Corp | Protected thermoelectric elements and method of protecting same |
| US5439528A (en) | 1992-12-11 | 1995-08-08 | Miller; Joel | Laminated thermo element |
| JP3400479B2 (ja) * | 1993-02-10 | 2003-04-28 | 松下電工株式会社 | 電子加熱冷却装置 |
| JPH06275871A (ja) * | 1993-03-19 | 1994-09-30 | Mitsubishi Heavy Ind Ltd | 熱電発電モジュール |
| US5448109B1 (en) | 1994-03-08 | 1997-10-07 | Tellurex Corp | Thermoelectric module |
| JPH07307495A (ja) * | 1994-05-12 | 1995-11-21 | Matsushita Electric Ind Co Ltd | ペルチェ素子 |
| KR970047662A (ko) * | 1995-12-29 | 1997-07-26 | 구자홍 | 온장실이 구비된 냉장고 |
| AU6783598A (en) | 1997-03-31 | 1998-10-22 | Research Triangle Institute | Thin-film thermoelectric device and fabrication method of same |
| US6891138B2 (en) * | 1997-04-04 | 2005-05-10 | Robert C. Dalton | Electromagnetic susceptors with coatings for artificial dielectric systems and devices |
| JP2000022224A (ja) * | 1998-07-01 | 2000-01-21 | Seiko Instruments Inc | 熱電素子及びその製造方法 |
| DE19955788A1 (de) | 1999-11-19 | 2001-05-23 | Basf Ag | Thermoelektrisch aktive Materialien und diese enthaltende Generatoren |
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| JP2002359406A (ja) * | 2001-05-31 | 2002-12-13 | Komatsu Ltd | 熱電素子とその製造方法 |
| JP4434575B2 (ja) * | 2002-12-13 | 2010-03-17 | キヤノン株式会社 | 熱電変換素子及びその製造方法 |
| JP4325199B2 (ja) * | 2003-01-22 | 2009-09-02 | トヨタ自動車株式会社 | 熱電モジュール |
| US7461512B2 (en) | 2003-10-29 | 2008-12-09 | California Institute Of Technology | System and method for suppressing sublimation using opacified aerogel |
| US20060157101A1 (en) | 2004-10-29 | 2006-07-20 | Sakamoto Jeff S | System and method for fabrication of high-efficiency durable thermoelectric devices |
| US7309830B2 (en) * | 2005-05-03 | 2007-12-18 | Toyota Motor Engineering & Manufacturing North America, Inc. | Nanostructured bulk thermoelectric material |
| US8686277B2 (en) * | 2004-12-27 | 2014-04-01 | Intel Corporation | Microelectronic assembly including built-in thermoelectric cooler and method of fabricating same |
| JP4904452B2 (ja) * | 2005-12-07 | 2012-03-28 | 独立行政法人物質・材料研究機構 | 半導体系熱電材料における耐環境性被覆膜の自己形成法 |
| WO2007104603A2 (de) | 2006-03-16 | 2007-09-20 | Basf Se | Blei-germanium-telluride fuer thermoelektrische anwendungen |
| US8716589B2 (en) | 2006-03-16 | 2014-05-06 | Basf Aktiengesellschaft | Doped lead tellurides for thermoelectric applications |
-
2010
- 2010-03-29 TW TW099109442A patent/TW201042789A/zh unknown
- 2010-03-30 US US13/262,644 patent/US20120024332A1/en not_active Abandoned
- 2010-03-30 SG SG2011070638A patent/SG174961A1/en unknown
- 2010-03-30 CA CA2757528A patent/CA2757528A1/en not_active Abandoned
- 2010-03-30 CN CN201080023761.9A patent/CN102449790B/zh not_active Expired - Fee Related
- 2010-03-30 RU RU2011144116/28A patent/RU2011144116A/ru not_active Application Discontinuation
- 2010-03-30 JP JP2012502636A patent/JP5600732B2/ja not_active Expired - Fee Related
- 2010-03-30 EP EP10711682.4A patent/EP2415089B1/en not_active Not-in-force
- 2010-03-30 KR KR1020117025741A patent/KR20120027187A/ko not_active Withdrawn
- 2010-03-30 WO PCT/EP2010/054199 patent/WO2010115776A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| KR20120027187A (ko) | 2012-03-21 |
| EP2415089B1 (en) | 2013-07-10 |
| SG174961A1 (en) | 2011-11-28 |
| EP2415089A1 (en) | 2012-02-08 |
| WO2010115776A1 (en) | 2010-10-14 |
| CN102449790B (zh) | 2015-01-07 |
| TW201042789A (en) | 2010-12-01 |
| CN102449790A (zh) | 2012-05-09 |
| JP5600732B2 (ja) | 2014-10-01 |
| US20120024332A1 (en) | 2012-02-02 |
| CA2757528A1 (en) | 2010-10-14 |
| JP2012523110A (ja) | 2012-09-27 |
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