JP5594198B2 - 電子部品及び電子部品組立装置 - Google Patents
電子部品及び電子部品組立装置 Download PDFInfo
- Publication number
- JP5594198B2 JP5594198B2 JP2011058364A JP2011058364A JP5594198B2 JP 5594198 B2 JP5594198 B2 JP 5594198B2 JP 2011058364 A JP2011058364 A JP 2011058364A JP 2011058364 A JP2011058364 A JP 2011058364A JP 5594198 B2 JP5594198 B2 JP 5594198B2
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- electronic component
- heating
- semiconductor device
- electrode
- heating element
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0212—Printed circuits or mounted components having integral heating means
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- H—ELECTRICITY
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- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- H05K13/0465—Surface mounting by soldering
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- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
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- H05K13/0486—Replacement and removal of components
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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Description
[半導体装置の構造]
まず、第1の実施の形態に係る半導体装置の構造について説明する。図1は、第1の実施の形態に係る半導体装置の一例を示す断面図である。図2Aは、第1の実施の形態に係る半導体装置の一例を示す底面図である。なお、図1は、図2AのA−A線に沿う断面を示している。図2Aにおいて、便宜上、後述する第3絶縁層23は省略されている。
次に、第1の実施の形態に係る半導体装置の搭載及び取り外しについて説明する。図3は、半導体装置の搭載及び取り外しに用いる装置の一例を示す模式図である。図3を参照するに、装置100は、ノズル110A及び110Bと、加熱手段120と、吸引手段130と、監視手段140と、制御手段150と、記憶手段160と、操作手段170とを有する。半導体装置10は基板200上に搭載されている。つまり、外部接続端子24が溶融して、半導体装置10の外部電極21と基板200の対応する電極とを電気的に接続している。なお、ノズル110A及び110Bは、本発明に係る当接部の代表的な一例である。又、ノズル110A及び110B(当接部)、加熱手段120、及び吸引手段130は、本発明に係る電子部品組立装置の代表的な一例である。
第1の実施の形態の変形例1では、第1の実施の形態とは異なる構造の半導体装置に本発明を適用する例を示す。なお、第1の実施の形態の変形例1において、既に説明した実施の形態と同一構成部分についての説明は省略する。
第1の実施の形態の変形例2では、第1の実施の形態及びその変形例1とは異なる構造の半導体装置に本発明を適用する例を示す。なお、第1の実施の形態の変形例2において、既に説明した実施の形態及びその変形例と同一構成部分についての説明は省略する。
第1の実施の形態の変形例3では、第1の実施の形態及びその変形例1、2とは異なる構造の半導体装置に本発明を適用する例を示す。なお、第1の実施の形態の変形例3において、既に説明した実施の形態及びその変形例と同一構成部分についての説明は省略する。
第1の実施の形態及びその変形例では、封止部の表面に加熱用電極を設ける例を示したが、第2の実施の形態では、外部電極側に加熱用電極を設ける例を示す。なお、第2の実施の形態において、既に説明した実施の形態及びその変形例と同一構成部分についての説明は省略する。
既に説明した実施の形態及びその変形例では、熱拡散層の表面に発熱体を設ける例を示したが、第3の実施の形態では、半導体装置に形成した貫通孔内部に熱絶縁層及び発熱体を設ける例を示す。なお、第3の実施の形態において、既に説明した実施の形態及びその変形例と同一構成部分についての説明は省略する。
既に説明した実施の形態及びその変形例では、発熱体に電流を流すことで熱を発生させる例を示したが、第4の実施の形態では、半導体装置の外部から加熱用電極を介して熱を供給し、供給された熱を発熱体が保持する例を示す。なお、第4の実施の形態において、既に説明した実施の形態及びその変形例と同一構成部分についての説明は省略する。
既に説明した実施の形態及びその変形例では、半導体装置に熱絶縁層、熱拡散層、発熱体、及び加熱用電極を設ける例を示した。第5の実施の形態では、半導体装置以外の電子部品の一例として、セラミックコンデンサに熱絶縁層、熱拡散層、発熱体、及び加熱用電極を設ける例を示す。
上記各実施の形態及びその変形例では、主に図4に示すノズル110A及び110Bを用いる例を示した。ここでは、ノズルの他の例を示す。
(付記1)
配線基板と、
前記配線基板の一方の面側に搭載される電子部品本体と、
前記配線基板の他方の面側に形成され、前記電子部品本体と電気的に接続される外部電極と、
前記外部電極と同一層に形成され、導電性を有し、抵抗率が前記外部電極よりも高い発熱体と、
前記電子部品本体と前記発熱体との間に配置され、絶縁性を有し、前記配線基板を構成する材料とは異なる材料からなる熱絶縁層と、を有する電子部品。
(付記2)
前記発熱体と前記熱絶縁層との間に配置され、前記熱絶縁層よりも熱伝導率が小さい熱拡散層を更に有する付記1記載の電子部品。
(付記3)
前記熱絶縁層は、前記熱拡散層に隣接する層に設けられている付記2記載の電子部品。
(付記4)
前記発熱体は、前記熱拡散層に隣接する層に設けられている付記1乃至3の何れか一に記載の電子部品。
(付記5)
前記配線基板には、前記熱絶縁層よりも前記一方の面側に設けられた層を貫通する第1の貫通孔と、前記第1の貫通孔よりも小径であり、かつ、前記第1の貫通孔と連通し少なくとも前記熱絶縁層を貫通する第2の貫通孔と、が設けられ、
前記第1及び第2の貫通孔内には、前記発熱体に接続する貫通配線が設けられ、
前記第1の貫通孔の内壁と前記貫通配線との間に第2の熱絶縁層が設けられている付記1乃至4の何れか一に記載の電子部品。
(付記6)
前記熱絶縁層は、前記配線基板の前記一方の面側の最外層に設けられ、
前記熱絶縁層上に加熱用電極が設けられ、前記加熱用電極は少なくとも前記熱絶縁層を貫通する貫通配線を介して前記発熱体と熱的に接続されている付記1乃至4の何れか一に記載の電子部品。
(付記7)
前記電子部品本体を封止する封止部と、前記発熱体と接続された加熱用電極と、を更に有し、
前記加熱用電極の一部は前記一方の面に形成され、前記一方の面から前記封止部の側面及び上面に延在し、かつ、前記貫通配線を介して前記発熱体と電気的に接続されている付記5記載の電子部品。
(付記8)
前記加熱用電極はボンディングワイヤを介して前記貫通配線の一端と電気的に接続されている付記7記載の電子部品。
(付記9)
前記電子部品本体を封止する封止部と、前記発熱体と接続された加熱用電極と、を更に有し、
前記加熱用電極は、前記電子部品本体のリード端子の一部であり、
前記リード端子の一部は、前記封止部の上面に延在している付記5記載の電子部品。
(付記10)
電子部品本体と、前記電子部品本体と電気的に接続された外部電極と、前記外部電極と同一層に形成され、導電性を有し、導電率が前記外部電極よりも低い発熱体と、前記発熱体と接続された加熱用電極と、を有する電子部品の前記加熱用電極に当接し、貫通孔を有する当接部と、
前記当接部を介して前記発熱体を発熱させる加熱手段と、
前記貫通孔を介して前記加熱用電極を吸引する吸引手段と、を有する電子部品組立装置。
(付記11)
前記加熱用電極は、第1電極と第2電極と、を有し、
前記当接部は、前記第1電極に当接する第1導電部と、前記第2電極に当接する第2導電部と、前記第1導電部と前記第2導電部とを絶縁する絶縁部と、を有し、
前記加熱手段は、前記第1導電部と前記第2導電部との間に電位差を生じさせる付記10記載の電子部品組立装置。
(付記12)
前記当接部は、環状の前記第1導電部と、
前記第1導電部の内周に配置された第2導電部と、
絶縁性を有し、前記第1導電部と前記第2導電部とを連結する絶縁部と、を有する付記11記載の電子部品組立装置。
(付記13)
前記当接部は発熱手段を内蔵する付記10記載の電子部品組立装置。
(付記14)
前記発熱体に接する層に設けられ、前記発熱体の発する熱を均一化する熱拡散層を更に有し、
前記熱絶縁層は、前記熱拡散層と前記電子部品本体との間に設けられている付記10乃至13の何れか一に記載の電子部品組立装置。
(付記15)
前記熱絶縁層は、前記熱拡散層に隣接する層に設けられている付記14記載の電子部品組立装置。
(付記16)
前記電子部品の前記外部電極に前記外部接続端子が接続されている付記10乃至15の何れか一に記載の電子部品組立装置。
11 配線基板
12 第1配線層
13 第1絶縁層
13x 第1貫通配線
14 第2配線層
15 第2絶縁層
15x 第2貫通配線
16 第3配線層
17、77、97 熱絶縁層
17x 第3貫通配線
18、98 熱拡散層
19、78、99 発熱体
20 第4配線層
21、92A、92B 外部電極
22A、22B、56A、56B 内部電極
23 第3絶縁層
23x 開口部
24、301 外部接続端子
25、55 半導体チップ
26 バンプ
27、87 封止部
28A、28B、28C、28D、28E、28F、38A、38B、58A、58B、68A、68B、93A、93B 加熱用電極
29A、29B、39A、39B 貫通配線
36、46 ボンディングワイヤ
57 はんだ
90 電子部品
91 電子部品本体
100、100A 装置
110A、110B、110C、110D、111、112、113 ノズル
110Ax、110Bx、111x、112x、113x 貫通孔
111A、112A、113A 正電極
111B、112B、113B 負電極
111C、112C、113C 絶縁部
115A、115B 発熱手段
120 加熱手段
130 吸引手段
140 監視手段
150 制御手段
160 記憶手段
170 操作手段
200、300 基板
302 パッド
Claims (10)
- 配線基板と、
前記配線基板の一方の面側に搭載される電子部品本体と、
前記配線基板の他方の面側に形成され、前記電子部品本体と電気的に接続される外部電極と、
前記外部電極と同一層に形成され、導電性を有し、抵抗率が前記外部電極よりも高い発熱体と、
前記電子部品本体と前記発熱体との間に配置され、絶縁性を有し、前記配線基板を構成する材料とは異なる材料からなる熱絶縁層と、を有する電子部品。 - 前記発熱体と前記熱絶縁層との間に配置され、前記熱絶縁層よりも熱伝導率が大きい熱拡散層を更に有する請求項1記載の電子部品。
- 前記熱絶縁層は、前記熱拡散層に隣接する層に設けられている請求項2記載の電子部品。
- 前記発熱体は、前記熱拡散層に隣接する層に設けられている請求項2又は3記載の電子部品。
- 前記配線基板には、前記熱絶縁層よりも前記一方の面側に設けられた層を貫通する第1の貫通孔と、前記第1の貫通孔よりも小径であり、かつ、前記第1の貫通孔と連通し少なくとも前記熱絶縁層を貫通する第2の貫通孔と、が設けられ、
前記第1及び第2の貫通孔内には、前記発熱体に接続する貫通配線が設けられ、
前記第1の貫通孔の内壁と前記貫通配線との間に第2の熱絶縁層が設けられている請求項1乃至4の何れか一項記載の電子部品。 - 前記熱絶縁層は、前記配線基板の前記一方の面側の最外層に設けられ、
前記熱絶縁層上に加熱用電極が設けられ、前記加熱用電極は少なくとも前記熱絶縁層を貫通する貫通配線を介して前記発熱体と熱的に接続されている請求項1乃至4の何れか一項記載の電子部品。 - 電子部品本体と、前記電子部品本体と電気的に接続された外部電極と、前記外部電極と同一層に形成され、導電性を有し、導電率が前記外部電極よりも低い発熱体と、前記発熱体と接続された加熱用電極と、を有する電子部品の前記加熱用電極に当接し、貫通孔を有する当接部と、
前記当接部を介して前記発熱体を発熱させる加熱手段と、
前記貫通孔を介して前記加熱用電極を吸引する吸引手段と、を有する電子部品組立装置。 - 前記加熱用電極は、第1電極と第2電極と、を有し、
前記当接部は、前記第1電極に当接する第1導電部と、前記第2電極に当接する第2導電部と、前記第1導電部と前記第2導電部とを絶縁する絶縁部と、を有し、
前記加熱手段は、前記第1導電部と前記第2導電部との間に電位差を生じさせる請求項7記載の電子部品組立装置。 - 前記当接部は、環状の前記第1導電部と、
前記第1導電部の内周に配置された第2導電部と、
絶縁性を有し、前記第1導電部と前記第2導電部とを連結する絶縁部と、を有する請求項8記載の電子部品組立装置。 - 前記当接部は発熱手段を内蔵する請求項7記載の電子部品組立装置。
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