IT1239764B - Sistema di saldatura, particolarmente idoneo per saldature di chip a mezzo di leghe saldanti - Google Patents

Sistema di saldatura, particolarmente idoneo per saldature di chip a mezzo di leghe saldanti

Info

Publication number
IT1239764B
IT1239764B IT47801A IT4780190A IT1239764B IT 1239764 B IT1239764 B IT 1239764B IT 47801 A IT47801 A IT 47801A IT 4780190 A IT4780190 A IT 4780190A IT 1239764 B IT1239764 B IT 1239764B
Authority
IT
Italy
Prior art keywords
welding
particularly suitable
alloys
chip
welding system
Prior art date
Application number
IT47801A
Other languages
English (en)
Other versions
IT9047801A1 (it
IT9047801A0 (it
Inventor
Sergio Moretti
Ugo Fracassi
Original Assignee
Selenia Ind Elettroniche
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Selenia Ind Elettroniche filed Critical Selenia Ind Elettroniche
Priority to IT47801A priority Critical patent/IT1239764B/it
Publication of IT9047801A0 publication Critical patent/IT9047801A0/it
Priority to EP91104610A priority patent/EP0449156B1/en
Priority to DE91104610T priority patent/DE69100548D1/de
Priority to US07/677,628 priority patent/US5222655A/en
Publication of IT9047801A1 publication Critical patent/IT9047801A1/it
Application granted granted Critical
Publication of IT1239764B publication Critical patent/IT1239764B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • B23K3/0478—Heating appliances electric comprising means for controlling or selecting the temperature or power
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75302—Shape
    • H01L2224/75303—Shape of the pressing surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Arc Welding In General (AREA)
  • Nonmetallic Welding Materials (AREA)
IT47801A 1990-03-28 1990-03-28 Sistema di saldatura, particolarmente idoneo per saldature di chip a mezzo di leghe saldanti IT1239764B (it)

Priority Applications (4)

Application Number Priority Date Filing Date Title
IT47801A IT1239764B (it) 1990-03-28 1990-03-28 Sistema di saldatura, particolarmente idoneo per saldature di chip a mezzo di leghe saldanti
EP91104610A EP0449156B1 (en) 1990-03-28 1991-03-24 Soldering apparatus and method employing provision of heated gas to a soldering alloy at a soldering collection
DE91104610T DE69100548D1 (de) 1990-03-28 1991-03-24 Lötvorrichtung und Verfahren unter Verwendung eines erwärmten Gases an einer Lotlegierung für eine zusammenzulötende Teileanordnung.
US07/677,628 US5222655A (en) 1990-03-28 1991-03-28 Soldering method employing provision of heated gas to a soldering alloy at a soldering connection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT47801A IT1239764B (it) 1990-03-28 1990-03-28 Sistema di saldatura, particolarmente idoneo per saldature di chip a mezzo di leghe saldanti

Publications (3)

Publication Number Publication Date
IT9047801A0 IT9047801A0 (it) 1990-03-28
IT9047801A1 IT9047801A1 (it) 1991-09-28
IT1239764B true IT1239764B (it) 1993-11-15

Family

ID=11262595

Family Applications (1)

Application Number Title Priority Date Filing Date
IT47801A IT1239764B (it) 1990-03-28 1990-03-28 Sistema di saldatura, particolarmente idoneo per saldature di chip a mezzo di leghe saldanti

Country Status (4)

Country Link
US (1) US5222655A (it)
EP (1) EP0449156B1 (it)
DE (1) DE69100548D1 (it)
IT (1) IT1239764B (it)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5234157A (en) * 1992-11-02 1993-08-10 At&T Bell Laboratories Soldering method and apparatus
GB2289235A (en) * 1994-05-06 1995-11-15 Ibm Solder tool
US5810241A (en) * 1996-09-16 1998-09-22 International Business Machines Corporation Solder bonding/debonding nozzle insert
SG106126A1 (en) * 2002-03-08 2004-09-30 Esec Trading Sa Method and apparatus for dispensing solder on a substrate
JP5594198B2 (ja) * 2011-03-16 2014-09-24 富士通株式会社 電子部品及び電子部品組立装置
US10046409B2 (en) * 2016-09-08 2018-08-14 Raytheon Company Methods of making an electrical connection, and of making a receptacle for receiving an electrical device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3964664A (en) * 1974-03-13 1976-06-22 P. R. Mallory & Co., Inc. Beam leaded device welding machine
DE2931857A1 (de) * 1979-08-06 1981-04-16 Siemens AG, 1000 Berlin und 8000 München Loetbuegel fuer mikroloetstellen
US4426571A (en) * 1980-06-19 1984-01-17 Sperry Corporation Portable electric hot air rework tool for soldering and desoldering printed circuit assemblies
JPS62165996A (ja) * 1986-01-17 1987-07-22 富士通株式会社 リフローボンディング装置
US4799615A (en) * 1987-06-17 1989-01-24 Davenport Michael L Collet holder
US4799617A (en) * 1987-10-09 1989-01-24 Advanced Techniques Co., Inc. Convection heat attachment and removal instrument for surface mounted assemblies

Also Published As

Publication number Publication date
US5222655A (en) 1993-06-29
IT9047801A1 (it) 1991-09-28
DE69100548D1 (de) 1993-12-02
EP0449156A1 (en) 1991-10-02
IT9047801A0 (it) 1990-03-28
EP0449156B1 (en) 1993-10-27

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Legal Events

Date Code Title Description
0001 Granted