IT1239764B - Sistema di saldatura, particolarmente idoneo per saldature di chip a mezzo di leghe saldanti - Google Patents

Sistema di saldatura, particolarmente idoneo per saldature di chip a mezzo di leghe saldanti

Info

Publication number
IT1239764B
IT1239764B IT47801A IT4780190A IT1239764B IT 1239764 B IT1239764 B IT 1239764B IT 47801 A IT47801 A IT 47801A IT 4780190 A IT4780190 A IT 4780190A IT 1239764 B IT1239764 B IT 1239764B
Authority
IT
Italy
Prior art keywords
welding
particularly suitable
alloys
chip
welding system
Prior art date
Application number
IT47801A
Other languages
English (en)
Other versions
IT9047801A1 (it
IT9047801A0 (it
Inventor
Sergio Moretti
Ugo Fracassi
Original Assignee
Selenia Ind Elettroniche
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Selenia Ind Elettroniche filed Critical Selenia Ind Elettroniche
Priority to IT47801A priority Critical patent/IT1239764B/it
Publication of IT9047801A0 publication Critical patent/IT9047801A0/it
Priority to EP91104610A priority patent/EP0449156B1/en
Priority to DE91104610T priority patent/DE69100548D1/de
Priority to US07/677,628 priority patent/US5222655A/en
Publication of IT9047801A1 publication Critical patent/IT9047801A1/it
Application granted granted Critical
Publication of IT1239764B publication Critical patent/IT1239764B/it

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • B23K3/0478—Heating appliances electric comprising means for controlling or selecting the temperature or power
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Nonmetallic Welding Materials (AREA)
  • Arc Welding In General (AREA)
IT47801A 1990-03-28 1990-03-28 Sistema di saldatura, particolarmente idoneo per saldature di chip a mezzo di leghe saldanti IT1239764B (it)

Priority Applications (4)

Application Number Priority Date Filing Date Title
IT47801A IT1239764B (it) 1990-03-28 1990-03-28 Sistema di saldatura, particolarmente idoneo per saldature di chip a mezzo di leghe saldanti
EP91104610A EP0449156B1 (en) 1990-03-28 1991-03-24 Soldering apparatus and method employing provision of heated gas to a soldering alloy at a soldering collection
DE91104610T DE69100548D1 (de) 1990-03-28 1991-03-24 Lötvorrichtung und Verfahren unter Verwendung eines erwärmten Gases an einer Lotlegierung für eine zusammenzulötende Teileanordnung.
US07/677,628 US5222655A (en) 1990-03-28 1991-03-28 Soldering method employing provision of heated gas to a soldering alloy at a soldering connection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT47801A IT1239764B (it) 1990-03-28 1990-03-28 Sistema di saldatura, particolarmente idoneo per saldature di chip a mezzo di leghe saldanti

Publications (3)

Publication Number Publication Date
IT9047801A0 IT9047801A0 (it) 1990-03-28
IT9047801A1 IT9047801A1 (it) 1991-09-28
IT1239764B true IT1239764B (it) 1993-11-15

Family

ID=11262595

Family Applications (1)

Application Number Title Priority Date Filing Date
IT47801A IT1239764B (it) 1990-03-28 1990-03-28 Sistema di saldatura, particolarmente idoneo per saldature di chip a mezzo di leghe saldanti

Country Status (4)

Country Link
US (1) US5222655A (it)
EP (1) EP0449156B1 (it)
DE (1) DE69100548D1 (it)
IT (1) IT1239764B (it)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5234157A (en) * 1992-11-02 1993-08-10 At&T Bell Laboratories Soldering method and apparatus
GB2289235A (en) * 1994-05-06 1995-11-15 Ibm Solder tool
US5810241A (en) * 1996-09-16 1998-09-22 International Business Machines Corporation Solder bonding/debonding nozzle insert
SG106126A1 (en) * 2002-03-08 2004-09-30 Esec Trading Sa Method and apparatus for dispensing solder on a substrate
JP5594198B2 (ja) * 2011-03-16 2014-09-24 富士通株式会社 電子部品及び電子部品組立装置
US10046409B2 (en) * 2016-09-08 2018-08-14 Raytheon Company Methods of making an electrical connection, and of making a receptacle for receiving an electrical device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3964664A (en) * 1974-03-13 1976-06-22 P. R. Mallory & Co., Inc. Beam leaded device welding machine
DE2931857A1 (de) * 1979-08-06 1981-04-16 Siemens AG, 1000 Berlin und 8000 München Loetbuegel fuer mikroloetstellen
US4426571A (en) * 1980-06-19 1984-01-17 Sperry Corporation Portable electric hot air rework tool for soldering and desoldering printed circuit assemblies
JPS62165996A (ja) * 1986-01-17 1987-07-22 富士通株式会社 リフローボンディング装置
US4799615A (en) * 1987-06-17 1989-01-24 Davenport Michael L Collet holder
US4799617A (en) * 1987-10-09 1989-01-24 Advanced Techniques Co., Inc. Convection heat attachment and removal instrument for surface mounted assemblies

Also Published As

Publication number Publication date
US5222655A (en) 1993-06-29
EP0449156A1 (en) 1991-10-02
IT9047801A1 (it) 1991-09-28
DE69100548D1 (de) 1993-12-02
IT9047801A0 (it) 1990-03-28
EP0449156B1 (en) 1993-10-27

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Legal Events

Date Code Title Description
0001 Granted