IT9047801A0 - Sistema di saldatura, particolarmente idoneo per saldature di chip a mezzo di leghe saldanti - Google Patents
Sistema di saldatura, particolarmente idoneo per saldature di chip a mezzo di leghe saldantiInfo
- Publication number
- IT9047801A0 IT9047801A0 IT9047801A IT4780190A IT9047801A0 IT 9047801 A0 IT9047801 A0 IT 9047801A0 IT 9047801 A IT9047801 A IT 9047801A IT 4780190 A IT4780190 A IT 4780190A IT 9047801 A0 IT9047801 A0 IT 9047801A0
- Authority
- IT
- Italy
- Prior art keywords
- soldering
- particularly suitable
- chips
- solder alloys
- soldering system
- Prior art date
Links
- 238000005476 soldering Methods 0.000 title 2
- 229910045601 alloy Inorganic materials 0.000 title 1
- 239000000956 alloy Substances 0.000 title 1
- 229910000679 solder Inorganic materials 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
- B23K3/047—Heating appliances electric
- B23K3/0478—Heating appliances electric comprising means for controlling or selecting the temperature or power
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/75301—Bonding head
- H01L2224/75302—Shape
- H01L2224/75303—Shape of the pressing surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
- H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Arc Welding In General (AREA)
- Nonmetallic Welding Materials (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT47801A IT1239764B (it) | 1990-03-28 | 1990-03-28 | Sistema di saldatura, particolarmente idoneo per saldature di chip a mezzo di leghe saldanti |
DE91104610T DE69100548D1 (de) | 1990-03-28 | 1991-03-24 | Lötvorrichtung und Verfahren unter Verwendung eines erwärmten Gases an einer Lotlegierung für eine zusammenzulötende Teileanordnung. |
EP91104610A EP0449156B1 (en) | 1990-03-28 | 1991-03-24 | Soldering apparatus and method employing provision of heated gas to a soldering alloy at a soldering collection |
US07/677,628 US5222655A (en) | 1990-03-28 | 1991-03-28 | Soldering method employing provision of heated gas to a soldering alloy at a soldering connection |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT47801A IT1239764B (it) | 1990-03-28 | 1990-03-28 | Sistema di saldatura, particolarmente idoneo per saldature di chip a mezzo di leghe saldanti |
Publications (3)
Publication Number | Publication Date |
---|---|
IT9047801A0 true IT9047801A0 (it) | 1990-03-28 |
IT9047801A1 IT9047801A1 (it) | 1991-09-28 |
IT1239764B IT1239764B (it) | 1993-11-15 |
Family
ID=11262595
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT47801A IT1239764B (it) | 1990-03-28 | 1990-03-28 | Sistema di saldatura, particolarmente idoneo per saldature di chip a mezzo di leghe saldanti |
Country Status (4)
Country | Link |
---|---|
US (1) | US5222655A (it) |
EP (1) | EP0449156B1 (it) |
DE (1) | DE69100548D1 (it) |
IT (1) | IT1239764B (it) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5234157A (en) * | 1992-11-02 | 1993-08-10 | At&T Bell Laboratories | Soldering method and apparatus |
GB2289235A (en) * | 1994-05-06 | 1995-11-15 | Ibm | Solder tool |
US5810241A (en) * | 1996-09-16 | 1998-09-22 | International Business Machines Corporation | Solder bonding/debonding nozzle insert |
SG106126A1 (en) * | 2002-03-08 | 2004-09-30 | Esec Trading Sa | Method and apparatus for dispensing solder on a substrate |
JP5594198B2 (ja) * | 2011-03-16 | 2014-09-24 | 富士通株式会社 | 電子部品及び電子部品組立装置 |
US10046409B2 (en) * | 2016-09-08 | 2018-08-14 | Raytheon Company | Methods of making an electrical connection, and of making a receptacle for receiving an electrical device |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3964664A (en) * | 1974-03-13 | 1976-06-22 | P. R. Mallory & Co., Inc. | Beam leaded device welding machine |
DE2931857A1 (de) * | 1979-08-06 | 1981-04-16 | Siemens AG, 1000 Berlin und 8000 München | Loetbuegel fuer mikroloetstellen |
US4426571A (en) * | 1980-06-19 | 1984-01-17 | Sperry Corporation | Portable electric hot air rework tool for soldering and desoldering printed circuit assemblies |
JPS62165996A (ja) * | 1986-01-17 | 1987-07-22 | 富士通株式会社 | リフローボンディング装置 |
US4799615A (en) * | 1987-06-17 | 1989-01-24 | Davenport Michael L | Collet holder |
US4799617A (en) * | 1987-10-09 | 1989-01-24 | Advanced Techniques Co., Inc. | Convection heat attachment and removal instrument for surface mounted assemblies |
-
1990
- 1990-03-28 IT IT47801A patent/IT1239764B/it active IP Right Grant
-
1991
- 1991-03-24 DE DE91104610T patent/DE69100548D1/de not_active Expired - Lifetime
- 1991-03-24 EP EP91104610A patent/EP0449156B1/en not_active Expired - Lifetime
- 1991-03-28 US US07/677,628 patent/US5222655A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69100548D1 (de) | 1993-12-02 |
EP0449156A1 (en) | 1991-10-02 |
IT1239764B (it) | 1993-11-15 |
EP0449156B1 (en) | 1993-10-27 |
US5222655A (en) | 1993-06-29 |
IT9047801A1 (it) | 1991-09-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69211456D1 (de) | Flip-Chip-Verfahren zur Verbindung eines Halbleiterchips | |
DE3277758D1 (en) | Semiconductor chip mounting module | |
DE3575635D1 (de) | Kuehlungssystem fuer integrierte schaltungschips. | |
AU5819590A (en) | Improved thermal performance package for integrated circuit chip | |
DE69308390D1 (de) | Packung für integrierte Schaltungschips | |
DE69009756D1 (de) | Tunnel zum flussmittelfreien löten. | |
EP0573965A3 (en) | Semiconductor arrangement with connection-selecting circuit. | |
DE58900451D1 (de) | Loetverbindung. | |
EP0103025A4 (en) | Pb ALLOY WELDING FOR SEMICONDUCTOR DEVICE. | |
DE69018732D1 (de) | Halbleiterlaser. | |
FR2657196B1 (fr) | Monture intermediaire de dispositif laser a semi-conducteur. | |
DE3865159D1 (de) | Montiergeraet fuer einen chiptraeger. | |
DE69009266D1 (de) | Halbleiterlaser-Vorrichtung. | |
IT9047801A0 (it) | Sistema di saldatura, particolarmente idoneo per saldature di chip a mezzo di leghe saldanti | |
IT8519790A0 (it) | Procedimento per effettuare la saldatura di componenti elettronici su un supporto. | |
DE69028184D1 (de) | Wasserlösliches Lotflussmittel | |
DE69205385D1 (de) | Lötflussmittel. | |
DE69021151D1 (de) | Halbleiterlaser-Vorrichtung. | |
DE69013316D1 (de) | Integrierter Löthalter zum Titanlöten. | |
DE69202448D1 (de) | Lötverfahren. | |
ITTO920417A0 (it) | Zoccolo di elemento portante di chip. | |
KR900014991U (ko) | 반도체 패키지(package) | |
IT8323884V0 (it) | Dispositivo perfezionato per la saldatura di fili per componenti elettronici. | |
DE3381262D1 (de) | Modulare hochgeschwindigkeitsmultiplizierer, und integrierte schaltungs-modulen fuer solche multiplizierer. | |
DE68911864D1 (de) | Silber-Kupfer-Aluminium-Titan-Hartlotlegierung. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
0001 | Granted |