IT8519790A0 - Procedimento per effettuare la saldatura di componenti elettronici su un supporto. - Google Patents

Procedimento per effettuare la saldatura di componenti elettronici su un supporto.

Info

Publication number
IT8519790A0
IT8519790A0 IT8519790A IT1979085A IT8519790A0 IT 8519790 A0 IT8519790 A0 IT 8519790A0 IT 8519790 A IT8519790 A IT 8519790A IT 1979085 A IT1979085 A IT 1979085A IT 8519790 A0 IT8519790 A0 IT 8519790A0
Authority
IT
Italy
Prior art keywords
procedure
support
electronic components
soldering electronic
soldering
Prior art date
Application number
IT8519790A
Other languages
English (en)
Other versions
IT1184362B (it
Inventor
Stuart Briggs
Luciano Flabbi
Ken Johns
Original Assignee
Montefluos Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Montefluos Spa filed Critical Montefluos Spa
Priority to IT19790/85A priority Critical patent/IT1184362B/it
Publication of IT8519790A0 publication Critical patent/IT8519790A0/it
Priority to JP61046461A priority patent/JPS61268094A/ja
Priority to CA000503475A priority patent/CA1276841C/en
Priority to EP86301611A priority patent/EP0194152B1/en
Priority to DE8686301611T priority patent/DE3678014D1/de
Application granted granted Critical
Publication of IT1184362B publication Critical patent/IT1184362B/it
Priority to US07/149,979 priority patent/US4874124A/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3616Halogen compounds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
IT19790/85A 1985-03-06 1985-03-06 Procedimento per effittuare la saldatura di componenti elettronici su un supporto IT1184362B (it)

Priority Applications (6)

Application Number Priority Date Filing Date Title
IT19790/85A IT1184362B (it) 1985-03-06 1985-03-06 Procedimento per effittuare la saldatura di componenti elettronici su un supporto
JP61046461A JPS61268094A (ja) 1985-03-06 1986-03-05 電子部品の支持材へのはんだ付けの実施方法
CA000503475A CA1276841C (en) 1985-03-06 1986-03-06 Process for carrying out the soldering of electronic components on a support
EP86301611A EP0194152B1 (en) 1985-03-06 1986-03-06 Soldering electronic components on a support
DE8686301611T DE3678014D1 (de) 1985-03-06 1986-03-06 Loetung elektronischer bauelemente auf einer unterlage.
US07/149,979 US4874124A (en) 1985-03-06 1988-01-26 Process for carrying out the soldering of electronic components on a support

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT19790/85A IT1184362B (it) 1985-03-06 1985-03-06 Procedimento per effittuare la saldatura di componenti elettronici su un supporto

Publications (2)

Publication Number Publication Date
IT8519790A0 true IT8519790A0 (it) 1985-03-06
IT1184362B IT1184362B (it) 1987-10-28

Family

ID=11161234

Family Applications (1)

Application Number Title Priority Date Filing Date
IT19790/85A IT1184362B (it) 1985-03-06 1985-03-06 Procedimento per effittuare la saldatura di componenti elettronici su un supporto

Country Status (6)

Country Link
US (1) US4874124A (it)
EP (1) EP0194152B1 (it)
JP (1) JPS61268094A (it)
CA (1) CA1276841C (it)
DE (1) DE3678014D1 (it)
IT (1) IT1184362B (it)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4761881A (en) * 1986-09-15 1988-08-09 International Business Machines Corporation Single step solder process
US5188282A (en) * 1991-01-28 1993-02-23 Hughes Aircraft Company Vapor phase flash fusing of printed wiring boards
DE4103098C1 (it) * 1991-02-01 1992-06-25 Helmut Walter 8901 Koenigsbrunn De Leicht
NL1009214C2 (nl) * 1998-05-19 1999-12-07 Soltec Bv Reflowoven.
JP2001267733A (ja) * 2000-03-17 2001-09-28 Mitsumi Electric Co Ltd はんだ付け方法
JP3974525B2 (ja) * 2000-12-21 2007-09-12 富士通株式会社 リフロー半田付け装置及びリフロー半田付け方法
US20060252327A1 (en) * 2005-04-28 2006-11-09 Uitenbroek David R Scented product and method for manufacturing
DE102006032051B4 (de) 2006-07-10 2022-11-24 Endress+Hauser SE+Co. KG Wellenlötanlage zum Löten elektronischer Bauteile auf einer Leiterplatte
US20080164300A1 (en) * 2007-01-08 2008-07-10 Endicott Interconnect Technologies, Inc. Method of making circuitized substrate with solder balls having roughened surfaces, method of making electrical assembly including said circuitized substrate, and method of making multiple circuitized substrate assembly
DE102007053857A1 (de) * 2007-11-09 2009-05-14 Endress + Hauser Gmbh + Co. Kg Verfahren zum Betrieb einer Wellenlötanlage
US9009955B2 (en) 2010-08-03 2015-04-21 Infoscitex Corporation Method of making an electronically active textile article
DE202010012737U1 (de) * 2010-09-17 2011-04-14 Asscon Systemtechnik-Elektronik Gmbh Erwärmungs- und Trocknungsvorrichtung
US11445650B2 (en) 2019-10-22 2022-09-13 International Business Machines Corporation Localized rework using liquid media soldering

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2500388A (en) * 1948-07-21 1950-03-14 Minnesota Mining & Mfg Fluorocarbon ethers
US3054174A (en) * 1958-05-13 1962-09-18 Rca Corp Method for making semiconductor devices
US3242218A (en) * 1961-03-29 1966-03-22 Du Pont Process for preparing fluorocarbon polyethers
US3322826A (en) * 1962-04-11 1967-05-30 Du Pont Polymerization of hexafluoropropylene epoxide
US3388465A (en) * 1965-03-01 1968-06-18 Burroughs Corp Electronic assembly soldering process
US3665041A (en) * 1967-04-04 1972-05-23 Montedison Spa Perfluorinated polyethers and process for their preparation
US3825994A (en) * 1972-11-15 1974-07-30 Rca Corp Method of soldering circuit components to a substrate
US3866307A (en) * 1973-09-07 1975-02-18 Western Electric Co Method for soldering, fusing or brazing
US4032033A (en) * 1976-03-18 1977-06-28 Western Electric Company, Inc. Methods and apparatus for heating articles
US4077857A (en) * 1977-02-23 1978-03-07 The Unites States Of America As Represented By The Secretary Of The Air Force Method for the preparation of perfluoroethers
US4334646A (en) * 1980-04-17 1982-06-15 Harris Corporation Method of solder reflow assembly
GB8312503D0 (en) * 1983-05-06 1983-06-08 Isc Chemicals Ltd Vapour phase soldering

Also Published As

Publication number Publication date
EP0194152A1 (en) 1986-09-10
IT1184362B (it) 1987-10-28
JPS61268094A (ja) 1986-11-27
DE3678014D1 (de) 1991-04-18
EP0194152B1 (en) 1991-03-13
US4874124A (en) 1989-10-17
CA1276841C (en) 1990-11-27

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