DE3676744D1 - Leiterplattenherstellungsverfahren. - Google Patents
Leiterplattenherstellungsverfahren.Info
- Publication number
- DE3676744D1 DE3676744D1 DE8686303108T DE3676744T DE3676744D1 DE 3676744 D1 DE3676744 D1 DE 3676744D1 DE 8686303108 T DE8686303108 T DE 8686303108T DE 3676744 T DE3676744 T DE 3676744T DE 3676744 D1 DE3676744 D1 DE 3676744D1
- Authority
- DE
- Germany
- Prior art keywords
- pcb manufacturing
- pcb
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/135—Electrophoretic deposition of insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3473—Plating of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60087997A JPS61247090A (ja) | 1985-04-24 | 1985-04-24 | 半田スル−ホ−ルを有する回路板の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3676744D1 true DE3676744D1 (de) | 1991-02-14 |
Family
ID=13930433
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE198686303108T Pending DE204415T1 (de) | 1985-04-24 | 1986-04-24 | Leiterplattenherstellungsverfahren. |
DE8686303108T Expired - Fee Related DE3676744D1 (de) | 1985-04-24 | 1986-04-24 | Leiterplattenherstellungsverfahren. |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE198686303108T Pending DE204415T1 (de) | 1985-04-24 | 1986-04-24 | Leiterplattenherstellungsverfahren. |
Country Status (5)
Country | Link |
---|---|
US (1) | US4671854A (de) |
EP (1) | EP0204415B1 (de) |
JP (1) | JPS61247090A (de) |
KR (1) | KR930010060B1 (de) |
DE (2) | DE204415T1 (de) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5648320A (en) * | 1985-05-31 | 1997-07-15 | Jacobs; Richard L. | Method of manufacturing ceramic superconductor circuit board |
US5119272A (en) * | 1986-07-21 | 1992-06-02 | Mitsumi Electric Co., Ltd. | Circuit board and method of producing circuit board |
JPS63224389A (ja) * | 1987-03-13 | 1988-09-19 | 名幸電子工業株式会社 | 二重スル−ホ−ル付導体回路板及びその製造方法 |
JPS63246890A (ja) * | 1987-04-02 | 1988-10-13 | 関西ペイント株式会社 | プリント回路の形成方法 |
GB8712731D0 (en) * | 1987-05-30 | 1987-07-01 | Ciba Geigy Ag | Metallic patterns |
JPS6420694A (en) * | 1987-07-15 | 1989-01-24 | Kansai Paint Co Ltd | Manufacture of printed wiring board |
DE3850533T2 (de) * | 1987-08-05 | 1994-10-27 | Ciba Geigy Ag | Bilderzeugungsverfahren. |
JPH01256193A (ja) * | 1988-04-06 | 1989-10-12 | Oki Densen Kk | 小径スルーホール基板の製造方法 |
JPH0795577B2 (ja) * | 1988-04-12 | 1995-10-11 | 富士プラント工業株式会社 | リードフレームへの部分メッキ方法 |
JP2585070B2 (ja) * | 1988-08-02 | 1997-02-26 | 日本ペイント株式会社 | 画像形成方法 |
CA1334897C (en) * | 1988-08-02 | 1995-03-28 | Mamoru Seio | Electrodeposition coating composition and image-forming method using the same |
GB8822145D0 (en) * | 1988-09-21 | 1988-10-26 | Ciba Geigy Ag | Method |
US5045435A (en) * | 1988-11-25 | 1991-09-03 | Armstrong World Industries, Inc. | Water-borne, alkali-developable, photoresist coating compositions and their preparation |
US5004672A (en) * | 1989-07-10 | 1991-04-02 | Shipley Company Inc. | Electrophoretic method for applying photoresist to three dimensional circuit board substrate |
US5071359A (en) * | 1990-04-27 | 1991-12-10 | Rogers Corporation | Array connector |
US5245751A (en) * | 1990-04-27 | 1993-09-21 | Circuit Components, Incorporated | Array connector |
JPH0476985A (ja) * | 1990-07-18 | 1992-03-11 | Cmk Corp | プリント配線板の製造法 |
US5268256A (en) * | 1990-08-02 | 1993-12-07 | Ppg Industries, Inc. | Photoimageable electrodepositable photoresist composition for producing non-tacky films |
BR9103260A (pt) * | 1990-08-02 | 1992-02-18 | Ppg Industries Inc | Composicao de resina fotossensivel que pode ser eletrodepositada e pode receber fotoimagem |
JPH04146687A (ja) * | 1990-10-08 | 1992-05-20 | Nippon Paint Co Ltd | ソルダーマスクされた回路基板の製法 |
US5403698A (en) * | 1990-10-16 | 1995-04-04 | Hitachi Chemical Company, Ltd. | Negative type photosensitive electrodepositing resin composition |
US5202222A (en) * | 1991-03-01 | 1993-04-13 | Shipley Company Inc. | Selective and precise etching and plating of conductive substrates |
CA2067709C (en) * | 1991-06-05 | 1997-12-02 | James A. Johnson | Process for the manufacture of printed circuits using electrophoretically deposited organic resists |
JPH0690014A (ja) * | 1992-07-22 | 1994-03-29 | Mitsubishi Electric Corp | 薄型太陽電池及びその製造方法,エッチング方法及び自動エッチング装置,並びに半導体装置の製造方法 |
US6159658A (en) * | 1996-03-19 | 2000-12-12 | Toray Industries, Inc. | Photosensitive resin composition with polymer having an ionic group and having a polymerizable group in the side chain and printing plate materials |
DE59905871D1 (de) | 1998-09-18 | 2003-07-10 | Vantico Ag | Verfahren zur herstellung von geätzten schaltungen |
MY139405A (en) * | 1998-09-28 | 2009-09-30 | Ibiden Co Ltd | Printed circuit board and method for its production |
JP3931486B2 (ja) * | 1999-06-24 | 2007-06-13 | 住友化学株式会社 | ポジ型レジスト組成物 |
GB2354636A (en) * | 1999-09-25 | 2001-03-28 | Ibm | Mounting chips on substrates |
DE10045072A1 (de) * | 2000-09-12 | 2002-04-04 | Epcos Ag | Verfahren zur Herstellung einer elektrisch leitfähigen Struktur auf einer nichtplanen Oberfläche und Verwendung des Verfahrens |
EP1209527A1 (de) * | 2000-11-28 | 2002-05-29 | Shipley Company LLC | Photoresistzusammensetzung |
TWI269118B (en) * | 2001-03-05 | 2006-12-21 | Sumitomo Chemical Co | Chemical amplifying type positive resist composition |
EP1542519A4 (de) * | 2002-07-31 | 2010-01-06 | Sony Corp | Verfahren zur leiterplattenherstellung mit eingebauter einrichtung und leiterplatte mit eingebauter einrichtung und verfahren zur herstellung einer gedruckten leiterplatte und gedruckte leiterplatte |
CN100518448C (zh) * | 2005-11-22 | 2009-07-22 | 楠梓电子股份有限公司 | 电路板导通孔的制造方法 |
KR100797692B1 (ko) * | 2006-06-20 | 2008-01-23 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
US8324511B1 (en) * | 2010-04-06 | 2012-12-04 | Amkor Technology, Inc. | Through via nub reveal method and structure |
WO2023148511A1 (en) * | 2022-02-07 | 2023-08-10 | Sun Chemical Corporation | Water-based de-metallization resist |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1528489A (fr) * | 1966-07-01 | 1968-06-07 | Eastman Kodak Co | Nouvelles compositions photosensibles utiles, notamment, pour la préparation de planches de reproduction photomécanique |
JPS5239174A (en) * | 1975-09-25 | 1977-03-26 | Hitachi Ltd | Method of producing printed circuit board |
JPS52112770A (en) * | 1976-03-19 | 1977-09-21 | Hitachi Ltd | Method of producing printed substrate |
JPS55148491A (en) * | 1979-05-09 | 1980-11-19 | Meidensha Electric Mfg Co Ltd | Method of fabricating printed circuit board |
US4390615A (en) * | 1979-11-05 | 1983-06-28 | Courtney Robert W | Coating compositions |
US4325780A (en) * | 1980-09-16 | 1982-04-20 | Schulz Sr Robert M | Method of making a printed circuit board |
US4455364A (en) * | 1981-11-14 | 1984-06-19 | Konishiroku Photo Industry Co., Ltd. | Process for forming metallic image, composite material for the same |
JPS59202684A (ja) * | 1983-05-04 | 1984-11-16 | 株式会社日立製作所 | プリント基板の製造方法 |
US4487654A (en) * | 1983-10-27 | 1984-12-11 | Ael Microtel Limited | Method of manufacturing printed wiring boards |
US4601916A (en) * | 1984-07-18 | 1986-07-22 | Kollmorgen Technologies Corporation | Process for bonding metals to electrophoretically deposited resin coatings |
-
1985
- 1985-04-24 JP JP60087997A patent/JPS61247090A/ja active Pending
-
1986
- 1986-04-23 KR KR1019860003140A patent/KR930010060B1/ko not_active IP Right Cessation
- 1986-04-24 DE DE198686303108T patent/DE204415T1/de active Pending
- 1986-04-24 DE DE8686303108T patent/DE3676744D1/de not_active Expired - Fee Related
- 1986-04-24 EP EP86303108A patent/EP0204415B1/de not_active Expired - Lifetime
- 1986-04-24 US US06/855,362 patent/US4671854A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US4671854A (en) | 1987-06-09 |
EP0204415B1 (de) | 1991-01-09 |
KR860008702A (ko) | 1986-11-17 |
DE204415T1 (de) | 1987-04-09 |
EP0204415A2 (de) | 1986-12-10 |
JPS61247090A (ja) | 1986-11-04 |
KR930010060B1 (ko) | 1993-10-14 |
EP0204415A3 (en) | 1987-10-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3676744D1 (de) | Leiterplattenherstellungsverfahren. | |
DE3579315D1 (de) | Elektroden-herstellungsverfahren. | |
DE3670154D1 (de) | Elektronisches hubodometer. | |
DE3689533T3 (de) | Plasmaphorese-verfahren | |
FI850868L (fi) | Elektroniskt stroe-system. | |
DE3766324D1 (de) | Leiterplatte. | |
DE3482368D1 (de) | Leiterplatte. | |
KR870700615A (ko) | 감마-부티로락톤의 제조방법 | |
FI864620A (fi) | Substituerade bensyletrar. | |
FI853529L (fi) | Metod foer maetning av fuktighet. | |
NO853376L (no) | Broenn-testemetode. | |
DE3673816D1 (de) | Schnittstellenschaltung. | |
FI860180A0 (fi) | Polycykliska salter. | |
DE3676753D1 (de) | Stranggiessverfahren. | |
DE68912494T2 (de) | Leiterplattenherstellung. | |
DE3650049D1 (de) | Lötverfahren. | |
NL193232B (nl) | Elektronisch samenstel. | |
DE3670823D1 (de) | Changierfadenfuehrer. | |
NO870271D0 (no) | Maskineringsmetode. | |
DE3672424D1 (de) | Herstellungsverfahren 16-substituierter prostaglandine-e. | |
DE3687576D1 (de) | Bauelement und herstellungsverfahren. | |
DE3671804D1 (de) | Vorrichtungs-herstellungsverfahren. | |
DE3584107D1 (de) | Polyphosphazen-verfahren. | |
KR860004247U (ko) | 피혁 봉침구의 천공기 | |
KR880700287A (ko) | 연결관 제조 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |