KR860008702A - 땜납 도금회로와 관통공을 갖는 인쇄회로판의 제조 방법 - Google Patents

땜납 도금회로와 관통공을 갖는 인쇄회로판의 제조 방법 Download PDF

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KR860008702A
KR860008702A KR1019860003140A KR860003140A KR860008702A KR 860008702 A KR860008702 A KR 860008702A KR 1019860003140 A KR1019860003140 A KR 1019860003140A KR 860003140 A KR860003140 A KR 860003140A KR 860008702 A KR860008702 A KR 860008702A
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photosensitive resin
conductive coating
parts
manufacturing
resin composition
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KR1019860003140A
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KR930010060B1 (ko
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가쓰끼요 이시까와
가쓰끼요 이시가와
간지 니시지마
마모루 세이오
Original Assignee
닛뽄 페인트 가부시끼가이샤
스즈끼 마사오
닛뽄 페인트 가부시끼 가이샤
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/135—Electrophoretic deposition of insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
  • Paints Or Removers (AREA)

Abstract

내용 없음

Description

땜납 도금회로와 관통공을 갖는 인쇄회로판의 제조 방법.
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1 내지 제6도는 본 발명 방법의 각 단계에서 취급되는 감광성 물질을 도시한 것이다.

Claims (9)

  1. 관통공을 포함하여 그의 표면이 전도성 피복으로 이미 피복된 다수의 관통공을 갖는 기판을 제공하는 단계와 전착수단에 의하여, 감광성수지 100중량부당 0.01 내지 5중량부의 양으로 킬레이트계를 함유하는 음이온성의 광숙성형 감광성수지 조성물로 상기 전도성피복상에 감광성 수지층을 형성시키는 단계와; 상기 감광성 수지층을 그 위에 위치한 회로패턴의 포지티브 마스크를 통하여 노출시키는 단계와, 알칼리 수용액이나 반수용액으로 비 노출영역으로부터 미숙성된 감광성 수지를 제거하고, 이에 의하여 도금내식막을 형성하고, 노출된 전도성 피복을 땜납도금하는 단계와, 노출된 영역에서 도금내식막을 제거하고, 마지막으로 부식시켜서 노출된 영역에 아직도 잔류하는 전도성 피복을 제거하는 단계로, 구성되는 것을 특징으로 하는 땜납도금회로와 관통공을 갖는 인쇄회로판의 제조방법.
  2. 제1항에 있어서, 킬레이트제가 아미노-폴리카르복실산 화합물인 것을 특징으로 하는 제조방법.
  3. 제1항에 있어서, 음이온성의 광숙성형 감광성수지 조성물 (a) 다음 일반식(Ⅰ)로 표시되는 불포화 화합물, (b) 기타 공중합성의 불포화 화합물과의 공중합체를 기제로하는 것을 특징으로 하는 제조방법.
    상기 식에서, n은 1 내지 3의 정수; R1은 수소나 메틸기; R2는 수소, 1 내지 5개 탄소원자의 알킬, 알콕시 또는 니트로기이다.
  4. 제1항에 있어서, 음이온성의 광숙성형 감광성수지 조성물이 수지 100중량부당 0.1 내지 20중량부의 양으로 가소제를 함유하는 것을 특징으로 하는, 제조방법.
  5. 제4항에 있어서, 가소제가 폴리알킬렌 글리콜 페닐에테르인 것을 특징으로 하는 제조방법.
  6. 관통공을 포함하여 그의 전표면을 전도성 피복으로 미리 피본시킨 다수의 상기 관통공을 갖는 기간을 마련하는 단계와, 전착수단에 의하여 상기 전도성 피복상에 양이온성의 광숙성형 감광성 수지 조성물로 감광성 수지츠을 형성하는 단계와, 상기 감광성층를 그위에 위치한 회로패턴의 포지티브마스크를 통하여 노출시키는 단계와, 상기 감광성층을 산성수용액이나 용제로 현상시킴으로써 비노출 영역으로부터 미성숙된 감광성 수지를 제거하고 도금 내식막을 형성하는 단계와, 노출된 전도성 피복을 땜납 도금하는 단계와, 노출된 영역의 도금내식막을 제거하고, 마지막으로 부식단계를 밟게하여 노출영역에 아직도 잔류하는 전도성 피복을 제거하는 단계로 구성되는 것을 특징으로 하는 땜납도금회로와 관통공을 갖는 인쇄회로판의 제조방법.
  7. 제6항에 있어서, 양이온성의 광숙성형 감광성수지 조성물 (a) 다음 일반식(Ⅰ)로 표시되는 불포화 화합물과, (b) 기타 공중합성 불포화 화합물과의 공중합체를 기제로 하는 것을 특징으로 하는 제조방법.
    상기 식에서, n은 1 내지 3의 정수; R1은 수소나 메틸기; R2는 수소, 탄소원자 1 내지 5개의 알킬, 알콕시 또는 니트로기이다.
  8. 제6항에 있어서, 양이온성의 광숙성형 감광성수지 100중량부당 0.1 내지 20중량부의 양으로 가소제를 함유하는 것을 특징으로 하는 제조방법.
  9. 제8항에 있어서, 가소제가 폴리알킬렌 글리콜 페닐에테르일 것을 특징으로 하는 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860003140A 1985-04-24 1986-04-23 땜납도금회로와 관통공을 갖는 인쇄회로판의 제조방법 KR930010060B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP60087997A JPS61247090A (ja) 1985-04-24 1985-04-24 半田スル−ホ−ルを有する回路板の製造方法
JP87997 1985-04-24
JP85-87997 1985-04-24

Publications (2)

Publication Number Publication Date
KR860008702A true KR860008702A (ko) 1986-11-17
KR930010060B1 KR930010060B1 (ko) 1993-10-14

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KR1019860003140A KR930010060B1 (ko) 1985-04-24 1986-04-23 땜납도금회로와 관통공을 갖는 인쇄회로판의 제조방법

Country Status (5)

Country Link
US (1) US4671854A (ko)
EP (1) EP0204415B1 (ko)
JP (1) JPS61247090A (ko)
KR (1) KR930010060B1 (ko)
DE (2) DE204415T1 (ko)

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US4487654A (en) * 1983-10-27 1984-12-11 Ael Microtel Limited Method of manufacturing printed wiring boards
US4601916A (en) * 1984-07-18 1986-07-22 Kollmorgen Technologies Corporation Process for bonding metals to electrophoretically deposited resin coatings

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010039676A (ko) * 1999-06-24 2001-05-15 고오사이 아끼오 포지티브 내식막 조성물

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KR930010060B1 (ko) 1993-10-14
US4671854A (en) 1987-06-09
EP0204415A2 (en) 1986-12-10
JPS61247090A (ja) 1986-11-04
DE204415T1 (de) 1987-04-09
DE3676744D1 (de) 1991-02-14
EP0204415B1 (en) 1991-01-09
EP0204415A3 (en) 1987-10-28

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