KR860003753A - 동스로우호올프린트 배선판의 제조방법 - Google Patents

동스로우호올프린트 배선판의 제조방법 Download PDF

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Publication number
KR860003753A
KR860003753A KR1019850007484A KR850007484A KR860003753A KR 860003753 A KR860003753 A KR 860003753A KR 1019850007484 A KR1019850007484 A KR 1019850007484A KR 850007484 A KR850007484 A KR 850007484A KR 860003753 A KR860003753 A KR 860003753A
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KR
South Korea
Prior art keywords
copper
circuit board
printed circuit
throw
alkylimidazole compound
Prior art date
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KR1019850007484A
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English (en)
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KR900001089B1 (ko
Inventor
미노루 쓰까고시
아끼오 나까야마
마사히꼬 미나가와
슈우지 요시다
Original Assignee
아까자와 아쓰시
시꼬꾸카세이코오교오 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR860003753A publication Critical patent/KR860003753A/ko
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Publication of KR900001089B1 publication Critical patent/KR900001089B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/14—Nitrogen-containing compounds
    • C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09581—Applying an insulating coating on the walls of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0582—Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0591—Organic non-polymeric coating, e.g. for inhibiting corrosion thereby preserving solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

내용 없음

Description

동스로우호올프린트 배선판의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (3)

  1. 알킬리 수용액에 가용성 레지스트잉크를 사용하여 동피복적층판 위에 필요한 페턴을 형성한 뒤 하기식으로 표시되는 알킬이미다졸 화합물의 염이 함유된 수용액에 상기판을 침지하여 이 동피복적층판의 동표면이 상기 알킬이미다졸 화합물로 이루어진 에칭레지스트 막을 형성하여 생성된 동피복적층판을 건조시키고 이어서 알카리성에칭액으로 처리하는 것을 특징으로 하는 동스로우호올프린트 배선판의 제조방법.
    (상기식에서 R2는 탄소수 5-21의 알킬기, R4는 수소원자 또는 메틸기, HA는 유도기 또는 무기산이다.)
  2. 제1항에 있어서, 알킬이미다졸 화합물이 2-운데실이미다졸인 것을 특징으로 하는 동스로우호올프린트 배선판의 제조방법.
  3. 제1항에 있어서, 알킬이미다졸 화합물이 2-운데실-4-메틸이미다졸인 것을 특징으로 하는 동스로우호울프린트 배선판의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019850007484A 1984-10-11 1985-10-11 동스로우호올프린트 배선판의 제조방법 KR900001089B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP59213304A JPS6190492A (ja) 1984-10-11 1984-10-11 銅スル−ホ−ルプリント配線板の製造方法
JP84-213304 1984-10-11

Publications (2)

Publication Number Publication Date
KR860003753A true KR860003753A (ko) 1986-05-28
KR900001089B1 KR900001089B1 (ko) 1990-02-26

Family

ID=16636908

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019850007484A KR900001089B1 (ko) 1984-10-11 1985-10-11 동스로우호올프린트 배선판의 제조방법

Country Status (6)

Country Link
US (1) US4622097A (ko)
EP (1) EP0178864B1 (ko)
JP (1) JPS6190492A (ko)
KR (1) KR900001089B1 (ko)
CA (1) CA1238559A (ko)
DE (1) DE3582390D1 (ko)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6327091A (ja) * 1986-07-18 1988-02-04 四国化成工業株式会社 銅スル−ホ−ルプリント配線板の製造方法
ATE96978T1 (de) * 1988-08-25 1993-11-15 Siemens Nixdorf Inf Syst Verfahren zum herstellen von durchkontaktierten leiterplatten mit sehr kleinen oder keinen loetraendern um die durchkontaktierungsloecher.
DE4039271A1 (de) * 1990-12-08 1992-06-11 Basf Ag Verfahren zum schutz von kupfer- und kupferlegierungsoberlfaechen vor korrosion
US5275694A (en) * 1992-03-24 1994-01-04 Sanwa Laboratory Ltd. Process for production of copper through-hole printed wiring boards
ATE128597T1 (de) * 1992-11-23 1995-10-15 Siemens Nixdorf Inf Syst Verfahren zum herstellen von durchkontaktierten leiterplatten mit sehr kleinen oder keinen lötaugen.
DE4239328C2 (de) * 1992-11-23 1994-09-08 Siemens Nixdorf Inf Syst Verfahren zum Herstellen von durchkontaktierten Leiterplatten mit sehr kleinen oder keinen Lötaugen
DE4311807C2 (de) * 1993-04-03 1998-03-19 Atotech Deutschland Gmbh Verfahren zur Beschichtung von Metallen und Anwendung des Verfahrens in der Leiterplattentechnik
JPH06287774A (ja) * 1993-04-05 1994-10-11 Metsuku Kk 銅および銅合金の表面処理剤
EP0639043A1 (de) * 1993-08-10 1995-02-15 Siemens Nixdorf Informationssysteme AG Verfahren zur Herstellung von durchkontaktierten Leiterplatten mit sehr kleinen Lötaugen
US5376189A (en) * 1993-11-08 1994-12-27 Macdermid, Incorporated Composition and process for treatment of metallic surfaces
DE4339019A1 (de) * 1993-11-10 1995-05-11 Atotech Deutschland Gmbh Verfahren zur Herstellung von Leiterplatten
US5362334A (en) * 1993-12-23 1994-11-08 Macdermid, Incorporated Composition and process for treatment of metallic surfaces
JP4189609B2 (ja) * 1997-01-31 2008-12-03 テイラー，ジェームズ、エム． サブストレート材料をプライミングする組成物及び方法
US6174561B1 (en) 1998-01-30 2001-01-16 James M. Taylor Composition and method for priming substrate materials
US6555170B2 (en) 1998-01-30 2003-04-29 Duratech Industries, Inc. Pre-plate treating system
DE19944908A1 (de) 1999-09-10 2001-04-12 Atotech Deutschland Gmbh Verfahren zum Bilden eines Leitermusters auf dielektrischen Substraten
JP3736607B2 (ja) * 2000-01-21 2006-01-18 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
JP4309602B2 (ja) * 2001-04-25 2009-08-05 メック株式会社 銅または銅合金と樹脂との接着性を向上させる方法、ならびに積層体
AT412094B (de) * 2003-05-13 2004-09-27 Austria Tech & System Tech Verfahren zur beschichtung von rohlingen zur herstellung von gedruckten leiterplatten (pcb)
JP5615227B2 (ja) 2011-05-23 2014-10-29 四国化成工業株式会社 銅または銅合金の表面処理剤及びその利用
JP5615233B2 (ja) * 2011-06-20 2014-10-29 四国化成工業株式会社 銅または銅合金の表面処理剤及びその利用
CN102595795A (zh) * 2012-03-05 2012-07-18 同扬光电（江苏）有限公司 以纯铜板为基材制作双面柔性印刷线路板的方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3933531A (en) * 1972-04-11 1976-01-20 Natsuo Sawa Method of rust-preventing for copper and copper alloy
JPS5932915B2 (ja) * 1981-07-25 1984-08-11 「弐」夫 甲斐 スル−ホ−ルを有する配線基板製造方法
US4395294A (en) * 1981-08-17 1983-07-26 Bell Telephone Laboratories, Incorporated Copper corrosion inhibitor
US4529477A (en) * 1983-05-02 1985-07-16 Kollmorgen Technologies Corporation Process for the manufacture of printed circuit boards

Also Published As

Publication number Publication date
EP0178864A3 (en) 1987-09-30
EP0178864A2 (en) 1986-04-23
JPS641954B2 (ko) 1989-01-13
KR900001089B1 (ko) 1990-02-26
JPS6190492A (ja) 1986-05-08
US4622097A (en) 1986-11-11
EP0178864B1 (en) 1991-04-03
CA1238559A (en) 1988-06-28
DE3582390D1 (de) 1991-05-08

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