KR900004960A - 구리 또는 구리합금 표면상의 전환피막 형성방법 - Google Patents

구리 또는 구리합금 표면상의 전환피막 형성방법 Download PDF

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Publication number
KR900004960A
KR900004960A KR1019890013993A KR890013993A KR900004960A KR 900004960 A KR900004960 A KR 900004960A KR 1019890013993 A KR1019890013993 A KR 1019890013993A KR 890013993 A KR890013993 A KR 890013993A KR 900004960 A KR900004960 A KR 900004960A
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South Korea
Prior art keywords
copper
compound
aqueous solution
solution containing
metal surface
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KR1019890013993A
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English (en)
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KR0142409B1 (en
Inventor
수스무 마츠바라
수지 요시다
마사히코 미나가와
다이키치 다치바나
히로키 고다마
Original Assignee
아카자와 아츠시
시코쿠 가세이코교 가부시기가이샤
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Priority claimed from JP63247247A external-priority patent/JPH0293079A/ja
Priority claimed from JP1148136A external-priority patent/JP2561150B2/ja
Application filed by 아카자와 아츠시, 시코쿠 가세이코교 가부시기가이샤 filed Critical 아카자와 아츠시
Publication of KR900004960A publication Critical patent/KR900004960A/ko
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Publication of KR0142409B1 publication Critical patent/KR0142409B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/14—Nitrogen-containing compounds
    • C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

내용없음

Description

구리 또는 구리합금 표면상의 전환피막 형성방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (9)

  1. 금속표면을 2- 위치에 5 내지 21의 탄소원자를 가지는 일킬기를 포함하는 이미다졸 화합물함유 수용액과 접촉시키는 것으로 구성되고, 알킬이미다졸 화합물함유 수용액중에는 구리이온 또는 아연이온을 발생시킬 수 있는 기제가 용해 및 함유되어 있는 구리 또는 구리합금표면상의 화합전환피막형성 방법.
  2. 제1항에 있어서, 알킬이미다졸 화합물로서 2－운데실 이미다졸의 사용되는 방법.
  3. 제1항에 있어서, 알킬이미다졸 화합물로서 2－운데실－4－메틸이미다졸이 사용되는 방법.
  4. 제1항에 있어서, 알킬이미다졸 화합물과 구리이온 또는 아연이온을 발생시킬 수 있는 기제를 함유하는 수용액에 수용액의 pH치를 3 내지 6 으로 조절하기 위해서 산성기제가 첨가하는 방법.
  5. 금속표면을 2－위치에 5 내지 21의 탄소원자를 가지는 알킬기를 포함하는 이미다졸 화합물, 유기산 및 구리 이온을 발생시킬 수 있는 기제를 함유하는 수용액과 접촉시키는 것으로 구성되는 구리 또는 구리합금 표면상의 화합전환 피막형성 방법.
  6. 금속표면을 2－위치에 5 내지 21의 탄소원자를 가지는 알킬기를 포함하는 이미다졸 화합물, 유기산 및 아연이온을 발생시킬 수 있는 기제를 함유하는 수용액과 접촉시키는 것으로 구성되는 구리 또는 구리합금표면상의 화합전환 피막형성방법.
  7. 금속표면을 2－위치에 5 내지 21의 탄소원자를 가지는 알킬기를 포함하는 이미다졸 화합물, 유기산, 구리화합물 및 암모니아 또는 아민을 함유하고 4 내지 5로 조절된 pH치를 가지는 수용액과 접촉시키는 것으로 구성되는 구리 또는 구리합금 표면상의 화학전환피막형성방법.
  8. 금속표면을 2－운데실아미다졸, 유기산, 염화제일구리 및 암모니아를 함유하는 수용액과 접촉시켜서 금속표면상에 알킬이미다졸화합물의 전환피막을 형성시키는 것으로 구성되는 구리 또는 구리합금표면상의 화학전환 피막형성 방법.
  9. 금속표면을 2－운데실－4－메틸이미다졸, 유기산, 염화 제일구리 및 암모니아를 함유하는 수용액과 접촉시켜서 금속표면상에 알킬이미다졸 화합물의 전환피막을 형성시키는 것으로 구성되는 구리 또는 구리합금표면상의 화학전환 피막형성방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR89013993A 1988-09-29 1989-09-29 Method for forming conversion coating on surface of copper or copper alloy KR0142409B1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP63-247247 1988-09-29
JP63247247A JPH0293079A (ja) 1988-09-29 1988-09-29 銅及び銅合金の表面処理方法
JP1-148136 1989-06-09
JP1148136A JP2561150B2 (ja) 1989-06-09 1989-06-09 銅及び銅合金の表面処理方法

Publications (2)

Publication Number Publication Date
KR900004960A true KR900004960A (ko) 1990-04-13
KR0142409B1 KR0142409B1 (en) 1998-07-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR89013993A KR0142409B1 (en) 1988-09-29 1989-09-29 Method for forming conversion coating on surface of copper or copper alloy

Country Status (2)

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EP (1) EP0364132A1 (ko)
KR (1) KR0142409B1 (ko)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4311807C2 (de) * 1993-04-03 1998-03-19 Atotech Deutschland Gmbh Verfahren zur Beschichtung von Metallen und Anwendung des Verfahrens in der Leiterplattentechnik
DE4339019A1 (de) * 1993-11-10 1995-05-11 Atotech Deutschland Gmbh Verfahren zur Herstellung von Leiterplatten
JP2781954B2 (ja) * 1994-03-04 1998-07-30 メック株式会社 銅および銅合金の表面処理剤
DE4444388A1 (de) * 1994-11-28 1996-05-30 Atotech Deutschland Gmbh Verfahren zum Bonden von Drähten auf oxidationsempfindlichen, lötbaren Metallsubstraten
JP2923524B2 (ja) * 1995-08-01 1999-07-26 メック株式会社 銅および銅合金のマイクロエッチング剤並びにマイクロエッチング方法
US6284309B1 (en) 1997-12-19 2001-09-04 Atotech Deutschland Gmbh Method of producing copper surfaces for improved bonding, compositions used therein and articles made therefrom
EP1008675B1 (en) * 1998-12-10 2004-10-27 International Business Machines Corporation Copper pretreatment for tin solder alloy deposition
DE19944908A1 (de) 1999-09-10 2001-04-12 Atotech Deutschland Gmbh Verfahren zum Bilden eines Leitermusters auf dielektrischen Substraten
AT412094B (de) * 2003-05-13 2004-09-27 Austria Tech & System Tech Verfahren zur beschichtung von rohlingen zur herstellung von gedruckten leiterplatten (pcb)
JP5656081B2 (ja) * 2011-04-18 2015-01-21 メック株式会社 皮膜形成液及びこれを用いた皮膜形成方法
JP5615227B2 (ja) * 2011-05-23 2014-10-29 四国化成工業株式会社 銅または銅合金の表面処理剤及びその利用
JP5615233B2 (ja) 2011-06-20 2014-10-29 四国化成工業株式会社 銅または銅合金の表面処理剤及びその利用
JP6779557B1 (ja) 2020-07-20 2020-11-04 メック株式会社 被膜形成用組成物、表面処理金属部材の製造方法、および金属‐樹脂複合体の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3933531A (en) * 1972-04-11 1976-01-20 Natsuo Sawa Method of rust-preventing for copper and copper alloy
KR890004583B1 (ko) * 1984-06-29 1989-11-16 히다찌가세이고오교 가부시끼가이샤 금속표면 처리공정
US4731128A (en) * 1987-05-21 1988-03-15 International Business Machines Corporation Protection of copper from corrosion

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EP0364132A1 (en) 1990-04-18
KR0142409B1 (en) 1998-07-15

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