KR870010216A - 무전해 구리도금 및 이에 사용되는 도금욕 - Google Patents

무전해 구리도금 및 이에 사용되는 도금욕 Download PDF

Info

Publication number
KR870010216A
KR870010216A KR870004016A KR870004016A KR870010216A KR 870010216 A KR870010216 A KR 870010216A KR 870004016 A KR870004016 A KR 870004016A KR 870004016 A KR870004016 A KR 870004016A KR 870010216 A KR870010216 A KR 870010216A
Authority
KR
South Korea
Prior art keywords
copper
electroless
plating bath
copper plating
ethylenediamine tetraacetic
Prior art date
Application number
KR870004016A
Other languages
English (en)
Inventor
웰버트 밀리어스 존
다나 알더슨 질
Original Assignee
차알스 엘, 알브라이트, 주니어
마인 세이프티 어플라이언시스 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 차알스 엘, 알브라이트, 주니어, 마인 세이프티 어플라이언시스 캄파니 filed Critical 차알스 엘, 알브라이트, 주니어
Publication of KR870010216A publication Critical patent/KR870010216A/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

내용 없음

Description

무전해 구리도금 및 이에 사용되는 도금욕
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (7)

  1. (1) 수용성 구리염 약 0.6-6.4g/ι,
    (2) 에틸렌디아민 테트라아세트산 약 6~50g/ι
    (3) 디메틸아민 보란 약 2.5~12.5g/ι,
    (4) 티오디글리콜산 약 2.5~50mg/ι,
    (5) 에틸렌 옥시드와 아세틸렌글리콜의 게면활성반응 생성물 약 2.5~1000mg/ι, 그리고
    (6) pH를 약 8.0~11.5로 조절하기에 충분한 수산화암모늄의
    수용액을 필수 성분으로 하는 무전해 구리 도금욕.
  2. 제1항에 있어서, 아세틸렌글리콜이 2,4,7,9-테트라-메틸-5-대신-4.7-디올임을 특징으로 하는 무전해 구리 도금욕.
  3. 제1항에 있어서, 구리염이 황산구리임을 특징으로 하는 무전해 구리 도금욕.
  4. 제2항에 있어서, 구리염이 황산구리임을 특징으로 하는 무전해 구리 도금욕.
  5. 제1항에 있어서, pH가 9.5~10.5이고 황산 구리 약 3.2g/ι, 에틸렌디아민 테트라아세트산 약 12g/ι, 디메틸아민 보란 약 5.5g/ι, 티오디글리콜산 약 10mg/ι, 그리고 에틸렌옥시드와 2,4,7,9-테트라-메틸-5-데신-4,7디올의 계면활성 부가물 약 11mg/ι을 함유함을 특징으로 하는 무전해 구리 도금욕.
  6. (1) 수용성 구리염 약 0.6-6.4g/ι,
    (2) 에틸렌디아민 테트라아세트산 약 6~50g/ι
    (3) 디메틸아민 보란 약 2.5~12.5g/ι,
    (4) 티오디글리콜산 약 2.5~50mg/ι,
    (5) 에틸렌옥시드와 아세틸렌글리콜의 게면활성 반응 생성물 약 2.5~1000mg/ι, 그리고
    (6) pH를 약 8.0~11.5로 조절하기에 충분한 수산화암모늄을
    함유하는 온도 약 25~80℃의 수성욕과 기판을 접촉시켜서 되는 기판상에 구리의 무전해 도급법.
  7. 제6항에 있어서, 상기 욕은 그 pH가 약 9.5~10.5이고 황산 구리 약 3.2g/ι, 에틸렌디아민 테트라아세트산 약 12g/ι, 디메틸아민 보란 약 5.5g/ι, 티오디글리콜산 약 10mg/ι, 그리고 에틸렌옥시드와 2,4,7,9,-테트라-메틸-5-데신-4,7디올의 계면활성 부가물 약 11mg/ι,를 함유함을 특징으로 하는 구리의 무전해 도금법.
    ※ 참고사항: 최초출원 내용에 의하여 공개하는 것임.
KR870004016A 1986-04-25 1987-04-25 무전해 구리도금 및 이에 사용되는 도금욕 KR870010216A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/856,009 US4684550A (en) 1986-04-25 1986-04-25 Electroless copper plating and bath therefor
US856009 1986-04-25

Publications (1)

Publication Number Publication Date
KR870010216A true KR870010216A (ko) 1987-11-30

Family

ID=25322678

Family Applications (1)

Application Number Title Priority Date Filing Date
KR870004016A KR870010216A (ko) 1986-04-25 1987-04-25 무전해 구리도금 및 이에 사용되는 도금욕

Country Status (5)

Country Link
US (1) US4684550A (ko)
EP (1) EP0248522A1 (ko)
JP (1) JPS62256970A (ko)
KR (1) KR870010216A (ko)
CN (1) CN87102861A (ko)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01214100A (ja) * 1988-02-21 1989-08-28 Asahi Chem Res Lab Ltd 電磁波シールド回路及びその製造方法
US4818286A (en) * 1988-03-08 1989-04-04 International Business Machines Corporation Electroless copper plating bath
US4877450A (en) * 1989-02-23 1989-10-31 Learonal, Inc. Formaldehyde-free electroless copper plating solutions
US5108786A (en) * 1989-05-01 1992-04-28 Enthone-Omi, Inc. Method of making printed circuit boards
FR2646583B1 (fr) * 1989-05-01 1992-01-24 Enthone Corp Procede pour fabriquer des plaquettes a circuits imprimes
JP2648729B2 (ja) * 1990-09-04 1997-09-03 英夫 本間 無電解銅めっき液および無電解銅めっき方法
JP3115095B2 (ja) * 1992-04-20 2000-12-04 ディップソール株式会社 無電解メッキ液及びそれを使用するメッキ方法
US6042889A (en) * 1994-02-28 2000-03-28 International Business Machines Corporation Method for electrolessly depositing a metal onto a substrate using mediator ions
KR960005765A (ko) * 1994-07-14 1996-02-23 모리시다 요이치 반도체 장치의 배선형성에 이용하는 무전해 도금욕 및 반도체 장치의 배선성형방법
DE4440299A1 (de) * 1994-11-11 1996-05-15 Metallgesellschaft Ag Verfahren zur stromlosen Abscheidung von Kupferüberzügen auf Eisen- und Eisenlegierungsoberflächen
US6268016B1 (en) 1996-06-28 2001-07-31 International Business Machines Corporation Manufacturing computer systems with fine line circuitized substrates
US5770032A (en) * 1996-10-16 1998-06-23 Fidelity Chemical Products Corporation Metallizing process
JP3198066B2 (ja) * 1997-02-21 2001-08-13 荏原ユージライト株式会社 微多孔性銅皮膜およびこれを得るための無電解銅めっき液
US6797312B2 (en) * 2003-01-21 2004-09-28 Mattson Technology, Inc. Electroless plating solution and process
US7913644B2 (en) * 2005-09-30 2011-03-29 Lam Research Corporation Electroless deposition system
US7972652B2 (en) * 2005-10-14 2011-07-05 Lam Research Corporation Electroless plating system
CN100451168C (zh) * 2005-11-25 2009-01-14 北京林业大学 一种木材表面化学镀铜的组合物及其化学镀铜方法
US9048088B2 (en) 2008-03-28 2015-06-02 Lam Research Corporation Processes and solutions for substrate cleaning and electroless deposition
CN101580953B (zh) * 2008-05-14 2011-08-03 深圳市迪凯鑫科技有限公司 一种化学沉铜液的组成及其制备方法
CN101684554B (zh) * 2008-09-23 2012-03-07 比亚迪股份有限公司 一种聚酰亚胺薄膜的化学镀铜液及其表面化学镀铜方法
CN103422079B (zh) * 2012-05-22 2016-04-13 比亚迪股份有限公司 一种化学镀铜液及其制备方法
US9611550B2 (en) 2012-12-26 2017-04-04 Rohm And Haas Electronic Materials Llc Formaldehyde free electroless copper plating compositions and methods
US10655227B2 (en) 2017-10-06 2020-05-19 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US10294569B2 (en) 2017-10-06 2019-05-21 Rohm And Haas Electronic Materials Llc Stable electroless copper plating compositions and methods for electroless plating copper on substrates
CN111303427B (zh) * 2020-05-14 2020-09-04 富海(东营)新材料科技有限公司 高纯度低灰分聚砜类树脂的工业化提纯工艺

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US29285A (en) * 1860-07-24 A M Karr Improvement in mole-plows
USRE29285E (en) 1973-03-15 1977-06-28 E. I. Du Pont De Nemours And Company Method for concomitant particulate diamond deposition in electroless plating, and the product thereof
US3902907A (en) * 1973-08-17 1975-09-02 Kazutaka Kishita System for electroless plating of copper and composition
US3870526A (en) * 1973-09-20 1975-03-11 Us Army Electroless deposition of copper and copper-tin alloys
US4143186A (en) * 1976-09-20 1979-03-06 Amp Incorporated Process for electroless copper deposition from an acidic bath
JPS56156749A (en) * 1980-05-08 1981-12-03 Toshiba Corp Chemical copper plating solution

Also Published As

Publication number Publication date
US4684550A (en) 1987-08-04
EP0248522A1 (en) 1987-12-09
CN87102861A (zh) 1987-12-09
JPS62256970A (ja) 1987-11-09

Similar Documents

Publication Publication Date Title
KR870010216A (ko) 무전해 구리도금 및 이에 사용되는 도금욕
KR920018241A (ko) 주석, 납 또는 주석-납 합금을 무전해 도금하는 방법
SE7606209L (sv) Forfarande for elektrolytisk beleggning av en aluminiumberare
ES485223A1 (es) Un procedimiento para el tratamiento de un substrato plasti-co polimerico
SE8206447L (sv) Avmetalliseringskomposition och -forfarande
KR870010219A (ko) 금속표면의 코팅조성물과 그를 이용한 코팅방법
US3436233A (en) Method and composition for autocatalytically depositing copper
SE7907531L (sv) Stromlos kopparbeleggning
KR930002539A (ko) 무전해 주석 또는 주석-납 합금 도금액 무전해 주석 또는 주석-납 합금 도금방법
KR900004960A (ko) 구리 또는 구리합금 표면상의 전환피막 형성방법
GB956922A (en) Chemical gold plating
SE8002598L (sv) Silver- och silver/guld-pleteringsbad
SE7703989L (sv) Forfarande vid stromlos avsettning av kopparbeleggnigar
GB939007A (en) Bright gold electroplating
GB2115008B (en) Electroplating chromium
US4640718A (en) Process for accelerating Pd/Sn seeds for electroless copper plating
JPS57140891A (en) Pretreating solution for silver plating
SE8205982L (sv) Forfarande vid stromfri kopparpletering och pleteringslosning for genomforande av forfarandet
KR850000538A (ko) 고속 은도금
KR890017391A (ko) 무전해 용착 방법
ES8106023A1 (es) Un metodo para la electrodeposicion de un deposito de niquelsustancialmente negro sobre un sustrato.
JPS5462933A (en) Nickel electroplating method
US2891896A (en) Improved cyanide copper plating baths
ES322277A1 (es) Procedimiento para el chapado quimico de superficies de metal ferroso.
GB1087054A (en) Tinning of alumnium

Legal Events

Date Code Title Description
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid