KR930002539A - 무전해 주석 또는 주석-납 합금 도금액 무전해 주석 또는 주석-납 합금 도금방법 - Google Patents

무전해 주석 또는 주석-납 합금 도금액 무전해 주석 또는 주석-납 합금 도금방법 Download PDF

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Publication number
KR930002539A
KR930002539A KR1019920011918A KR920011918A KR930002539A KR 930002539 A KR930002539 A KR 930002539A KR 1019920011918 A KR1019920011918 A KR 1019920011918A KR 920011918 A KR920011918 A KR 920011918A KR 930002539 A KR930002539 A KR 930002539A
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KR
South Korea
Prior art keywords
tin
lead alloy
electroless
alloy plating
salt
Prior art date
Application number
KR1019920011918A
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English (en)
Other versions
KR100221260B1 (ko
Inventor
히로끼 우찌다
모또노부 구보
마사유끼 기소
데루유끼 홋다
도호루 기미다마리
Original Assignee
우에무라 아끼히도
우에무라 고오교오 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP3190768A external-priority patent/JP2873751B2/ja
Priority claimed from JP3224944A external-priority patent/JP2518118B2/ja
Application filed by 우에무라 아끼히도, 우에무라 고오교오 가부시끼가이샤 filed Critical 우에무라 아끼히도
Publication of KR930002539A publication Critical patent/KR930002539A/ko
Application granted granted Critical
Publication of KR100221260B1 publication Critical patent/KR100221260B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

내용 없음.

Description

무전해 주석 또는 주석-납 합금 도금액 무전해 주석 또는 주석-납 합금 도금방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (4)

  1. (A)제1주석염 및 제1주석염과 납염의 혼합물로 이루어진 군으로부터 선택된 가용성금속염 성분, (B)산, (C)티오우레아 또는 티오우레아 유도체, (D)환원제, 및(E)비이온성 계면활성제로 이루어진 것을 특징으로 하는 무전해 주석 또는 주석-납 합금 도금액.
  2. 제1항에 있어서, (F)양이온성 계면활성제, 환에 질소원자를 가지고있는 복소환식 화합물 및 그것의 혼합물로 이루어진 군으로부터 선택된 성분을 더 포함하는것을 특징으로 하는 도금액.
  3. (A)제1주석염 및 제1주석염과 납염의 혼합물로 이루어진 군으로부터 선택된 가용성금속염 성분, (B)산, (C)티오우레아 또는 티오우레아 유도체, (D)환원제, 및(E)암모늄 이온, 4급암모늄이온 및 그것의 혼합물로 이루어진 군으로부터 선택된 성분으로 이루어진 것을 특징으로 하는 무전해 주석 또는 주석-납 합금 도금액.
  4. 물품상에 주석 또는 주석-납 합금 피막을 도금하기위하여 제1항 또는 제3항의 무전해 도금액에 물품을 침지하여 도금하는 것으로 이루어지는것을 특징으로 하는 무전해 주석 또는 주석-납 합금의 도금방법.
    ※참고사항:최초출원 내용에 의하여 공개하는 것임.
KR1019920011918A 1991-07-04 1992-07-04 무전해 주석 또는 주석-납 합금 도금액 및 무전해 주석 또는 주석-납 합금 도금방법 KR100221260B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP91-190768 1991-07-04
JP3190768A JP2873751B2 (ja) 1991-07-04 1991-07-04 無電解錫又は錫・鉛合金めっき液及び無電解錫又は錫・鉛合金めっき方法
JP3224944A JP2518118B2 (ja) 1991-08-09 1991-08-09 無電解錫又は錫・鉛合金めっき液及び無電解錫又は錫・鉛合金めっき方法
JP91-224944 1991-08-09

Publications (2)

Publication Number Publication Date
KR930002539A true KR930002539A (ko) 1993-02-23
KR100221260B1 KR100221260B1 (ko) 1999-09-15

Family

ID=26506301

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920011918A KR100221260B1 (ko) 1991-07-04 1992-07-04 무전해 주석 또는 주석-납 합금 도금액 및 무전해 주석 또는 주석-납 합금 도금방법

Country Status (4)

Country Link
US (1) US5266103A (ko)
EP (1) EP0521738B1 (ko)
KR (1) KR100221260B1 (ko)
DE (1) DE69215014T2 (ko)

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US5910340A (en) * 1995-10-23 1999-06-08 C. Uyemura & Co., Ltd. Electroless nickel plating solution and method
US5554211A (en) * 1995-11-15 1996-09-10 Mcgean-Rohco, Inc. Aqueous electroless plating solutions
WO1997046732A1 (fr) * 1996-06-05 1997-12-11 Sumitomo Light Metal Industries, Ltd. Procede de fabrication de tuyau de cuivre dont l'interieur est plaque a l'etain
US6268016B1 (en) * 1996-06-28 2001-07-31 International Business Machines Corporation Manufacturing computer systems with fine line circuitized substrates
JP3687722B2 (ja) * 1999-01-12 2005-08-24 上村工業株式会社 無電解複合めっき液及び無電解複合めっき方法
DE19954613A1 (de) * 1999-11-12 2001-05-17 Enthone Omi Deutschland Gmbh Verfahren zur stromlosen Verzinnung von Kupfer oder Kupferlegierungen
US6821323B1 (en) 1999-11-12 2004-11-23 Enthone Inc. Process for the non-galvanic tin plating of copper or copper alloys
US6562221B2 (en) * 2001-09-28 2003-05-13 David Crotty Process and composition for high speed plating of tin and tin alloys
CN1839355B (zh) * 2003-08-19 2012-07-11 安万托特性材料股份有限公司 用于微电子设备的剥离和清洁组合物
ES2354045T3 (es) * 2005-02-28 2011-03-09 Rohm And Haas Electronic Materials, Llc Procedimientos con fundente mejorados.
JP2010070838A (ja) * 2008-09-22 2010-04-02 Rohm & Haas Electronic Materials Llc 金属表面処理水溶液および金属表面のウィスカ抑制方法
EP2476779B1 (en) * 2011-01-13 2013-03-20 Atotech Deutschland GmbH Immersion tin or tin alloy plating bath with improved removal of cupurous ions
US8834958B2 (en) 2011-07-08 2014-09-16 The United States Of America As Represented By The Secretary Of The Army Process of making negative electrode
KR101574229B1 (ko) * 2014-03-24 2015-12-03 주식회사 익스톨 무전해 주석 도금액 및 이를 이용하여 무전해 주석 도금하는 방법
US9604316B2 (en) 2014-09-23 2017-03-28 Globalfoundries Inc. Tin-based solder composition with low void characteristic
CN116249273A (zh) * 2022-12-31 2023-06-09 湖北金禄科技有限公司 汽车线路板及其沉锡处理方法

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US4093466A (en) * 1975-05-06 1978-06-06 Amp Incorporated Electroless tin and tin-lead alloy plating baths
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US5145517A (en) * 1981-04-01 1992-09-08 Surface Technology, Inc. Composite electroless plating-solutions, processes, and articles thereof
US4550037A (en) * 1984-12-17 1985-10-29 Texo Corporation Tin plating immersion process
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Also Published As

Publication number Publication date
EP0521738B1 (en) 1996-11-06
KR100221260B1 (ko) 1999-09-15
DE69215014T2 (de) 1997-04-03
US5266103A (en) 1993-11-30
EP0521738A2 (en) 1993-01-07
DE69215014D1 (de) 1996-12-12
EP0521738A3 (en) 1994-07-13

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