SE8205982L - Forfarande vid stromfri kopparpletering och pleteringslosning for genomforande av forfarandet - Google Patents

Forfarande vid stromfri kopparpletering och pleteringslosning for genomforande av forfarandet

Info

Publication number
SE8205982L
SE8205982L SE8205982A SE8205982A SE8205982L SE 8205982 L SE8205982 L SE 8205982L SE 8205982 A SE8205982 A SE 8205982A SE 8205982 A SE8205982 A SE 8205982A SE 8205982 L SE8205982 L SE 8205982L
Authority
SE
Sweden
Prior art keywords
procedure
solution
implementation
power
plating
Prior art date
Application number
SE8205982A
Other languages
Unknown language ( )
English (en)
Other versions
SE8205982D0 (sv
Inventor
D A Arcilesi
Original Assignee
Occidental Chem Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Occidental Chem Co filed Critical Occidental Chem Co
Publication of SE8205982D0 publication Critical patent/SE8205982D0/sv
Publication of SE8205982L publication Critical patent/SE8205982L/sv

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
SE8205982A 1981-10-23 1982-10-21 Forfarande vid stromfri kopparpletering och pleteringslosning for genomforande av forfarandet SE8205982L (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US31428081A 1981-10-23 1981-10-23

Publications (2)

Publication Number Publication Date
SE8205982D0 SE8205982D0 (sv) 1982-10-21
SE8205982L true SE8205982L (sv) 1983-04-24

Family

ID=23219330

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8205982A SE8205982L (sv) 1981-10-23 1982-10-21 Forfarande vid stromfri kopparpletering och pleteringslosning for genomforande av forfarandet

Country Status (7)

Country Link
AU (1) AU544591B2 (sv)
BE (1) BE894789A (sv)
CA (1) CA1184359A (sv)
DE (1) DE3238921C2 (sv)
GB (1) GB2109013A (sv)
IT (1) IT1197434B (sv)
SE (1) SE8205982L (sv)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3404270A1 (de) * 1984-02-04 1985-08-08 Schering AG, 1000 Berlin und 4709 Bergkamen Waessriges alkalisches bad zur chemischen abscheidung von kupfer, nickel, kobalt und deren legierungen
GB2154250B (en) * 1984-02-17 1987-06-03 Omi Int Corp Complexing agent for electroless copper plating
DE3806306A1 (de) * 1988-02-27 1989-09-07 Basf Ag Verwendung von polyacetalen als komplexbildner zur chemischen abscheidung von kupfer und verfahren zur chemischen abscheidung von kupfer
JP3208410B2 (ja) 1997-04-07 2001-09-10 奥野製薬工業株式会社 非導電性プラスチック成形品への電気めっき方法
JP6035540B2 (ja) 2012-12-21 2016-11-30 奥野製薬工業株式会社 導電性皮膜形成浴
CN105765104A (zh) 2014-01-27 2016-07-13 奥野制药工业株式会社 导电膜形成浴
CN105132973A (zh) * 2015-09-22 2015-12-09 太原工业学院 一种环保型无氰电镀铜锌合金溶液及其电镀铜锌合金工艺

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3383224A (en) * 1965-11-09 1968-05-14 Shipley Co Electroless copper deposition
US3329512A (en) * 1966-04-04 1967-07-04 Shipley Co Chemical deposition of copper and solutions therefor
BE757573A (fr) * 1969-10-16 1971-04-15 Philips Nv Depot sans courant de cuivre flexible
US3650777A (en) * 1971-02-11 1972-03-21 Kollmorgen Corp Electroless copper plating

Also Published As

Publication number Publication date
IT1197434B (it) 1988-11-30
IT8249324A0 (it) 1982-10-21
CA1184359A (en) 1985-03-26
AU8915282A (en) 1983-04-28
BE894789A (fr) 1983-04-22
SE8205982D0 (sv) 1982-10-21
AU544591B2 (en) 1985-06-06
GB2109013A (en) 1983-05-25
DE3238921A1 (de) 1983-05-05
DE3238921C2 (de) 1985-06-13

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