CA1184359A - Metallic impurity control for electroless copper plating - Google Patents
Metallic impurity control for electroless copper platingInfo
- Publication number
- CA1184359A CA1184359A CA000412763A CA412763A CA1184359A CA 1184359 A CA1184359 A CA 1184359A CA 000412763 A CA000412763 A CA 000412763A CA 412763 A CA412763 A CA 412763A CA 1184359 A CA1184359 A CA 1184359A
- Authority
- CA
- Canada
- Prior art keywords
- solution
- present
- hydroxy compound
- amount
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US31428081A | 1981-10-23 | 1981-10-23 | |
US314,280 | 1981-10-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
CA1184359A true CA1184359A (en) | 1985-03-26 |
Family
ID=23219330
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA000412763A Expired CA1184359A (en) | 1981-10-23 | 1982-10-04 | Metallic impurity control for electroless copper plating |
Country Status (7)
Country | Link |
---|---|
AU (1) | AU544591B2 (sv) |
BE (1) | BE894789A (sv) |
CA (1) | CA1184359A (sv) |
DE (1) | DE3238921C2 (sv) |
GB (1) | GB2109013A (sv) |
IT (1) | IT1197434B (sv) |
SE (1) | SE8205982L (sv) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3404270A1 (de) * | 1984-02-04 | 1985-08-08 | Schering AG, 1000 Berlin und 4709 Bergkamen | Waessriges alkalisches bad zur chemischen abscheidung von kupfer, nickel, kobalt und deren legierungen |
GB2154250B (en) * | 1984-02-17 | 1987-06-03 | Omi Int Corp | Complexing agent for electroless copper plating |
DE3806306A1 (de) * | 1988-02-27 | 1989-09-07 | Basf Ag | Verwendung von polyacetalen als komplexbildner zur chemischen abscheidung von kupfer und verfahren zur chemischen abscheidung von kupfer |
JP3208410B2 (ja) | 1997-04-07 | 2001-09-10 | 奥野製薬工業株式会社 | 非導電性プラスチック成形品への電気めっき方法 |
US10036097B2 (en) | 2012-12-21 | 2018-07-31 | Okuno Chemical Industries Co., Ltd. | Conductive coating film forming bath |
US9951433B2 (en) | 2014-01-27 | 2018-04-24 | Okuno Chemical Industries Co., Ltd. | Conductive film-forming bath |
CN105132973A (zh) * | 2015-09-22 | 2015-12-09 | 太原工业学院 | 一种环保型无氰电镀铜锌合金溶液及其电镀铜锌合金工艺 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3383224A (en) * | 1965-11-09 | 1968-05-14 | Shipley Co | Electroless copper deposition |
US3329512A (en) * | 1966-04-04 | 1967-07-04 | Shipley Co | Chemical deposition of copper and solutions therefor |
BE757573A (fr) * | 1969-10-16 | 1971-04-15 | Philips Nv | Depot sans courant de cuivre flexible |
US3650777A (en) * | 1971-02-11 | 1972-03-21 | Kollmorgen Corp | Electroless copper plating |
-
1982
- 1982-10-04 CA CA000412763A patent/CA1184359A/en not_active Expired
- 1982-10-06 AU AU89152/82A patent/AU544591B2/en not_active Ceased
- 1982-10-21 SE SE8205982A patent/SE8205982L/sv not_active Application Discontinuation
- 1982-10-21 DE DE3238921A patent/DE3238921C2/de not_active Expired
- 1982-10-21 IT IT49324/82A patent/IT1197434B/it active
- 1982-10-22 BE BE0/209315A patent/BE894789A/fr not_active IP Right Cessation
- 1982-10-22 GB GB08230180A patent/GB2109013A/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
DE3238921C2 (de) | 1985-06-13 |
AU544591B2 (en) | 1985-06-06 |
IT1197434B (it) | 1988-11-30 |
BE894789A (fr) | 1983-04-22 |
GB2109013A (en) | 1983-05-25 |
IT8249324A0 (it) | 1982-10-21 |
SE8205982L (sv) | 1983-04-24 |
AU8915282A (en) | 1983-04-28 |
SE8205982D0 (sv) | 1982-10-21 |
DE3238921A1 (de) | 1983-05-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4814205A (en) | Process for rejuvenation electroless nickel solution | |
US3993799A (en) | Electroless plating process employing non-noble metal hydrous oxide catalyst | |
CA1255975A (en) | Formaldehyde-free autocatalytic electroless copper plating | |
EP0913502B1 (en) | Method of electroplating nonconductive plastic molded product | |
KR101635661B1 (ko) | 베타-아미노산 함유 전해질 및 금속 층 침착 방법 | |
EP0100452A1 (en) | Method for conditioning a substrate for plating | |
US4136216A (en) | Non-precious metal colloidal dispersions for electroless metal deposition | |
US3853590A (en) | Electroless plating solution and process | |
TW201741497A (zh) | 鍍銅液及鍍銅方法 | |
US3993848A (en) | Catalytic primer | |
CA1184359A (en) | Metallic impurity control for electroless copper plating | |
US4450191A (en) | Ammonium ions used as electroless copper plating rate controller | |
US3178311A (en) | Electroless plating process | |
US4020197A (en) | Process for the catalytic sensitization of non-metallic surfaces for subsequent electroless metallization | |
KR20100017608A (ko) | 비전도성 기판에 금속 코팅하는 방법 | |
KR20120081107A (ko) | 비전도성 기판에 금속 코팅을 적용하기 위한 프로세스 | |
US4321285A (en) | Electroless plating | |
US2976180A (en) | Method of silver plating by chemical reduction | |
US3769061A (en) | Pre-etch treatment of acrylonitrile-butadiene-styrene resins for electroless plating | |
JPH022952B2 (sv) | ||
US3754940A (en) | Electroless plating solutions containing sulfamic acid and salts thereof | |
JPS60184683A (ja) | 金属付着方法 | |
US3645749A (en) | Electroless plating baths with improved deposition rates | |
US3507681A (en) | Metal plating of plastics | |
US3130072A (en) | Silver-palladium immersion plating composition and process |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MKEC | Expiry (correction) | ||
MKEX | Expiry |