CA1184359A - Repression des impuretes metalliques en cuivrage non electrolytique - Google Patents

Repression des impuretes metalliques en cuivrage non electrolytique

Info

Publication number
CA1184359A
CA1184359A CA000412763A CA412763A CA1184359A CA 1184359 A CA1184359 A CA 1184359A CA 000412763 A CA000412763 A CA 000412763A CA 412763 A CA412763 A CA 412763A CA 1184359 A CA1184359 A CA 1184359A
Authority
CA
Canada
Prior art keywords
solution
present
hydroxy compound
amount
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000412763A
Other languages
English (en)
Inventor
Donald A. Arcilesi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OMI International Corp
Original Assignee
OMI International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OMI International Corp filed Critical OMI International Corp
Application granted granted Critical
Publication of CA1184359A publication Critical patent/CA1184359A/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
CA000412763A 1981-10-23 1982-10-04 Repression des impuretes metalliques en cuivrage non electrolytique Expired CA1184359A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US31428081A 1981-10-23 1981-10-23
US314,280 1981-10-23

Publications (1)

Publication Number Publication Date
CA1184359A true CA1184359A (fr) 1985-03-26

Family

ID=23219330

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000412763A Expired CA1184359A (fr) 1981-10-23 1982-10-04 Repression des impuretes metalliques en cuivrage non electrolytique

Country Status (7)

Country Link
AU (1) AU544591B2 (fr)
BE (1) BE894789A (fr)
CA (1) CA1184359A (fr)
DE (1) DE3238921C2 (fr)
GB (1) GB2109013A (fr)
IT (1) IT1197434B (fr)
SE (1) SE8205982L (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3404270A1 (de) * 1984-02-04 1985-08-08 Schering AG, 1000 Berlin und 4709 Bergkamen Waessriges alkalisches bad zur chemischen abscheidung von kupfer, nickel, kobalt und deren legierungen
GB2154250B (en) * 1984-02-17 1987-06-03 Omi Int Corp Complexing agent for electroless copper plating
DE3806306A1 (de) * 1988-02-27 1989-09-07 Basf Ag Verwendung von polyacetalen als komplexbildner zur chemischen abscheidung von kupfer und verfahren zur chemischen abscheidung von kupfer
WO1998045505A1 (fr) 1997-04-07 1998-10-15 Okuno Chemical Industries Co., Ltd. Procede d'electrodeposition de produit moule en plastique, non conducteur
EP2937447B1 (fr) 2012-12-21 2018-10-10 Okuno Chemical Industries Co., Ltd. Bain formant un film de revêtement conducteur
WO2015111291A1 (fr) 2014-01-27 2015-07-30 奥野製薬工業株式会社 Bain formant un film conducteur
CN105132973A (zh) * 2015-09-22 2015-12-09 太原工业学院 一种环保型无氰电镀铜锌合金溶液及其电镀铜锌合金工艺

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3383224A (en) * 1965-11-09 1968-05-14 Shipley Co Electroless copper deposition
US3329512A (en) * 1966-04-04 1967-07-04 Shipley Co Chemical deposition of copper and solutions therefor
BE757573A (fr) * 1969-10-16 1971-04-15 Philips Nv Depot sans courant de cuivre flexible
US3650777A (en) * 1971-02-11 1972-03-21 Kollmorgen Corp Electroless copper plating

Also Published As

Publication number Publication date
DE3238921C2 (de) 1985-06-13
DE3238921A1 (de) 1983-05-05
SE8205982D0 (sv) 1982-10-21
BE894789A (fr) 1983-04-22
IT8249324A0 (it) 1982-10-21
IT1197434B (it) 1988-11-30
AU544591B2 (en) 1985-06-06
SE8205982L (sv) 1983-04-24
AU8915282A (en) 1983-04-28
GB2109013A (en) 1983-05-25

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Legal Events

Date Code Title Description
MKEC Expiry (correction)
MKEX Expiry