KR870001328A - 구리 얼룩 방지법 - Google Patents

구리 얼룩 방지법 Download PDF

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Publication number
KR870001328A
KR870001328A KR1019860005317A KR860005317A KR870001328A KR 870001328 A KR870001328 A KR 870001328A KR 1019860005317 A KR1019860005317 A KR 1019860005317A KR 860005317 A KR860005317 A KR 860005317A KR 870001328 A KR870001328 A KR 870001328A
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KR
South Korea
Prior art keywords
solution
copper
liter
chromic acid
stain prevention
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Application number
KR1019860005317A
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English (en)
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KR930008926B1 (ko
Inventor
파다사라디 아빈드
더블유. 폴란 네드
Original Assignee
오린 코포레이션
폴 와인스타인
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Application filed by 오린 코포레이션, 폴 와인스타인 filed Critical 오린 코포레이션
Publication of KR870001328A publication Critical patent/KR870001328A/ko
Application granted granted Critical
Publication of KR930008926B1 publication Critical patent/KR930008926B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/24—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing hexavalent chromium compounds
    • C23C22/33—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing hexavalent chromium compounds containing also phosphates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/82—After-treatment
    • C23C22/83—Chemical after-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

내용 없음.

Description

구리 얼룩 방지법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (13)

  1. 구리 및 구리합금 박 재료에 내변색과 내식성을 부여하기 위한 구리 얼룩 방지법에 있어서, 농도가 크롬산 0.02내지 1그램/리터 ,인산 0.02내지 1그램/리터인 묽은 수성 크롬산-인산 용액을 상기 재료에 가하는 것을 특징으로 하는 구리 얼룩방지법.
  2. 제1항에 있어서, pH8이상인 수성 린스용액을 상기 재료에 가하는 것을 특징으로 하는 구리 얼룩 방지법.
  3. 제2항에 있어서, 상기 린스 적용 단계후 상기 재료를 건조시키는 것을 특징으로 하는 구리 얼룩 방지법.
  4. 제2항에 있어서, 상기 린스 적용 단계는 pH9내지 11.5인 수성 린스용액을 실온에서 100℃의 온도 범위로 상기 재료에 가하는 것을 특징으로 하는 구리 얼룩 방지법.
  5. 제4항에 있어서, 린스 용액은 수산화칼슘, 수산화 나트륨, 수산화칼륨, 수산화 암모늄으로 구성되는 그룹에서 선택한 재료를 적어도 1ppm함유하고 있는 것을 특징으로 하는 구리 얼룩 방지법.
  6. 제1항에 있어서, 적용 단계는 재료를 묽은 용액에 1초 내지 120초 동안 침지하는 것을 특징으로 하는 구리 얼룩 방지법.
  7. 제1항에 있어서, 적용단계는 용액을 60°내지 90°의 온도는 유지하면서 재료를 묽은 용액에 10초 내지 30초 동안 침지하는 것을 특징으로 하는 구리 얼룩 방지법.
  8. 제1항에 있어서, 적용단계는 크롬산 0.1내지 0.3그램/리터, 인산 0.1내지 0.3그램/리터 함유하는 용액에 재료를 침지하는 것을 특징으로 하는 구리 얼룩 방지법.
  9. 제1항에 있어서, 적용단계전에 적어도 재료의 한면을 거칠게 하는데, 이러한 조면 처리 단계로써 적어도 한면상에 복수개의 수지상 입자를 묽은 크롬산-인산 용액에의 재료의 침지가 수지상 입자를 의미 있을 정도로 용해시키지 않도록 형성하는 것을 특징으로 하는 구리 얼룩 방지법.
  10. 구리 및 구리합금 재료에 향상된 내변색과 내산화를 부여하기 위한 구리 얼룩 방지 처리법에 있어서, 얼룩 방지 용액이 크롬산 0.02내지 1그램/리터, 인산 0.02내지 1그램/리터, 잔부로서 물을 함유하는 것을 특징으로 하는 구리 얼룩 방지 처리법.
  11. 제10항에 있어서, 크롬산은 상기 용액내의 농도가 0.1내지 0.3그램/리터이고, 인산은 상기 용액내의 농도가 0.1내지 0.3그램/리터인 것을 특징으로 하는 구리 얼룩 방지 처리법.
  12. 제11항에 있어서, 수산화칼슘, 수산화나트륨, 수산화 칼륨 ,수산화 암모늄으로 구성되는 그룹에서 선택한 재료를 적어도 1ppm함유하며 pH8이상인 묽은 수성 가성 린스용액을 얼룩방지 용액의 사용후 재료에 가하는 것을 특징으로 하는 구리 얼룩 방지 처리법.
  13. 제12항에 있어서, 상기 린스 용액은 pH9내지 11.5이며, 온도 실온에서 100℃의 범위인 것을 특징으로 하는 구리 얼룩 방지 처리법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860005317A 1985-07-01 1986-07-01 구리얼룩 방지방법 및 구리얼룩 방지처리 용액 KR930008926B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US750,573 1985-07-01
US06/750,573 US4647315A (en) 1985-07-01 1985-07-01 Copper stainproofing technique

Publications (2)

Publication Number Publication Date
KR870001328A true KR870001328A (ko) 1987-03-13
KR930008926B1 KR930008926B1 (ko) 1993-09-17

Family

ID=25018404

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860005317A KR930008926B1 (ko) 1985-07-01 1986-07-01 구리얼룩 방지방법 및 구리얼룩 방지처리 용액

Country Status (6)

Country Link
US (1) US4647315A (ko)
EP (1) EP0207484B1 (ko)
JP (1) JPS627881A (ko)
KR (1) KR930008926B1 (ko)
BR (1) BR8603052A (ko)
DE (2) DE3682712D1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020000211A (ko) * 2000-06-24 2002-01-05 박윤구 초콜릿이 코팅된 떡의 제조방법 및 이로부터 제조된 떡

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020000211A (ko) * 2000-06-24 2002-01-05 박윤구 초콜릿이 코팅된 떡의 제조방법 및 이로부터 제조된 떡

Also Published As

Publication number Publication date
EP0207484A2 (en) 1987-01-07
KR930008926B1 (ko) 1993-09-17
BR8603052A (pt) 1987-02-17
EP0207484A3 (en) 1988-01-13
DE3682712D1 (de) 1992-01-16
JPS627881A (ja) 1987-01-14
DE207484T1 (de) 1987-07-02
US4647315A (en) 1987-03-03
EP0207484B1 (en) 1991-12-04

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