DE3682712D1 - Verfahren zum erhoehen der fleckbestaendigkeit von kupfer. - Google Patents

Verfahren zum erhoehen der fleckbestaendigkeit von kupfer.

Info

Publication number
DE3682712D1
DE3682712D1 DE8686108892T DE3682712T DE3682712D1 DE 3682712 D1 DE3682712 D1 DE 3682712D1 DE 8686108892 T DE8686108892 T DE 8686108892T DE 3682712 T DE3682712 T DE 3682712T DE 3682712 D1 DE3682712 D1 DE 3682712D1
Authority
DE
Germany
Prior art keywords
copper
increasing
stain resistance
stain
resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686108892T
Other languages
English (en)
Inventor
Arvind Parthasarathi
Ned W Polan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olin Corp
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Application granted granted Critical
Publication of DE3682712D1 publication Critical patent/DE3682712D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/24—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing hexavalent chromium compounds
    • C23C22/33—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing hexavalent chromium compounds containing also phosphates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/82—After-treatment
    • C23C22/83—Chemical after-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
DE8686108892T 1985-07-01 1986-06-30 Verfahren zum erhoehen der fleckbestaendigkeit von kupfer. Expired - Fee Related DE3682712D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/750,573 US4647315A (en) 1985-07-01 1985-07-01 Copper stainproofing technique

Publications (1)

Publication Number Publication Date
DE3682712D1 true DE3682712D1 (de) 1992-01-16

Family

ID=25018404

Family Applications (2)

Application Number Title Priority Date Filing Date
DE8686108892T Expired - Fee Related DE3682712D1 (de) 1985-07-01 1986-06-30 Verfahren zum erhoehen der fleckbestaendigkeit von kupfer.
DE198686108892T Pending DE207484T1 (de) 1985-07-01 1986-06-30 Verfahren zum erhoehen der fleckbestaendigkeit von kupfer.

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE198686108892T Pending DE207484T1 (de) 1985-07-01 1986-06-30 Verfahren zum erhoehen der fleckbestaendigkeit von kupfer.

Country Status (6)

Country Link
US (1) US4647315A (de)
EP (1) EP0207484B1 (de)
JP (1) JPS627881A (de)
KR (1) KR930008926B1 (de)
BR (1) BR8603052A (de)
DE (2) DE3682712D1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5057193A (en) * 1989-04-05 1991-10-15 Olin Corporation Anti-tarnish treatment of metal foil
US4961828A (en) * 1989-04-05 1990-10-09 Olin Corporation Treatment of metal foil
US4952285A (en) * 1989-04-14 1990-08-28 Olin Corporation Anti-tarnish treatment of metal foil
US5022968A (en) * 1990-09-20 1991-06-11 Olin Corporation Method and composition for depositing a chromium-zinc anti-tarnish coating on copper foil
US5230932A (en) * 1989-10-13 1993-07-27 Olin Corporation Chromium-zinc anti-tarnish coating for copper foil
US5098796A (en) * 1989-10-13 1992-03-24 Olin Corporation Chromium-zinc anti-tarnish coating on copper foil
US5250363A (en) * 1989-10-13 1993-10-05 Olin Corporation Chromium-zinc anti-tarnish coating for copper foil having a dark color
US5071520A (en) * 1989-10-30 1991-12-10 Olin Corporation Method of treating metal foil to improve peel strength
US5164235A (en) * 1990-03-06 1992-11-17 Olin Corporation Anti-tarnish treatment of metal foil
JP2667052B2 (ja) * 1990-07-02 1997-10-22 オリン コーポレイション 耐変色処理後の銅箔の洗浄
US5338619A (en) * 1991-05-16 1994-08-16 Fukuda Metal Foil And Powder Co., Ltd. Copper foil for printed circuits and method of producing same
US5343073A (en) * 1992-01-17 1994-08-30 Olin Corporation Lead frames having a chromium and zinc alloy coating
US5300158A (en) * 1992-05-26 1994-04-05 Olin Corporation Protective coating having adhesion improving characteristics
IT1263235B (it) * 1992-09-08 1996-08-05 Piemontese Radiatori Procedimento per migliorare la resistenza alla corrosione dei radiatori in rame e leghe di rame, e radiatori cosi' ottenibili
US5573845A (en) * 1994-12-09 1996-11-12 Olin Corporation Superficial coating layer having acicular structures for electrical conductors
US5489373A (en) * 1995-02-02 1996-02-06 Olin Corporation Aqueous zinc solution resistant to precipitation
US5681662A (en) * 1995-09-15 1997-10-28 Olin Corporation Copper alloy foils for flexible circuits
US20020081443A1 (en) * 2000-06-08 2002-06-27 Connelly Susan M. Method of manufacturing circuit laminates
KR20020000211A (ko) * 2000-06-24 2002-01-05 박윤구 초콜릿이 코팅된 떡의 제조방법 및 이로부터 제조된 떡
US6538211B2 (en) 2000-08-15 2003-03-25 World Properties, Inc. Multi-layer circuits and methods of manufacture thereof
US20070098910A1 (en) * 2005-10-14 2007-05-03 Mitsui Mining & Smelting Co., Ltd. Flexible copper clad laminate, flexible printed wiring board obtained by using flexible copper clad laminate thereof, film carrier tape obtained by using flexible copper clad laminate thereof, semiconductor device obtained by using flexible copper clad laminate thereof, method of manufacturing flexible copper clad laminate and method of manufacturing film carrier tape

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB398180A (en) * 1932-03-02 1933-09-04 Horace Campbell Hall Improvements in and relating to treatment of metals and alloys to protect them from corrosion
US2030601A (en) * 1934-04-20 1936-02-11 Victor Chemical Works Rustproofing composition and method of coating iron and steel
US2306143A (en) * 1939-05-09 1942-12-22 Continental Can Co Preparing metal surfaces to resist staining or corrosion
US2418608A (en) * 1939-05-22 1947-04-08 Parker Rust Proof Co Corrosion-resistant metallic article and method of making the same
US2412543A (en) * 1941-07-03 1946-12-10 Parker Rust Proof Co Coated zinc article and method of making same
NL71913C (de) * 1947-09-24
DE1155952B (de) * 1959-03-02 1963-10-17 Metallgesellschaft Ag Verfahren zur Verlaengerung der Gebrauchszeit von waessrigen, sauren, sechswertiges Chrom enthaltenden Loesungen
FR1303317A (fr) * 1960-10-10 1962-09-07 Amchem S A Perfectionnements apportés aux solutions pour le traitement de surfaces métalliques en vue d'améliorer leur résistance à la corrosion, et aux procédés pour la préparation et l'utilisation de telles solutions
US3625844A (en) * 1969-06-05 1971-12-07 Circult Foll Corp Stainproofing process and products resulting therefrom
US3677828A (en) * 1970-07-30 1972-07-18 Olin Corp Tarnish resistant copper and copper alloys
CA949859A (en) * 1970-07-30 1974-06-25 Olin Corporation Method of producing tarnish resistant film on copper and copper alloys
US3716427A (en) * 1970-08-28 1973-02-13 Olin Corp Method of producing tarnish resistant copper and copper alloys and products thereof
US3764400A (en) * 1971-09-02 1973-10-09 Olin Corp Method of producing tarnish resistant copper and copper alloys
US3940303A (en) * 1971-09-02 1976-02-24 Olin Corporation Method of producing tarnish resistant copper and copper alloys and products thereof
US3853716A (en) * 1972-09-08 1974-12-10 Yates Industries Electrolytic copper stainproofing process
JPS5135629A (ja) * 1974-09-21 1976-03-26 Shigekazu Awada Suiyoseiboseizaiseizoho
DE2632626A1 (de) * 1975-07-25 1977-02-10 Ici Ltd Mit einem metallphosphatueberzug versehener grundstoff
DE2632124A1 (de) * 1975-07-25 1977-02-17 Imp Chemial Ind Ltd Belag- oder anstrichmittel
FR2323102A1 (fr) * 1975-09-05 1977-04-01 Martin Johannes Josef Dispositif d'evacuation de dechets pour grands foyers
US4131517A (en) * 1977-06-03 1978-12-26 Nippon Mining Co., Ltd. Surface treating process for copper foil for use in printed circuit
JPS5535069A (en) * 1978-09-05 1980-03-11 Takeda Chem Ind Ltd Tetrapeptide derivative
JPS5515216A (en) * 1978-07-20 1980-02-02 Mitsui Anakonda Dohaku Kk Printed circut copper foil and method of manufacturing same
JPS56155593A (en) * 1980-04-08 1981-12-01 Furukawa Circuit Foil Steel foil for printed circuit and method of manufacturing same
US4387006A (en) * 1981-07-08 1983-06-07 Fukuda Metal Foil & Powder Co., Ltd. Method of treating the surface of the copper foil used in printed wire boards
US4468293A (en) * 1982-03-05 1984-08-28 Olin Corporation Electrochemical treatment of copper for improving its bond strength
US4432846A (en) * 1982-12-10 1984-02-21 National Steel Corporation Cleaning and treatment of etched cathode aluminum capacitor foil
US4515671A (en) * 1983-01-24 1985-05-07 Olin Corporation Electrochemical treatment of copper for improving its bond strength

Also Published As

Publication number Publication date
US4647315A (en) 1987-03-03
EP0207484B1 (de) 1991-12-04
KR930008926B1 (ko) 1993-09-17
BR8603052A (pt) 1987-02-17
KR870001328A (ko) 1987-03-13
EP0207484A3 (en) 1988-01-13
JPS627881A (ja) 1987-01-14
EP0207484A2 (de) 1987-01-07
DE207484T1 (de) 1987-07-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee