KR930004502A - 환원제를 이용한 전해구리 도금방법 - Google Patents

환원제를 이용한 전해구리 도금방법 Download PDF

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Publication number
KR930004502A
KR930004502A KR1019920014557A KR920014557A KR930004502A KR 930004502 A KR930004502 A KR 930004502A KR 1019920014557 A KR1019920014557 A KR 1019920014557A KR 920014557 A KR920014557 A KR 920014557A KR 930004502 A KR930004502 A KR 930004502A
Authority
KR
South Korea
Prior art keywords
plating method
salts
copper
electrolytic copper
reducing agent
Prior art date
Application number
KR1019920014557A
Other languages
English (en)
Inventor
다케시 미우라
마사루 세이타
Original Assignee
가와시마 도시오
니뽄리로날 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가와시마 도시오, 니뽄리로날 가부시키가이샤 filed Critical 가와시마 도시오
Publication of KR930004502A publication Critical patent/KR930004502A/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/916—Sequential electrolytic and nonelectrolytic, or nonelectrolytic and electrolytic coating from the same bath

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

내용 없음.

Description

환원제를 이용한 전해구리 도금방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (4)

  1. 활성화된 전기 부전도성 재료를 구리염과, 구리의 침전을 가속화하는 구리환원제 및 구리착화제를 함유하며 pH가 약 6 내지 7.5인 용액에 침액하여 전해되는 동안 15내지 50℃를 유지하여서 상기 전기 부전도성 재료에 전기전도성 구리피막을 만드는 것임을 특징으로 하는 환원제를 이용한 전해구리도금방법.
  2. 제1항에 있어서, 상기 환원제는 디메틸아민보란, 히드라진과 그의 염 및 이포아인산과 그의 염으로 된 군중에서 선택된 1종 이상이 상기 용액내에서 0.5 내지 20g/ℓ로 존재하는 것임을 특징으로 하는 전해구리도금방법.
  3. 제1항에 있어서, 상기 착화제는 폴리아민과 그의 염, 아미노카르복실산과 그의 염, 아민알칸을 화합물 및 히드록시카르복실산과 그의 염으로 된 군중에서 선택된 1종 이상의 것임을 특징으로 하는 전해구리도금방법.
  4. 제1항에 있어서, 1종 이상의 침전물은 상기 용액의 성질을 개선시켜 전해에 의하여 피막을 침전시키기 위하여 상기 용액에 첨가되는 것임을 특징으로 하는 전해구리도금방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.
KR1019920014557A 1991-08-15 1992-08-13 환원제를 이용한 전해구리 도금방법 KR930004502A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP205101/1991 1991-08-15
JP3205101A JPH0544075A (ja) 1991-08-15 1991-08-15 無電解銅めつき代替銅ストライクめつき方法

Publications (1)

Publication Number Publication Date
KR930004502A true KR930004502A (ko) 1993-03-22

Family

ID=16501437

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920014557A KR930004502A (ko) 1991-08-15 1992-08-13 환원제를 이용한 전해구리 도금방법

Country Status (5)

Country Link
US (1) US5454930A (ko)
EP (1) EP0530568A3 (ko)
JP (1) JPH0544075A (ko)
KR (1) KR930004502A (ko)
TW (1) TW241316B (ko)

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KR100782782B1 (ko) * 2006-11-23 2007-12-05 주식회사 포스코 프레스 교정기와 형상계측기를 이용한 판재형상 교정방법

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US6331239B1 (en) 1997-04-07 2001-12-18 Okuno Chemical Industries Co., Ltd. Method of electroplating non-conductive plastic molded products
TW593731B (en) * 1998-03-20 2004-06-21 Semitool Inc Apparatus for applying a metal structure to a workpiece
US6113771A (en) 1998-04-21 2000-09-05 Applied Materials, Inc. Electro deposition chemistry
JP2000173868A (ja) * 1998-12-01 2000-06-23 Nichicon Corp アルミニウム電解コンデンサ駆動用電解液
US6571657B1 (en) 1999-04-08 2003-06-03 Applied Materials Inc. Multiple blade robot adjustment apparatus and associated method
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DE19918833C2 (de) * 1999-04-22 2002-10-31 Atotech Deutschland Gmbh Verfahren zum elektrolytischen Abscheiden einer Metallschicht auf Oberflächen eines elektrisch nichtleitenden Substrats und Anwendung des Verfahrens
US20030213772A9 (en) * 1999-07-09 2003-11-20 Mok Yeuk-Fai Edwin Integrated semiconductor substrate bevel cleaning apparatus and method
US6913680B1 (en) 2000-05-02 2005-07-05 Applied Materials, Inc. Method of application of electrical biasing to enhance metal deposition
US6808612B2 (en) 2000-05-23 2004-10-26 Applied Materials, Inc. Method and apparatus to overcome anomalies in copper seed layers and to tune for feature size and aspect ratio
US6576110B2 (en) 2000-07-07 2003-06-10 Applied Materials, Inc. Coated anode apparatus and associated method
EP1470268A2 (en) * 2000-10-03 2004-10-27 Applied Materials, Inc. Method and associated apparatus for tilting a substrate upon entry for metal deposition
US6776893B1 (en) 2000-11-20 2004-08-17 Enthone Inc. Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect
DE60044362D1 (de) * 2000-12-13 2010-06-17 Imec Verfahren zur Herstellung eines Elektroplattierungsbad und zugehöriges Kupfer-Plattierungsverfahren
US6610189B2 (en) 2001-01-03 2003-08-26 Applied Materials, Inc. Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature
US20040020780A1 (en) * 2001-01-18 2004-02-05 Hey H. Peter W. Immersion bias for use in electro-chemical plating system
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US20040253450A1 (en) * 2001-05-24 2004-12-16 Shipley Company, L.L.C. Formaldehyde-free electroless copper plating process and solution for use in the process
JP4843164B2 (ja) * 2001-08-21 2011-12-21 日本リーロナール有限会社 銅−樹脂複合材料の形成方法
EP1322146A1 (en) * 2001-12-18 2003-06-25 Phoenix Precision Technology Corporation Method of electroplating solder bumps on an organic circuit board
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US6911136B2 (en) * 2002-04-29 2005-06-28 Applied Materials, Inc. Method for regulating the electrical power applied to a substrate during an immersion process
US20040200725A1 (en) * 2003-04-09 2004-10-14 Applied Materials Inc. Application of antifoaming agent to reduce defects in a semiconductor electrochemical plating process
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JP5996244B2 (ja) * 2011-04-19 2016-09-21 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 半導体上の銅のめっき
CN103526239A (zh) * 2013-10-08 2014-01-22 昆山纯柏精密五金有限公司 一种铜电镀液以及五金件的镀铜方法
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CN114408858B (zh) * 2022-01-05 2023-03-17 北京科技大学 一种室温可吸氢锆基复合材料的制备方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100782782B1 (ko) * 2006-11-23 2007-12-05 주식회사 포스코 프레스 교정기와 형상계측기를 이용한 판재형상 교정방법

Also Published As

Publication number Publication date
EP0530568A2 (en) 1993-03-10
JPH0544075A (ja) 1993-02-23
EP0530568A3 (en) 1993-08-25
US5454930A (en) 1995-10-03
TW241316B (ko) 1995-02-21

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