ES8205021A1 - Un procedimiento para el pretratamiento de un sustrato sus- tancialmente no conductor - Google Patents
Un procedimiento para el pretratamiento de un sustrato sus- tancialmente no conductorInfo
- Publication number
- ES8205021A1 ES8205021A1 ES501765A ES501765A ES8205021A1 ES 8205021 A1 ES8205021 A1 ES 8205021A1 ES 501765 A ES501765 A ES 501765A ES 501765 A ES501765 A ES 501765A ES 8205021 A1 ES8205021 A1 ES 8205021A1
- Authority
- ES
- Spain
- Prior art keywords
- copper
- acid
- steps
- conditioning
- polyether compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Chemically Coating (AREA)
Abstract
PROCEDIMIENTO PARA EL PRETRATAMIENTO DE UN SUSTRATO SUSTANCIALMENTE NO CONDUCTOR. CONSISTE EN ACONDICIONAR LA SUPERFICIE DEL SUSTRATO PARA PRODUCIR UN AUMENTO DE LA CONDUCTIVIDAD DEL MISMO CON UNA SOLUCION ACIDA ACUOSA DILUIDA QUE CONTIEN CANTIDADES EFECTIVAS CONTROLADAS DE COBRE, DE ACIDO Y DE UN COMPUESTO POLIWETER SEGUIDO DE UN ACUÑADO DE COBRE ACIDO ELECTROLITICO EMPLEANDO UN ELECTROLITO ACUOSO MAS CONCENTRADO QUE CONTIENE COBRE, UN ACIDO Y UN COMPUESTO POLIETER. LAS ETAPAS DE ACONDICIONAMIENTO Y ACUÑADO DE COBRE ELECTROLITICO PUEDEN REALIZARSE SIN NECESIDAD DE ETAPAS DE ACLARADO INTERMEDIAS CON OBJETO DE OBTENER UNA BASE CONDUCTORA PARA DEPOSITAR A CONTINUACION ELCTROPLACAS UNIFORMES Y ADHERENTES TALES COMO COBRE ACIDO DECORATIVO O SIMILARES.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/145,534 US4374709A (en) | 1980-05-01 | 1980-05-01 | Process for plating polymeric substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
ES501765A0 ES501765A0 (es) | 1982-05-16 |
ES8205021A1 true ES8205021A1 (es) | 1982-05-16 |
Family
ID=22513544
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES501765A Expired ES8205021A1 (es) | 1980-05-01 | 1981-04-29 | Un procedimiento para el pretratamiento de un sustrato sus- tancialmente no conductor |
Country Status (12)
Country | Link |
---|---|
US (1) | US4374709A (es) |
JP (1) | JPS56169793A (es) |
AU (1) | AU526075B2 (es) |
BR (1) | BR8102678A (es) |
CA (1) | CA1192858A (es) |
DE (1) | DE3116743A1 (es) |
ES (1) | ES8205021A1 (es) |
FR (1) | FR2481718A1 (es) |
GB (1) | GB2075063B (es) |
IT (1) | IT1142499B (es) |
MX (1) | MX163920B (es) |
NL (1) | NL8102169A (es) |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3240643A1 (de) * | 1982-11-04 | 1984-05-30 | LPW-Chemie GmbH, 4040 Neuss | Erzeugung von leiterbahnbeschichtungen und leitenden lochwandbeschichtungen auf bzw. in leiterplatten |
DE3482273D1 (de) * | 1983-06-24 | 1990-06-21 | American Cyanamid Co | Vorrichtung und verfahren zum kontinuierlichen plattieren von fasern. |
JPS60258494A (ja) * | 1984-06-01 | 1985-12-20 | Nippon Sanmou Senshoku Kk | 導電性高分子材料 |
US4673469A (en) * | 1984-06-08 | 1987-06-16 | Mcgean-Rohco, Inc. | Method of plating plastics |
US5004525A (en) * | 1988-08-23 | 1991-04-02 | Shipley Company Inc. | Copper electroplating composition |
DE4032864A1 (de) * | 1990-10-13 | 1992-04-16 | Schering Ag | Saures bad zur galvanischen abscheidung von kupferueberzuegen und verfahren unter verwendung dieser kombination |
US5849171A (en) * | 1990-10-13 | 1998-12-15 | Atotech Deutschland Gmbh | Acid bath for copper plating and process with the use of this combination |
US5328589A (en) * | 1992-12-23 | 1994-07-12 | Enthone-Omi, Inc. | Functional fluid additives for acid copper electroplating baths |
US5336370A (en) * | 1993-12-09 | 1994-08-09 | Chipalkatti Makarand H | Pre-treatment for plating technique |
EP0795802A1 (en) * | 1996-03-15 | 1997-09-17 | Agfa-Gevaert N.V. | A printhead structure made from an electroless plated plastic substrate |
US6203582B1 (en) * | 1996-07-15 | 2001-03-20 | Semitool, Inc. | Modular semiconductor workpiece processing tool |
US6936153B1 (en) | 1997-09-30 | 2005-08-30 | Semitool, Inc. | Semiconductor plating system workpiece support having workpiece-engaging electrode with pre-conditioned contact face |
US6454926B1 (en) | 1997-09-30 | 2002-09-24 | Semitool Inc. | Semiconductor plating system workpiece support having workpiece-engaging electrode with submerged conductive current transfer areas |
US6258241B1 (en) | 1997-12-10 | 2001-07-10 | Lucent Technologies, Inc. | Process for electroplating metals |
US20040045832A1 (en) * | 1999-10-14 | 2004-03-11 | Nicholas Martyak | Electrolytic copper plating solutions |
KR100760337B1 (ko) * | 1999-12-15 | 2007-09-20 | 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨 | 시드층 보수방법 |
US6468672B1 (en) | 2000-06-29 | 2002-10-22 | Lacks Enterprises, Inc. | Decorative chrome electroplate on plastics |
GB0020414D0 (en) * | 2000-08-18 | 2000-10-04 | Avecia Ltd | Dispersions containing polyether dispersants |
US20040000488A1 (en) * | 2002-06-28 | 2004-01-01 | Applied Materials, Inc. | CU ECP planarization by insertion of polymer treatment step between gap fill and bulk fill steps |
US8465469B2 (en) * | 2002-09-12 | 2013-06-18 | Medtronic Vascular, Inc. | Reinforced catheter and methods of making |
US20040211657A1 (en) * | 2003-04-11 | 2004-10-28 | Ingelbrecht Hugo Gerard Eduard | Method of purifying 2,6-xylenol and method of producing poly(arylene ether) therefrom |
US9399618B2 (en) * | 2003-05-12 | 2016-07-26 | Arkema Inc. | High purity electrolytic sulfonic acid solutions |
US20050230262A1 (en) * | 2004-04-20 | 2005-10-20 | Semitool, Inc. | Electrochemical methods for the formation of protective features on metallized features |
US20060086620A1 (en) * | 2004-10-21 | 2006-04-27 | Chase Lee A | Textured decorative plating on plastic components |
TWI400365B (zh) * | 2004-11-12 | 2013-07-01 | Enthone | 微電子裝置上的銅電沈積 |
US7354354B2 (en) * | 2004-12-17 | 2008-04-08 | Integran Technologies Inc. | Article comprising a fine-grained metallic material and a polymeric material |
JP2007023361A (ja) * | 2005-07-20 | 2007-02-01 | Mitsubishi Engineering Plastics Corp | 芳香族ポリカーボネート系樹脂成形品のメッキ方法およびメッキ成形品 |
US20070158199A1 (en) * | 2005-12-30 | 2007-07-12 | Haight Scott M | Method to modulate the surface roughness of a plated deposit and create fine-grained flat bumps |
US20070178697A1 (en) * | 2006-02-02 | 2007-08-02 | Enthone Inc. | Copper electrodeposition in microelectronics |
JP2009041097A (ja) * | 2007-08-10 | 2009-02-26 | Rohm & Haas Electronic Materials Llc | 銅めっき方法 |
US20090056994A1 (en) * | 2007-08-31 | 2009-03-05 | Kuhr Werner G | Methods of Treating a Surface to Promote Metal Plating and Devices Formed |
EP2188818A4 (en) * | 2007-08-31 | 2013-01-09 | Atotech Deutschland Gmbh | METHODS OF TREATING A SURFACE TO PROMOTE THE BONDING OF ONE OR MORE MOLECULES HAVING AN INTEREST AND COATINGS AND DEVICES FORMED THEREFROM |
US7905994B2 (en) * | 2007-10-03 | 2011-03-15 | Moses Lake Industries, Inc. | Substrate holder and electroplating system |
US20090188553A1 (en) * | 2008-01-25 | 2009-07-30 | Emat Technology, Llc | Methods of fabricating solar-cell structures and resulting solar-cell structures |
US8262894B2 (en) | 2009-04-30 | 2012-09-11 | Moses Lake Industries, Inc. | High speed copper plating bath |
CN107072072B (zh) | 2010-07-06 | 2019-10-25 | 纳美仕有限公司 | 处理铜表面以增强对印刷电路板中使用的有机衬底的粘着力的方法 |
JP2011068995A (ja) * | 2010-11-15 | 2011-04-07 | Mitsubishi Engineering Plastics Corp | 芳香族ポリカーボネート系樹脂成形品のメッキ方法およびメッキ成形品 |
US8747643B2 (en) * | 2011-08-22 | 2014-06-10 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
CN103009708A (zh) * | 2011-09-21 | 2013-04-03 | 深圳富泰宏精密工业有限公司 | 镀膜件及其制造方法 |
US9243339B2 (en) | 2012-05-25 | 2016-01-26 | Trevor Pearson | Additives for producing copper electrodeposits having low oxygen content |
ITUD20130108A1 (it) | 2013-08-13 | 2015-02-14 | New Technology Consultants N T C | Dispositivo di controllo del funzionamento di uno scambiatore di calore, scambiatore di calore comprendente detto dispositivo e relativo procedimento di controllo |
US9809891B2 (en) | 2014-06-30 | 2017-11-07 | Rohm And Haas Electronic Materials Llc | Plating method |
US10988852B2 (en) | 2015-10-27 | 2021-04-27 | Rohm And Haas Electronic Materials Llc | Method of electroplating copper into a via on a substrate from an acid copper electroplating bath |
PT3497267T (pt) | 2016-08-15 | 2020-07-28 | Atotech Deutschland Gmbh | Composição aquosa acídica para galvanização eletrolítica de cobre |
US10986738B2 (en) * | 2018-05-08 | 2021-04-20 | Macdermid Enthone Inc. | Carbon-based direct plating process |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB493485A (en) * | 1937-01-13 | 1938-10-10 | Langbein Pfanhauser Werke Ag | Process for the electrolytic production of metal coatings on objects with a non-conducting surface |
US3099608A (en) * | 1959-12-30 | 1963-07-30 | Ibm | Method of electroplating on a dielectric base |
US3328273A (en) * | 1966-08-15 | 1967-06-27 | Udylite Corp | Electro-deposition of copper from acidic baths |
US3682788A (en) * | 1970-07-28 | 1972-08-08 | M & T Chemicals Inc | Copper electroplating |
US3751289A (en) * | 1971-08-20 | 1973-08-07 | M & T Chemicals Inc | Method of preparing surfaces for electroplating |
US3954570A (en) * | 1974-11-11 | 1976-05-04 | Amp Incorporated | Sensitized polyimides and circuit elements thereof |
-
1980
- 1980-05-01 US US06/145,534 patent/US4374709A/en not_active Expired - Lifetime
-
1981
- 1981-03-27 CA CA000373992A patent/CA1192858A/en not_active Expired
- 1981-04-22 FR FR8108047A patent/FR2481718A1/fr active Granted
- 1981-04-27 JP JP6386181A patent/JPS56169793A/ja active Granted
- 1981-04-28 DE DE19813116743 patent/DE3116743A1/de not_active Ceased
- 1981-04-29 ES ES501765A patent/ES8205021A1/es not_active Expired
- 1981-04-29 IT IT48365/81A patent/IT1142499B/it active
- 1981-04-30 GB GB8113313A patent/GB2075063B/en not_active Expired
- 1981-04-30 MX MX187101A patent/MX163920B/es unknown
- 1981-04-30 AU AU70018/81A patent/AU526075B2/en not_active Expired
- 1981-04-30 BR BR8102678A patent/BR8102678A/pt unknown
- 1981-05-01 NL NL8102169A patent/NL8102169A/nl not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
FR2481718B1 (es) | 1985-05-03 |
IT1142499B (it) | 1986-10-08 |
JPS56169793A (en) | 1981-12-26 |
BR8102678A (pt) | 1982-01-26 |
NL8102169A (nl) | 1981-12-01 |
ES501765A0 (es) | 1982-05-16 |
CA1192858A (en) | 1985-09-03 |
GB2075063A (en) | 1981-11-11 |
GB2075063B (en) | 1983-04-07 |
AU7001881A (en) | 1981-11-05 |
AU526075B2 (en) | 1982-12-16 |
US4374709A (en) | 1983-02-22 |
IT8148365A0 (it) | 1981-04-29 |
FR2481718A1 (fr) | 1981-11-06 |
DE3116743A1 (de) | 1982-02-25 |
MX163920B (es) | 1992-06-30 |
JPH0224919B2 (es) | 1990-05-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES8205021A1 (es) | Un procedimiento para el pretratamiento de un sustrato sus- tancialmente no conductor | |
US4169171A (en) | Bright electroless plating process and plated articles produced thereby | |
TW200833879A (en) | Deposition of conductive polymer and metallization of non-conductive substrates | |
ES485223A1 (es) | Un procedimiento para el tratamiento de un substrato plasti-co polimerico | |
GB1343211A (en) | Treatmetn of resin substrates for the reception of metal deposits | |
FR2426742A1 (fr) | Solution pour depot non electrolytique de cuivre, contenant un hypophosphite comme reducteur et son procede de mise en oeuvre | |
DE60109486D1 (de) | Verfahren zur chemischen vernickelung | |
GB2164063B (en) | Selective electroless deposition on insulating substrates | |
GR3020348T3 (en) | Method for directly electroplating a dielectric substrate | |
KR19980703108A (ko) | 비전도성 물질로 제조된 기판 표면을 선택적 또는 부분적으로 전해 메탈라이징하는 방법 | |
GB493485A (en) | Process for the electrolytic production of metal coatings on objects with a non-conducting surface | |
US20160333491A1 (en) | Method for creating multiple electrical current pathways on a work piece | |
GB1082031A (en) | Method of producing zinc-coated steel articles and articles produced by such method | |
US3674550A (en) | Method of electroless deposition of a substrate and sensitizing solution therefor | |
US5298058A (en) | Electroless copper plating bath | |
US3846168A (en) | Method of forming bondable substrate surfaces | |
US3592744A (en) | Method of preventing rack plating in continuous plating cycle for nonconductive articles | |
US3567488A (en) | Process for electroless plating of carboxylic acid copolymers using ammonla | |
US3516848A (en) | Process and solution for sensitizing substrates for electroless plating | |
JP4789361B2 (ja) | 誘電体表面上に導電層を製造する方法 | |
US3567489A (en) | Process for electroless plating of carboxylic acid copolymers using alkylenimines | |
ES8201233A1 (es) | Procedimiento para obtener un producto consistente en un substrato conductor de corriente electrica y un recubrimien-to de aspecto metalico fijamente adherido al mismo | |
GB2017416A (en) | Circuit board manufacturing method | |
CA1136006A (en) | Bright electroless plating process and plated articles produced thereby | |
US11639552B2 (en) | Method for creating multiple electrical current pathways on a work piece |