FR2426742A1 - Solution pour depot non electrolytique de cuivre, contenant un hypophosphite comme reducteur et son procede de mise en oeuvre - Google Patents

Solution pour depot non electrolytique de cuivre, contenant un hypophosphite comme reducteur et son procede de mise en oeuvre

Info

Publication number
FR2426742A1
FR2426742A1 FR7913221A FR7913221A FR2426742A1 FR 2426742 A1 FR2426742 A1 FR 2426742A1 FR 7913221 A FR7913221 A FR 7913221A FR 7913221 A FR7913221 A FR 7913221A FR 2426742 A1 FR2426742 A1 FR 2426742A1
Authority
FR
France
Prior art keywords
solution
hypophosphite
reducer
implementation
electrolytic copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7913221A
Other languages
English (en)
Other versions
FR2426742B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Inc filed Critical MacDermid Inc
Publication of FR2426742A1 publication Critical patent/FR2426742A1/fr
Application granted granted Critical
Publication of FR2426742B1 publication Critical patent/FR2426742B1/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

L'invention concerne une solution et un procédé pour dépôt non électrolytique de Cu degrés . La solution contient H2 O, une source soluble d'ions Cu, un agent complexant pour maintenir Cu en solution et un réducteur hypophosphite pour obtenir un dépôt de Cu métallique sur la surface préparée d'une pièce mise au contact de la solution. Selon l'agent complexant et le pH du bain, l'hypophosphite réduit Cu**++ en Cu degrés . Le film de Cu non électrolytique déposé est assez conducteur pour permettre l'obtention d'un revetement métallique supplémentaire par les techniques usuelles de placage électrolytique. Application : métallisation d'une pièce en résine ABS pour automobile, ou réalisation d'un circuit imprimé.
FR7913221A 1978-05-25 1979-05-23 Solution pour depot non electrolytique de cuivre, contenant un hypophosphite comme reducteur et son procede de mise en oeuvre Expired FR2426742B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/909,209 US4209331A (en) 1978-05-25 1978-05-25 Electroless copper composition solution using a hypophosphite reducing agent

Publications (2)

Publication Number Publication Date
FR2426742A1 true FR2426742A1 (fr) 1979-12-21
FR2426742B1 FR2426742B1 (fr) 1985-06-28

Family

ID=25426815

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7913221A Expired FR2426742B1 (fr) 1978-05-25 1979-05-23 Solution pour depot non electrolytique de cuivre, contenant un hypophosphite comme reducteur et son procede de mise en oeuvre

Country Status (10)

Country Link
US (1) US4209331A (fr)
JP (1) JPS54153737A (fr)
AU (1) AU536632B2 (fr)
CA (1) CA1130952A (fr)
CH (1) CH647264A5 (fr)
DE (1) DE2920766A1 (fr)
FR (1) FR2426742B1 (fr)
GB (1) GB2021648B (fr)
NL (1) NL189362C (fr)
SE (1) SE7903341L (fr)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4265943A (en) * 1978-11-27 1981-05-05 Macdermid Incorporated Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions
SU921124A1 (ru) * 1979-06-19 1982-04-15 Институт Физико-Химических Основ Переработки Минерального Сырья Со Ан Ссср Способ металлизации отверстий печатных плат
US4325990A (en) * 1980-05-12 1982-04-20 Macdermid Incorporated Electroless copper deposition solutions with hypophosphite reducing agent
WO1982000666A1 (en) * 1980-08-12 1982-03-04 Macdermid Inc Method for continuous metal deposition from a non-autocatalytic electroless plating bath using electric potential
US4459184A (en) * 1980-08-12 1984-07-10 Macdermid, Inc. Method for continuous metal deposition from a non-autocatalytic electroless plating bath using electric potential
DE3152361A1 (de) * 1980-09-15 1983-01-13 Shipley Co Electroless alloy plating
US4617205A (en) * 1984-12-21 1986-10-14 Omi International Corporation Formaldehyde-free autocatalytic electroless copper plating
US4671968A (en) * 1985-04-01 1987-06-09 Macdermid, Incorporated Method for electroless deposition of copper on conductive surfaces and on substrates containing conductive surfaces
US4759986A (en) * 1986-10-23 1988-07-26 Hoechst Celanese Corporation Electrically conductive polybenzimidazole fibrous material
US4814197A (en) * 1986-10-31 1989-03-21 Kollmorgen Corporation Control of electroless plating baths
US4948707A (en) * 1988-02-16 1990-08-14 International Business Machines Corporation Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon
US4938853A (en) * 1989-05-10 1990-07-03 Macdermid, Incorporated Electrolytic method for the dissolution of copper particles formed during electroless copper deposition
US5077099B1 (en) * 1990-03-14 1997-12-02 Macdermid Inc Electroless copper plating process and apparatus
US5213840A (en) * 1990-05-01 1993-05-25 Macdermid, Incorporated Method for improving adhesion to polymide surfaces
JPH0544075A (ja) * 1991-08-15 1993-02-23 Nippon Riironaale Kk 無電解銅めつき代替銅ストライクめつき方法
US5328561A (en) * 1992-07-10 1994-07-12 Macdermid Incorporated Microetchant for copper surfaces and processes for using same
US6042889A (en) * 1994-02-28 2000-03-28 International Business Machines Corporation Method for electrolessly depositing a metal onto a substrate using mediator ions
US6054173A (en) * 1997-08-22 2000-04-25 Micron Technology, Inc. Copper electroless deposition on a titanium-containing surface
EP1020543A1 (fr) * 1999-01-15 2000-07-19 Interuniversitair Micro-Elektronica Centrum Vzw Dépôt de cuivre sur une surface activée d' un substrat
DE19918833C2 (de) * 1999-04-22 2002-10-31 Atotech Deutschland Gmbh Verfahren zum elektrolytischen Abscheiden einer Metallschicht auf Oberflächen eines elektrisch nichtleitenden Substrats und Anwendung des Verfahrens
US6632343B1 (en) * 2000-08-30 2003-10-14 Micron Technology, Inc. Method and apparatus for electrolytic plating of surface metals
JP4595237B2 (ja) * 2001-04-27 2010-12-08 日立金属株式会社 銅めっき液および銅めっき方法
US7169215B2 (en) * 2004-01-02 2007-01-30 Ramot At Tel Aviv University Ltd. Copper molybdenum electroless deposition process and materials
US20090238979A1 (en) * 2008-03-21 2009-09-24 William Decesare Method of Applying Catalytic Solution for Use in Electroless Deposition
DE102010012204B4 (de) * 2010-03-19 2019-01-24 MacDermid Enthone Inc. (n.d.Ges.d. Staates Delaware) Verbessertes Verfahren zur Direktmetallisierung von nicht leitenden Substraten
CN103154257A (zh) * 2010-09-26 2013-06-12 大玉企业有限公司 重组大分子生成方法
EP2784181B1 (fr) 2013-03-27 2015-12-09 ATOTECH Deutschland GmbH Solution de dépôt de cuivre chimique
KR101487890B1 (ko) * 2013-07-16 2015-02-03 한국생산기술연구원 무전해 니켈 도금액, 이를 이용한 무전해 니켈 도금 방법, 및 이를 이용하여 제조된 연성 니켈 도금층
US20170175272A9 (en) * 2013-09-04 2017-06-22 Rohm And Haas Electronic Materials Llc Electroless metallization of dielectrics with alkaline stable pyrimidine derivative containing catalysts
CN113861614B (zh) * 2021-09-29 2023-10-31 上海金发科技发展有限公司 一种高电镀结合力的abs改性材料及其制备方法与应用

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3959531A (en) * 1971-04-23 1976-05-25 Photocircuits Corporation Improvements in electroless metal plating

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3046159A (en) * 1957-12-17 1962-07-24 Hughes Aircraft Co Method of copper plating by chemical reduction
US3403035A (en) * 1964-06-24 1968-09-24 Process Res Company Process for stabilizing autocatalytic metal plating solutions
US3716462A (en) * 1970-10-05 1973-02-13 D Jensen Copper plating on zinc and its alloys
US3650777A (en) * 1971-02-11 1972-03-21 Kollmorgen Corp Electroless copper plating
NL7304650A (fr) * 1973-04-04 1974-10-08
US3870526A (en) * 1973-09-20 1975-03-11 Us Army Electroless deposition of copper and copper-tin alloys
JPS5147535A (ja) * 1974-10-22 1976-04-23 Toko Inc Domudenkaimetsukyoku
JPS5234571A (en) * 1975-09-10 1977-03-16 Hitachi Zosen Corp Thermal cracking device for combustible refuse
US4138267A (en) * 1976-12-28 1979-02-06 Okuno Chemical Industry Company, Limited Compositions for chemical copper plating

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3959531A (en) * 1971-04-23 1976-05-25 Photocircuits Corporation Improvements in electroless metal plating

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
CHEMICAL ABSTRACTS, volume 60, no. 11, 1967, abrégé 13470r (COLUMBUS OHIO, US) & Kyushu Kogyo Daigaku Kenkyu Hokoku No. 15, 65-71 (1965), I. TADAYOSHI et al. "Copper plating on nonconductors. I. Electroless copper plating on porcelain" *

Also Published As

Publication number Publication date
GB2021648A (en) 1979-12-05
NL7903647A (nl) 1979-11-27
NL189362C (nl) 1993-03-16
CH647264A5 (de) 1985-01-15
AU4641779A (en) 1979-11-29
US4209331A (en) 1980-06-24
GB2021648B (en) 1983-03-30
CA1130952A (fr) 1982-09-07
JPH029110B2 (fr) 1990-02-28
JPS54153737A (en) 1979-12-04
DE2920766A1 (de) 1979-11-29
DE2920766C2 (fr) 1988-01-07
FR2426742B1 (fr) 1985-06-28
NL189362B (nl) 1992-10-16
SE7903341L (sv) 1979-11-26
AU536632B2 (en) 1984-05-17

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