ES8307932A1 - Un metodo para formar un revestimiento de oro sobre un sustrato. - Google Patents

Un metodo para formar un revestimiento de oro sobre un sustrato.

Info

Publication number
ES8307932A1
ES8307932A1 ES512731A ES512731A ES8307932A1 ES 8307932 A1 ES8307932 A1 ES 8307932A1 ES 512731 A ES512731 A ES 512731A ES 512731 A ES512731 A ES 512731A ES 8307932 A1 ES8307932 A1 ES 8307932A1
Authority
ES
Spain
Prior art keywords
gold
substrates
bath
electroless plating
immersion deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES512731A
Other languages
English (en)
Other versions
ES512731A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Occidental Chemical Corp
Original Assignee
Hooker Chemicals and Plastics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hooker Chemicals and Plastics Corp filed Critical Hooker Chemicals and Plastics Corp
Publication of ES512731A0 publication Critical patent/ES512731A0/es
Publication of ES8307932A1 publication Critical patent/ES8307932A1/es
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

METODO PARA FORMAR UN REVESTIMIENTO DE ORO SOBRE UN SUBSTRATO. SE REALIZA LA INMERSION DEL SUBSTRATO EN UN BAÑO DE RECUBRIMIENTO NO ELECTRICO QUE INCLUYE DE 0,25 A 20 G/L DE UN COMPLEJO DE ORO TRIVALENTE, TAL COMO UN AURICIANURO DE UN METAL ALCALINO O UN IMIDURO DE ORO Y METAL ALCALINO, UN ACIDO CARBOXILICO ORGANICO, TAL COMO ACIDO CITRICO, EN UNA CANTIDAD DE HASTA 50 G/L, Y/O UN ACIDO MINERAL, TAL COMO ACIO CLORHIDRICO, EN UNA CANTIDAD DE HASTA 600 ML/L, DE FORMA QUE EL PH DEL BAÑO SEA DE 0,2 A 4,0. SE PUEDE AÑADIR OPCIONALMENTE UNA CANTIDAD DE HASTA 10 G/L DE UN CATALIZADOR METALICO, TAL COMO COBALTO, NIQUEL O HIERRO. SE MANTIENE EL BAÑO A UNA TEMPERATURA DE 20 A 95 C DURANTE UN TIEMPO DE 5 MINUTOS A 4 HORAS PARA FORMAR UN RECUBRIMIENTO CON UN ESPESOR DE 0,5 A 12 MICROMETROS. SE EMPLEA PARA RECUBRIR CERAMICA METALIZADA Y METALES.
ES512731A 1981-06-02 1982-05-31 Un metodo para formar un revestimiento de oro sobre un sustrato. Expired ES8307932A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/269,445 US4374876A (en) 1981-06-02 1981-06-02 Process for the immersion deposition of gold

Publications (2)

Publication Number Publication Date
ES512731A0 ES512731A0 (es) 1983-08-01
ES8307932A1 true ES8307932A1 (es) 1983-08-01

Family

ID=23027279

Family Applications (1)

Application Number Title Priority Date Filing Date
ES512731A Expired ES8307932A1 (es) 1981-06-02 1982-05-31 Un metodo para formar un revestimiento de oro sobre un sustrato.

Country Status (14)

Country Link
US (1) US4374876A (es)
JP (1) JPS581065A (es)
AT (1) ATA208782A (es)
BE (1) BE893396A (es)
CA (1) CA1177204A (es)
DE (1) DE3219665C2 (es)
ES (1) ES8307932A1 (es)
FI (1) FI821914A0 (es)
FR (1) FR2506787B1 (es)
GB (1) GB2099460B (es)
IT (1) IT1148950B (es)
NL (1) NL8202238A (es)
PT (1) PT74959B (es)
SE (1) SE8203085L (es)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3237394A1 (de) * 1982-10-08 1984-04-12 Siemens AG, 1000 Berlin und 8000 München Chemisches vergoldungsbad
US4483887A (en) * 1984-02-21 1984-11-20 Capetrol International, Inc. Metal plating iron-containing substrates
US5178918A (en) * 1986-07-14 1993-01-12 Robert Duva Electroless plating process
US4863766A (en) * 1986-09-02 1989-09-05 General Electric Company Electroless gold plating composition and method for plating
DE3640028C1 (de) * 1986-11-24 1987-10-01 Heraeus Gmbh W C Saures Bad fuer das stromlose Abscheiden von Goldschichten
US4832743A (en) * 1986-12-19 1989-05-23 Lamerie, N.V. Gold plating solutions, creams and baths
JP2655329B2 (ja) * 1988-01-28 1997-09-17 関東化学 株式会社 無電解金めつき液
JP2794741B2 (ja) * 1989-01-13 1998-09-10 日立化成工業株式会社 無電解銅めっき液
US4971944A (en) * 1989-02-21 1990-11-20 Westinghouse Electric Corp. Method of electroless depositing of gold onto superconducting particles
JPH02118324U (es) * 1989-03-06 1990-09-21
FI95816C (fi) * 1989-05-04 1996-03-25 Ad Tech Holdings Ltd Antimikrobinen esine ja menetelmä sen valmistamiseksi
US5258062A (en) * 1989-06-01 1993-11-02 Shinko Electric Industries Co., Ltd. Electroless gold plating solutions
DE4024764C1 (es) * 1990-08-02 1991-10-10 Schering Ag Berlin-Bergkamen, 1000 Berlin, De
JPH0452728U (es) * 1990-09-11 1992-05-06
JPH04137611U (ja) * 1991-06-19 1992-12-22 松下電器産業株式会社 セラミツク発振子
JPH0697758A (ja) * 1992-09-11 1994-04-08 Rohm Co Ltd 圧電発振子
JPH06140864A (ja) * 1992-10-21 1994-05-20 Rohm Co Ltd 圧電発振子
US5318621A (en) * 1993-08-11 1994-06-07 Applied Electroless Concepts, Inc. Plating rate improvement for electroless silver and gold plating
JP3811991B2 (ja) * 1996-05-21 2006-08-23 株式会社デンソー 酸素センサ素子の製造方法及び酸素センサ素子
JPH10330950A (ja) * 1997-06-02 1998-12-15 Nippon Parkerizing Co Ltd 改良充填置換析出型めっき金属材料及びその製造方法
US6383269B1 (en) * 1999-01-27 2002-05-07 Shipley Company, L.L.C. Electroless gold plating solution and process
US6805911B2 (en) * 2001-01-02 2004-10-19 J.G. Systems, Inc. Method and apparatus for improving interfacial chemical reactions
US20020086102A1 (en) * 2001-01-02 2002-07-04 John Grunwald Method and apparatus for improving interfacial chemical reactions in electroless depositions of metals
JP3876811B2 (ja) * 2001-11-02 2007-02-07 住友金属鉱山株式会社 透明導電層形成用塗液の製造方法
JP5116956B2 (ja) * 2005-07-14 2013-01-09 関東化学株式会社 無電解硬質金めっき液
US20120058362A1 (en) * 2010-09-08 2012-03-08 Infineon Technologies Ag Method for depositing metal on a substrate; metal structure and method for plating a metal on a substrate
KR101444687B1 (ko) * 2014-08-06 2014-09-26 (주)엠케이켐앤텍 무전해 금도금액
US11319613B2 (en) 2020-08-18 2022-05-03 Enviro Metals, LLC Metal refinement

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD29902A (es) *
US2501737A (en) * 1946-09-11 1950-03-28 Jr Ralph W Porter Solution for plating metals with gold
US2836515A (en) * 1953-04-30 1958-05-27 Westinghouse Electric Corp Gold immersion solution for treating silver and method of applying same
NL253834A (es) * 1959-07-21 1900-01-01
US3214292A (en) * 1962-09-12 1965-10-26 Western Electric Co Gold plating
US3294578A (en) * 1963-10-22 1966-12-27 Gen Aniline & Film Corp Deposition of a metallic coat on metal surfaces
US3589916A (en) * 1964-06-24 1971-06-29 Photocircuits Corp Autocatalytic gold plating solutions
US3598706A (en) * 1967-12-11 1971-08-10 Trifari Krussman And Fishel In Acid gold plating baths
US3700469A (en) * 1971-03-08 1972-10-24 Bell Telephone Labor Inc Electroless gold plating baths
US3697296A (en) * 1971-03-09 1972-10-10 Du Pont Electroless gold plating bath and process
US3993808A (en) * 1971-08-13 1976-11-23 Hitachi, Ltd. Method for electroless plating gold directly on tungsten or molybdenum
US3862850A (en) * 1973-06-08 1975-01-28 Ceramic Systems Electroless gold plating on refractory metals
US3917885A (en) * 1974-04-26 1975-11-04 Engelhard Min & Chem Electroless gold plating process
JPS52151637A (en) * 1976-04-29 1977-12-16 Trw Inc Aqueous solution for gold plating and method of applying gold film onto nickel surface at room temperature
US4168214A (en) * 1978-06-14 1979-09-18 American Chemical And Refining Company, Inc. Gold electroplating bath and method of making the same

Also Published As

Publication number Publication date
FI821914A0 (fi) 1982-05-31
DE3219665A1 (de) 1982-12-16
GB2099460A (en) 1982-12-08
FR2506787B1 (fr) 1986-02-28
GB2099460B (en) 1985-04-03
JPH028026B2 (es) 1990-02-22
US4374876A (en) 1983-02-22
FR2506787A1 (fr) 1982-12-03
PT74959A (en) 1982-06-01
JPS581065A (ja) 1983-01-06
IT1148950B (it) 1986-12-03
ES512731A0 (es) 1983-08-01
BE893396A (fr) 1982-12-02
PT74959B (en) 1984-08-02
ATA208782A (de) 1985-09-15
SE8203085L (sv) 1982-12-03
CA1177204A (en) 1984-11-06
DE3219665C2 (de) 1984-05-30
NL8202238A (nl) 1983-01-03
IT8248548A0 (it) 1982-05-31

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