ES2102224T3 - Procedimiento para la deposicion de capas de paladio. - Google Patents
Procedimiento para la deposicion de capas de paladio.Info
- Publication number
- ES2102224T3 ES2102224T3 ES94915040T ES94915040T ES2102224T3 ES 2102224 T3 ES2102224 T3 ES 2102224T3 ES 94915040 T ES94915040 T ES 94915040T ES 94915040 T ES94915040 T ES 94915040T ES 2102224 T3 ES2102224 T3 ES 2102224T3
- Authority
- ES
- Spain
- Prior art keywords
- palladium
- layers
- palladium layers
- deposited
- deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
Abstract
LAS CAPAS DE PALADIO SE UTILIZAN CON FRECUENCIA COMO CAPAS PROTECTORAS SOBRE LA SUPERFICIE DE SUBSTRATOS ELABORADOS DE COBRE, NIQUEL Y COBALTO, ASI COMO SUS ALEACIONES CON UNO O CON OTRO Y/O CON FOSFORO O BORO. LOS PROCESOS CONOCIDOS, SIN EMBARGO, NO PERMITEN CAPAS DE PALADIO ADHESIVO, PERMANENTEMENTE CON BRILLO, ASPECTO CLARO, SIENDO DEPOSITADO CON POCOS POROS. TALES CAPAS DE PALADIO PUEDEN SER SIN EMBARGO DEPOSITADAS MEDIANTE BAÑO QUIMICO LIBRE DE FORMALDEHIDO QUE CONTIENE UNA SAL DE PALADIO, UNO O VARIOS AGENTES DE FORMACION COMPLEJA NITROGENADA Y ACIDO FORMICO O DERIVADOS DE ACIDO FORMICO A UN VALOR DE PH MAYOR DE 4. ES TAMBIEN POSIBLE UN TRATAMIENTO PREVIO EN UN BAÑO DE PALADIO DE CEMENTACION.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19934316679 DE4316679C1 (de) | 1993-05-13 | 1993-05-13 | Verfahren und Bad zur Abscheidung von Palladiumschichten sowie dessen Verwendung |
DE4415211A DE4415211A1 (de) | 1993-05-13 | 1994-04-26 | Verfahren zur Abscheidung von Palladiumschichten |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2102224T3 true ES2102224T3 (es) | 1997-07-16 |
Family
ID=25926044
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES94915040T Expired - Lifetime ES2102224T3 (es) | 1993-05-13 | 1994-05-13 | Procedimiento para la deposicion de capas de paladio. |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0698130B1 (es) |
JP (1) | JP2918339B2 (es) |
AT (1) | ATE152188T1 (es) |
DE (2) | DE4415211A1 (es) |
ES (1) | ES2102224T3 (es) |
WO (1) | WO1994026954A1 (es) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9425031D0 (en) | 1994-12-09 | 1995-02-08 | Alpha Metals Ltd | Printed circuit board manufacture |
GB9425030D0 (en) | 1994-12-09 | 1995-02-08 | Alpha Metals Ltd | Silver plating |
US6544397B2 (en) | 1996-03-22 | 2003-04-08 | Ronald Redline | Method for enhancing the solderability of a surface |
US6905587B2 (en) | 1996-03-22 | 2005-06-14 | Ronald Redline | Method for enhancing the solderability of a surface |
DE19631565A1 (de) * | 1996-07-24 | 1998-01-29 | Atotech Deutschland Gmbh | Verfahren zum Herstellen von Palladiumkontaktbumps auf Halbleiterschaltungsträgern |
USRE45842E1 (en) | 1999-02-17 | 2016-01-12 | Ronald Redline | Method for enhancing the solderability of a surface |
FR2799337B1 (fr) * | 1999-10-05 | 2002-01-11 | St Microelectronics Sa | Procede de realisation de connexions electriques sur la surface d'un boitier semi-conducteur a gouttes de connexion electrique |
DE102004033979B4 (de) * | 2004-07-14 | 2008-04-24 | Dr.-Ing. Max Schlötter GmbH & Co KG | Verfahren zur Verbesserung der Lötbarkeit von Nickelüberzügen |
US8349393B2 (en) | 2004-07-29 | 2013-01-08 | Enthone Inc. | Silver plating in electronics manufacture |
DE102004046258A1 (de) * | 2004-09-23 | 2006-04-06 | Infineon Technologies Ag | Bad und Verfahren zur stromlosen Abscheidung von Palladium |
JP5526440B2 (ja) * | 2007-01-17 | 2014-06-18 | 奥野製薬工業株式会社 | パラジウム皮膜用還元析出型無電解金めっき液を用いて形成されたプリント配線板 |
KR100994579B1 (ko) * | 2007-02-28 | 2010-11-15 | 고지마 가가쿠 야쿠힌 가부시키가이샤 | 무전해 순팔라듐 도금액 |
JP4117016B1 (ja) | 2007-08-15 | 2008-07-09 | 小島化学薬品株式会社 | 無電解パラジウムめっき液 |
DE602008005748D1 (de) * | 2008-10-17 | 2011-05-05 | Atotech Deutschland Gmbh | Spannungsreduzierte Ni-P/Pd-Stapel für Waferoberfläche |
DE102010011269B4 (de) | 2009-11-10 | 2014-02-13 | Ami Doduco Gmbh | Verfahren zum Abscheiden einer für das Drahtbonden geeigneten Palladiumschicht auf Leiterbahnen einer Schaltungsträgerplatte und Verwendung eines Palladiumbades in dem Verfahren |
EP2535929A1 (en) * | 2011-06-14 | 2012-12-19 | Atotech Deutschland GmbH | Wire bondable surface for microelectronic devices |
DE102011082537A1 (de) * | 2011-09-12 | 2013-03-14 | Robert Bosch Gmbh | Leiterplatte und elektrische Bauteile zum Einsatz in aggressiver Umgebung und Verfahren zur Herstellung einer solchen Leiterplatte |
EP2581470B1 (en) * | 2011-10-12 | 2016-09-28 | ATOTECH Deutschland GmbH | Electroless palladium plating bath composition |
CN103290399B (zh) * | 2013-06-19 | 2015-09-30 | 广东东硕科技有限公司 | 一种使用复合稳定剂的化学镀钯液 |
JP6347853B2 (ja) * | 2014-04-10 | 2018-06-27 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングAtotech Deutschland GmbH | パラジウムの無電解めっきのためのめっき浴組成物及び方法 |
EP3234219B1 (en) * | 2014-12-17 | 2019-03-27 | ATOTECH Deutschland GmbH | Plating bath composition and method for electroless deposition of palladium |
JP6732751B2 (ja) * | 2014-12-17 | 2020-07-29 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングAtotech Deutschland GmbH | パラジウム無電解めっき用のめっき浴組成物およびパラジウムの無電解めっき方法 |
WO2020094642A1 (en) | 2018-11-06 | 2020-05-14 | Atotech Deutschland Gmbh | Electroless nickel plating solution |
JP7407644B2 (ja) | 2020-04-03 | 2024-01-04 | 上村工業株式会社 | パラジウムめっき液及びめっき方法 |
EP3960898A1 (en) | 2020-08-31 | 2022-03-02 | Atotech Deutschland GmbH & Co. KG | Compostion for depositing a palladium coating on a substrate |
EP4215642A1 (en) | 2022-01-25 | 2023-07-26 | Atotech Deutschland GmbH & Co. KG | Compostion for depositing a palladium coating on an activated copper-coated substrate |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1987005338A1 (en) * | 1986-03-04 | 1987-09-11 | Ishihara Chemical Co., Ltd. | Palladium-base electroless plating solution |
US5203911A (en) * | 1991-06-24 | 1993-04-20 | Shipley Company Inc. | Controlled electroless plating |
-
1994
- 1994-04-26 DE DE4415211A patent/DE4415211A1/de not_active Withdrawn
- 1994-05-13 JP JP6524827A patent/JP2918339B2/ja not_active Expired - Fee Related
- 1994-05-13 WO PCT/DE1994/000572 patent/WO1994026954A1/de active IP Right Grant
- 1994-05-13 DE DE59402540T patent/DE59402540D1/de not_active Expired - Lifetime
- 1994-05-13 AT AT94915040T patent/ATE152188T1/de active
- 1994-05-13 ES ES94915040T patent/ES2102224T3/es not_active Expired - Lifetime
- 1994-05-13 EP EP94915040A patent/EP0698130B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH10511738A (ja) | 1998-11-10 |
JP2918339B2 (ja) | 1999-07-12 |
EP0698130A1 (de) | 1996-02-28 |
DE4415211A1 (de) | 1994-12-08 |
WO1994026954A1 (de) | 1994-11-24 |
ATE152188T1 (de) | 1997-05-15 |
EP0698130B1 (de) | 1997-04-23 |
DE59402540D1 (de) | 1997-05-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
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