GB1343212A - Treatmetn of resin substrates for the reception of metal doposits - Google Patents

Treatmetn of resin substrates for the reception of metal doposits

Info

Publication number
GB1343212A
GB1343212A GB2273073A GB1343212DA GB1343212A GB 1343212 A GB1343212 A GB 1343212A GB 2273073 A GB2273073 A GB 2273073A GB 1343212D A GB1343212D A GB 1343212DA GB 1343212 A GB1343212 A GB 1343212A
Authority
GB
United Kingdom
Prior art keywords
alkyl
metal
apply
resin
steps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2273073A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Performance Solutions UK Ltd
Original Assignee
MacDermid Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Ltd filed Critical MacDermid Ltd
Publication of GB1343212A publication Critical patent/GB1343212A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)

Abstract

1343212 Treating plastics; electroless plating MACDERMID Inc 11 Jan 1971 22730/73 Divided out of 1343211 Heading C7F [Also in Division H1] A moulded polymerised resin substrate such as an epoxy- or phenolicbase resin is prepared for electroless plating by being contacted with a dipolar aprotic organic liquid selected from where R 1 = H or C 1 - C 5 alkyl, R 2 = C 1 - C 5 alkyl where R 3 = H or C 1 -C 3 alkyl, R 4 and R 5 are H or C1 - C 5 alkyl and where R 6 = C 1 - C 5 alkyl, then treated with an aqueous hexavalent chromic acid solution, catalysed by contact with aqueous precious metal solution, and the catalysed surface is heated to a temperature above ambient but insufficient to char the resin. Typical process steps in making a printed circuit are (1) contact substrate with said liquid (2) immerse in chromic/sulphuric acid solution (3) catalyze, either with SnCl 2 / PdCl 2 or Sn - Pd hydrosol, (4) either (a) apply electroless metal and (b) apply negative resist or (c) apply and develop negative resist (5) (further) metal deposition, followed by removal of resist (and unwanted metal, if steps 4(a) and (b) were used), the heating step following any of steps (3), (4) a, b, or c or (5). Examples are given in flow-sheet form; electrolessly deposited metal such as Cu or Ni may be thickened electrolytically with Cu or Ni or protected with electrolytic solder, which may be removed from contact areas to allow plating, e. g. with Au or Ag.
GB2273073A 1971-01-11 1971-01-11 Treatmetn of resin substrates for the reception of metal doposits Expired GB1343212A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2273073 1971-01-11

Publications (1)

Publication Number Publication Date
GB1343212A true GB1343212A (en) 1974-01-10

Family

ID=10184188

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2273073A Expired GB1343212A (en) 1971-01-11 1971-01-11 Treatmetn of resin substrates for the reception of metal doposits

Country Status (1)

Country Link
GB (1) GB1343212A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2555185A1 (en) * 1983-11-17 1985-05-24 Roehm Gmbh SUBSTRATE OF SYNTHETIC MATERIAL FOR ANCHORING METAL COATINGS
US4601916A (en) * 1984-07-18 1986-07-22 Kollmorgen Technologies Corporation Process for bonding metals to electrophoretically deposited resin coatings
US11066753B2 (en) 2015-06-16 2021-07-20 3M Innovative Properties Company Plated polymeric article including tin/copper tie/seed layer

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2555185A1 (en) * 1983-11-17 1985-05-24 Roehm Gmbh SUBSTRATE OF SYNTHETIC MATERIAL FOR ANCHORING METAL COATINGS
US4663199A (en) * 1983-11-17 1987-05-05 Rohm Gmbh Wet metallization of acrylic resin articles
US4601916A (en) * 1984-07-18 1986-07-22 Kollmorgen Technologies Corporation Process for bonding metals to electrophoretically deposited resin coatings
US11066753B2 (en) 2015-06-16 2021-07-20 3M Innovative Properties Company Plated polymeric article including tin/copper tie/seed layer

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee