GB1403219A - Process for depositing copper layers on shaped articles of a polyimide - Google Patents

Process for depositing copper layers on shaped articles of a polyimide

Info

Publication number
GB1403219A
GB1403219A GB5607872A GB5607872A GB1403219A GB 1403219 A GB1403219 A GB 1403219A GB 5607872 A GB5607872 A GB 5607872A GB 5607872 A GB5607872 A GB 5607872A GB 1403219 A GB1403219 A GB 1403219A
Authority
GB
United Kingdom
Prior art keywords
acid
polyimide
per cent
dec
shaped articles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5607872A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hoechst AG
Original Assignee
Hoechst AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoechst AG filed Critical Hoechst AG
Publication of GB1403219A publication Critical patent/GB1403219A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Abstract

1403219 Electroless plating of polyimides HOECHST AG 5 Dec 1972 [8 Dec 1971] 56078/72 Heading C7F A polyimide resin is electroless plated with copper by contacting it with a noble metal salt e.g. Pt, Pd, Au or Ag and a halogenated alkanoic acid, e.g. trichloro or trifluoroacetic acids or 2, 2, 3-trichloroptopionic acid, and applying a reducing agent e.g. stannous chloride or hydrazine hydrate, which does not contain a halogenated alkanoic acid, either before or after the noble metal salt. The solvent for the alkanoic acid may be water, acetone or butanone. The polyimide may be first contacted with a 1 to 5 per cent chromic acid, 30 to 60 per cent phosphoric acid, and 30 to 50 per cent sulphuric acid solution. The solutions may contain a wetting agent.
GB5607872A 1971-12-08 1972-12-05 Process for depositing copper layers on shaped articles of a polyimide Expired GB1403219A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2160821A DE2160821C3 (en) 1971-12-08 1971-12-08 Process for the deposition of copper layers on molded articles made of polyimides

Publications (1)

Publication Number Publication Date
GB1403219A true GB1403219A (en) 1975-08-28

Family

ID=5827354

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5607872A Expired GB1403219A (en) 1971-12-08 1972-12-05 Process for depositing copper layers on shaped articles of a polyimide

Country Status (10)

Country Link
US (1) US3881049A (en)
JP (1) JPS4866168A (en)
AT (1) AT322320B (en)
BE (1) BE792310A (en)
CA (1) CA990593A (en)
DE (1) DE2160821C3 (en)
FR (1) FR2162526B1 (en)
GB (1) GB1403219A (en)
IT (1) IT973915B (en)
NL (1) NL7216124A (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL176479C (en) * 1971-12-08 1985-04-16 Hoechst Ag METHOD FOR COATING PLASTIC ARTICLES WITH COPPER
GB2040969B (en) * 1978-12-19 1983-04-13 Crown City Plating Co Conditioning of polyamides for electroless plating
DE3328765A1 (en) * 1983-08-05 1985-02-14 Schering AG, 1000 Berlin und 4709 Bergkamen SOLUTION FOR PRE-TREATING POLYIMIDE
US4720401A (en) * 1985-01-11 1988-01-19 International Business Machines Corporation Enhanced adhesion between metals and polymers
DE3743780A1 (en) * 1987-12-23 1989-07-06 Bayer Ag METHOD FOR IMPROVING THE ADHESIVITY OF CURRENTLY DEPOSITED METAL LAYERS ON POLYIMIDE SURFACES
US5032427A (en) * 1988-04-25 1991-07-16 Macdermid, Incorporated Process for preparation printed circuit through-holes for metallization
EP0341504A3 (en) * 1988-05-09 1991-01-16 General Electric Company Plastic chip carrier package and method of preparation
US5242713A (en) * 1988-12-23 1993-09-07 International Business Machines Corporation Method for conditioning an organic polymeric material
US4999251A (en) * 1989-04-03 1991-03-12 General Electric Company Method for treating polyetherimide substrates and articles obtained therefrom
US5178956A (en) * 1989-10-03 1993-01-12 Shipley Company Inc. Pretreatment process for electroless plating of polyimides
WO1991017286A1 (en) * 1990-05-04 1991-11-14 Battelle Memorial Institute Process for depositing thin film layers onto surfaces modified with organic functional groups and products formed thereby
US5187241A (en) * 1990-05-15 1993-02-16 International Business Machines Corporation Isoimide modifications of a polyimide and reaction thereof with nucleophiles
US5441770A (en) * 1990-05-18 1995-08-15 Shipley Company Inc. Conditioning process for electroless plating of polyetherimides
US5151304A (en) * 1991-01-22 1992-09-29 International Business Machines Corporation Structure and method for enhancing adhesion to a polyimide surface
US5183692A (en) * 1991-07-01 1993-02-02 Motorola, Inc. Polyimide coating having electroless metal plate
US5290597A (en) * 1992-04-27 1994-03-01 General Electric Company Method of treating halogenated polyimide substrates for increasing adhesion of metal layer thereon
JP4086946B2 (en) * 1998-01-05 2008-05-14 日東電工株式会社 Thermally conductive pressure-sensitive adhesive sheets and methods for fixing electronic components and heat dissipation members using the same
JP4917841B2 (en) * 2006-06-09 2012-04-18 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． Electroless plating method on resin surface
US7981508B1 (en) 2006-09-12 2011-07-19 Sri International Flexible circuits
US8895874B1 (en) 2009-03-10 2014-11-25 Averatek Corp. Indium-less transparent metalized layers
TWI595024B (en) * 2016-06-23 2017-08-11 臻鼎科技股份有限公司 Polyamic acid, copper clad laminate and circuit board

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3403035A (en) * 1964-06-24 1968-09-24 Process Res Company Process for stabilizing autocatalytic metal plating solutions
US3544432A (en) * 1968-03-19 1970-12-01 Chisso Corp Electroplating plastic articles
US3704156A (en) * 1970-07-13 1972-11-28 Du Pont Catalyst solution for electroless plating on nonconductors
US3684572A (en) * 1970-07-13 1972-08-15 Du Pont Electroless nickel plating process for nonconductors
DE2101049A1 (en) * 1971-01-11 1972-08-03 Siemens Ag Process for preferably double-sided coating of plastic foils with .Metall
US3736170A (en) * 1971-06-28 1973-05-29 Ibm Process for improved adhesion of electroless copper to a polyimide surface
US3791848A (en) * 1972-05-19 1974-02-12 Western Electric Co A method of improving the adherence of a metal deposit to a polyimide surface

Also Published As

Publication number Publication date
US3881049A (en) 1975-04-29
FR2162526A1 (en) 1973-07-20
DE2160821C3 (en) 1979-02-08
FR2162526B1 (en) 1976-08-20
JPS4866168A (en) 1973-09-11
CA990593A (en) 1976-06-08
DE2160821B2 (en) 1978-06-08
BE792310A (en) 1973-06-05
NL7216124A (en) 1973-06-13
IT973915B (en) 1974-06-10
AT322320B (en) 1975-05-12
DE2160821A1 (en) 1973-06-20

Similar Documents

Publication Publication Date Title
GB1403219A (en) Process for depositing copper layers on shaped articles of a polyimide
GB1343211A (en) Treatmetn of resin substrates for the reception of metal deposits
GB1497620A (en) Formation of metal layers on polymers
GB1482708A (en) Catalytic treatment of non-conductors for chemical platin
US3553085A (en) Method of preparing surfaces of plastic for electro-deposition
GB1307927A (en) Electroless plating
US4244739A (en) Catalytic solution for the electroless deposition of metals
GB955781A (en) Electroless plating process
GB1348793A (en) Method of electroless deposition of metals with improved sensitizer
GB1461036A (en) Process and liquid for the catalytic sensitization of non- metallic surfaces for subsequent electroless metallization
GB1206741A (en) Process for electroplating polyoxymethylene resins
GB918220A (en) Method of chemically plating a dielectric article
JPS58500765A (en) A method for chemically stripping a plating layer containing palladium and at least one of copper and nickel, and a bath used in the method
KR900018410A (en) Electroless Plating Method
GB1035850A (en) Improvements in and relating to the electrodeposition of palladium
GB1198193A (en) Prevention of Skip Plating in an Electroless Nickel Bath
GB1164459A (en) A Process for the Metallisation of Non-Conductors
GB892451A (en) Improvements in and relating to the manufacture of printed circuits
ES371593A1 (en) Method of preventing rack plating in continuous plating cycle for nonconductive articles
GB1214420A (en) Surface-pretreatment of non-metallic articles for chemical nickel-plating
GB1400600A (en) Process for the manufacture of articles comprising copper coatings on shaped plastics supports
US3959564A (en) Method for the preliminary treatment of plastic surfaces for electroplating
GB604644A (en) Improvements in or relating to the metallising of non-metallic bodies
JPH02111883A (en) Electroless metal plating method
GB1518301A (en) Deposition of copper

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees