ATE138116T1 - Verfahren zum unmittelbaren elektroplattieren eines dielektrischen substrates - Google Patents

Verfahren zum unmittelbaren elektroplattieren eines dielektrischen substrates

Info

Publication number
ATE138116T1
ATE138116T1 AT91901113T AT91901113T ATE138116T1 AT E138116 T1 ATE138116 T1 AT E138116T1 AT 91901113 T AT91901113 T AT 91901113T AT 91901113 T AT91901113 T AT 91901113T AT E138116 T1 ATE138116 T1 AT E138116T1
Authority
AT
Austria
Prior art keywords
directly
electroplatting
micro
conducting
dielectric substrate
Prior art date
Application number
AT91901113T
Other languages
English (en)
Inventor
Kiyoshi Okabayashi
Original Assignee
Harnden Eric F
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harnden Eric F filed Critical Harnden Eric F
Application granted granted Critical
Publication of ATE138116T1 publication Critical patent/ATE138116T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
AT91901113T 1989-11-21 1990-11-07 Verfahren zum unmittelbaren elektroplattieren eines dielektrischen substrates ATE138116T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/440,661 US5071517A (en) 1989-11-21 1989-11-21 Method for directly electroplating a dielectric substrate and plated substrate so produced

Publications (1)

Publication Number Publication Date
ATE138116T1 true ATE138116T1 (de) 1996-06-15

Family

ID=23749664

Family Applications (1)

Application Number Title Priority Date Filing Date
AT91901113T ATE138116T1 (de) 1989-11-21 1990-11-07 Verfahren zum unmittelbaren elektroplattieren eines dielektrischen substrates

Country Status (10)

Country Link
US (1) US5071517A (de)
EP (1) EP0502120B1 (de)
JP (1) JP3136539B2 (de)
KR (1) KR100188481B1 (de)
AT (1) ATE138116T1 (de)
DE (1) DE69027040T2 (de)
DK (1) DK0502120T3 (de)
ES (1) ES2090300T3 (de)
GR (1) GR3020348T3 (de)
WO (1) WO1991007526A1 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5342501A (en) * 1989-11-21 1994-08-30 Eric F. Harnden Method for electroplating metal onto a non-conductive substrate treated with basic accelerating solutions for metal plating
AU659857B2 (en) * 1991-06-20 1995-06-01 Harnden, Eric F. Mildly basic accelerating solutions for direct electroplating
US5376248A (en) * 1991-10-15 1994-12-27 Enthone-Omi, Inc. Direct metallization process
DE4206680C1 (de) * 1992-02-28 1994-01-27 Schering Ag Verfahren zur Metallisierung von Nichtleiteroberflächen und die Verwendung von Hydroxymethansulfinsäure im Verfahren
US5681441A (en) * 1992-12-22 1997-10-28 Elf Technologies, Inc. Method for electroplating a substrate containing an electroplateable pattern
DE69434619T2 (de) * 1993-03-18 2006-08-17 Atotech Deutschland Gmbh Sich selbstbeschleunigendes und sich selbst auffrischendes Verfahren zur Tauchbeschichtung ohne Formaldehyd, sowie die entsprechende Zusammensetzung
US5387332A (en) * 1993-07-14 1995-02-07 Straus; Martin Cleaner/conditioner for the direct metallization of non-conductors and printed circuit boards
US5374346A (en) * 1993-08-09 1994-12-20 Rohm And Haas Company Electroplating process and composition
US5421989A (en) * 1993-08-31 1995-06-06 Atotech Deutschland Gmbh Process for the metallization of nonconductive substrates with elimination of electroless metallization
DE4412463C3 (de) * 1994-04-08 2000-02-10 Atotech Deutschland Gmbh Verfahren zur Herstellung einer Palladium-Kolloid-Lösung und ihre Verwendung
US5855755A (en) * 1995-06-19 1999-01-05 Lynntech, Inc. Method of manufacturing passive elements using conductive polypyrrole formulations
US6210537B1 (en) 1995-06-19 2001-04-03 Lynntech, Inc. Method of forming electronically conducting polymers on conducting and nonconducting substrates
US5908543A (en) * 1997-02-03 1999-06-01 Okuno Chemical Industries Co., Ltd. Method of electroplating non-conductive materials
US6598291B2 (en) * 1998-03-20 2003-07-29 Viasystems, Inc. Via connector and method of making same
EP1197131A4 (de) * 1999-03-29 2006-07-19 Viasystems Inc Durchkontaktierung und herstellungsmethode
US6277180B1 (en) * 1999-07-12 2001-08-21 Oliver Sales Company Method of replacing evaporation losses from colloidal catalyst baths
US6334965B1 (en) 1999-09-07 2002-01-01 Lynntech, Inc. Electronically conductive polymers
WO2004095614A2 (en) * 2003-04-18 2004-11-04 Ube Industries, Ltd. Metal-supported porous carbon film, fuel cell electrode and fuel cell employing the electrode
KR101105991B1 (ko) 2003-07-09 2012-01-18 프라이즈 메탈즈, 인크. 침착 및 패턴 공정
JP2005223063A (ja) * 2004-02-04 2005-08-18 Seiko Epson Corp 配線基板の製造方法及び電子デバイスの製造方法
JP2006070319A (ja) * 2004-09-01 2006-03-16 Toyota Motor Corp 樹脂めっき方法
US7368045B2 (en) * 2005-01-27 2008-05-06 International Business Machines Corporation Gate stack engineering by electrochemical processing utilizing through-gate-dielectric current flow
US8840960B2 (en) * 2006-11-01 2014-09-23 United Technologies Corporation Method of cleaning carbon composite prior to application of thermal coating
US8497359B2 (en) * 2010-02-26 2013-07-30 Ppg Industries Ohio, Inc. Cationic electrodepositable coating composition comprising lignin
KR102307816B1 (ko) * 2019-12-26 2021-10-05 한국과학기술원 도전성 여과막 제조 장치 및 이를 이용한 제조 방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3099608A (en) * 1959-12-30 1963-07-30 Ibm Method of electroplating on a dielectric base
US3904792A (en) * 1972-02-09 1975-09-09 Shipley Co Catalyst solution for electroless metal deposition on a substrate
US3961109A (en) * 1973-08-01 1976-06-01 Photocircuits Division Of Kollmorgen Corporation Sensitizers and process for electroless metal deposition
US4061588A (en) * 1975-09-30 1977-12-06 Shipley Company Inc. Catalyst composition and method of preparation
DE3323476A1 (de) * 1982-07-01 1984-01-05 Kollmorgen Technologies Corp., 75201 Dallas, Tex. Verbessertes verfahren zur galvanischen metallabscheidung auf nichtmetallischen oberflaechen
US4481236A (en) * 1983-05-02 1984-11-06 General Motors Corporation Life extension of catalyst predip baths
US4604299A (en) * 1983-06-09 1986-08-05 Kollmorgen Technologies Corporation Metallization of ceramics
US4448804A (en) * 1983-10-11 1984-05-15 International Business Machines Corporation Method for selective electroless plating of copper onto a non-conductive substrate surface
US4891069A (en) * 1986-06-06 1990-01-02 Techno Instruments Investments 1983 Ltd. Composition for the electrolytic coating of circuit boards without an electroless metal coating
JP2586466B2 (ja) * 1986-12-08 1997-02-26 日本エクスラン工業株式会社 金属被覆炭素材料の製造法
US5007990A (en) * 1987-07-10 1991-04-16 Shipley Company Inc. Electroplating process
JPH0686666B2 (ja) * 1988-01-12 1994-11-02 清 岡林 化学メッキ用増感活性剤

Also Published As

Publication number Publication date
DE69027040D1 (de) 1996-06-20
JPH05504167A (ja) 1993-07-01
GR3020348T3 (en) 1996-09-30
JP3136539B2 (ja) 2001-02-19
EP0502120A1 (de) 1992-09-09
WO1991007526A1 (en) 1991-05-30
EP0502120B1 (de) 1996-05-15
DE69027040T2 (de) 1996-10-31
KR927003884A (ko) 1992-12-18
DK0502120T3 (da) 1996-08-05
KR100188481B1 (ko) 1999-06-15
EP0502120A4 (en) 1993-03-24
US5071517A (en) 1991-12-10
ES2090300T3 (es) 1996-10-16

Similar Documents

Publication Publication Date Title
DE69027040T2 (de) Verfahren zum unmittelbaren elektroplattieren eines dielektrischen substrates
MY126635A (en) Pretreating solution for electroless plating, electroless plating bath and electroless plating process
KR850000377A (ko) 세라믹 기질을 금속화하는 방법
SE7903341L (sv) Forfaringssett for astadkommande av elektrofri kopparutfellning pa ett underlag samt komposition for nyttjande vid utovande av forfaringssettet
ES8205021A1 (es) Un procedimiento para el pretratamiento de un sustrato sus- tancialmente no conductor
DE3275105D1 (en) Method of activating substrate surfaces for electroless metal plating
CA2222158A1 (en) Self accelerating and replenishing non-formaldehyde immersion coating method and composition
GB2164063B (en) Selective electroless deposition on insulating substrates
SE8203085L (sv) Badkomposition for stromfri guldpletering
EP0160966A3 (en) Process for producing a metallic pattern on an insulating substrate, and insulating substrate with a metallic pattern, particularly a printed circuit
KR830002066A (ko) 구리이온이 함유되어 있는 욕(浴)에서 구리이온을 제거하는 방법
SE8300416L (sv) Zink-coboltbaserat elektropleteringsbad, forfarande for framstellningen av en zink-koboltpletering och derigenom framstellt, pleterat foremal
EP0248683A3 (de) Verfahren und Zusammenstellung zur Elektroplattierung von Leiterplatten ohne stromlose Plattierung
EP1174530B1 (de) Verfahren zur Herstellung von leitenden Schichten auf dielektrischen Oberflächen
JPS5949309B2 (ja) スチ−ル部材を電気泳動によりホウロウ処理する方法
SE8201298L (sv) Bad for galvanisk utfellning av en palladium/nickel-legering
ES8205268A1 (es) Procedimiento para la precipitacion sin corriente de una ca-pa metalica
SE8205087L (sv) Forfarande for hojning av korrosionsbestendigheten hos en galvaniskt avskild palladium/nickel-legering
ES8106023A1 (es) Un metodo para la electrodeposicion de un deposito de niquelsustancialmente negro sobre un sustrato.
EP0158890A3 (de) Aktivierung eines Basismaterials vor der chemischen Metallisierung
JPS57114695A (en) Production of zinc plated steeel plate of superior blackening resistance and intergranular corrosion resistance
ES2021949A6 (es) Composicion de deposicion de niquel no electrolitico conteniendo sacarina y procedimiento de preparacion de un deposito de niquel no electrolitico negro.
UST961007I4 (en) Production of electrically conductive paths on an insulating substrate
SU367746A1 (ru) Контактно-химический способ осаждени металлов
JPS57120663A (en) Electroless plating method

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee